• International Commerce and Information Review
• /
• v.6 no.3
• /
• pp.159-180
• /
• 2004

This paper focus on building online trust in electronic commerce between partner that have never traded with each other before, the so-called first trade situation. For this, this paper proposes the model to build trust for conduction first trade transaction in e-trade(so-ca1led Trust Matrix Model : TMM). The TMM is based on the idea that for business to business electronic trade a balance has to be found between anonymous procedural trust, i.e. procedural solutions for trust building, and personal trust based on positive past experiences within for first trade situation, because of the lack of experience in these situations. The procedural trust solutions are related in the notion of institution-based trust, because the trust in the procedural solutions depends on the trust one has in the institutions that issued or enforces the procedure. The TMM can be used as a tool to analyze and develope trust-building services to help organizations conduct first -trade electronic trade.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.25 no.7
• /
• pp.500-505
• /
• 2012

In this study, the influence of the intermolecular distance on the charge mobility in a pentacene thin-film was investigated. In order to increase the mobility which depends on the ${\pi}$-overlap between molecules, the intermolecular distance was shortened by compressive force along the conduction channel. Pentacene thin-film was fabricated on flexible substrates bent outward at different radii to stretch the gate dielectric surface and then the substrates were unbent, producing the compressive force to the film. The result showed that the mobility increased proportionally to the strain applied during the pentacene deposition and the molecular packing inside a grain was not optimal for the charge transport.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.126-127
• /
• 2008

The effects annealing conditions on the electrical conductions of SOI substrate were studied. The reversible change of resistance and carrier concentration in accordance with the annealing temperature were observed for the first time in SOI substrate. The thermal donors due to interstitial oxygen atoms contribute the change of resistance and carrier concentration. Final1y, we show that the furnace annelaing at $500^{\circ}C$ at final heat treatment stage is effective for eliminate the thermal donor effects in SOI substrate.

• Journal of computational fluids engineering
• /
• v.11 no.2 s.33
• /
• pp.32-39
• /
• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• 한국전산유체공학회:학술대회논문집
• /
• 2005.04a
• /
• pp.91-95
• /
• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• Electrical & Electronic Materials
• /
• v.8 no.2
• /
• pp.184-189
• /
• 1995

The electrical property of ultra thin PVA films(several hundreds .angs.-several .mu.m in thickness) formed by sphere bulb blowing technique, has been studied. The electrical conductivity of relatively thick films(>several thousands .angs.) has been very high and enhanced by the exposure either to high humidity of air or $NH_3$, which can be explained in terms of the role of ionic transport. The use of PVA films as NH$_{3}$ sensor is also proposed. In ultra thin PVA films less than 1500.angs., two conducting states ; high conducting and low conducting states, are observed. The nonlinear current-voltage characteristics in the low conducting state and the switching between these two states are also confirmed. These properties are discussed in terms of electronic conduction processes. The breakdown strength of the ultra thin PVA film is found to be very high(-30MV/cm), supporting the electron avalanche process in a thick polymer films.

• Journal of the Semiconductor & Display Technology
• /
• v.5 no.3 s.16
• /
• pp.11-16
• /
• 2006

A low cost PDP sustain power supply is proposed based on flyback topology. By using Boundary Conduction Method(BCM) to control input current regulation, DCM condition can be met under all load conditions. Another feature of the proposed method is that a excessive voltage stress due to the link voltage increase can be suppressed by removing link capacitor and suggest new 'Level-shifting switch driver'. this new gate driver is improved 66% of efficiency than switching loss of a existed push-pull amplifier. The proposed converter is tested with a 400W(200V-2A output) prototype circuit.

• Proceedings of the KIEE Conference
• /
• summer
• /
• pp.1239-1241
• /
• 2004

In this paper, electronic ballast with Interleaved Boost Cell is presented. The proposed topology is based on a single-stage ballast which combines a boost converter and a half-bridge series resonant inverter High power factor and low THD(reduction of current ripple) are achieved by using the boost semi-stage operating in discontinuous conduction mode, and inverter semi-stage operated above resonant frequency to provide zero voltage switching is employed to ballast the fluorescent lamp. The experimental results from the ballast system with fluorescent lamps have demonstrated the feasibility of the proposed electronic ballast.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.9
• /
• pp.789-794
• /
• 2008

Zinc oxide (ZnO) has been widely studied for its practical applications such as transparent conduction electrodes for flat panel displays and solar cells. Especially, ZnO films show good chemical stability against hydrogen plasma, absence of toxicity, abundance in nature, and then suitable for photovoltaic applications. However, the fabrication process of thin film solar cells require a high substrate temperature and/or post heat treatment. Therefore, the layers have to withstand high temperatures, requiring an excellent stability without degrading their electronic and optical properties. In this paper, we investigated the stability of zinc oxide (ZnO) films doped with aluminum and hydrogen. Doped ZnO films were prepared by r.f. magnetron sputter and followed by heat treatment at different temperatures and for various times.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.29 no.4 s.235
• /
• pp.526-536
• /
• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.