• Journal of the Korea Safety Management & Science
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• 제10권3호
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• pp.81-87
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• 2008

The reliability prediction and evaluation for general electronic components are required to guarantee in quality and in efficiency. Although many methodologies for predicting the reliability of electronic components have been developed, their reliability might be subjective according to a particular set of circumstances, and therefore it is not easy to quantify their reliability. In this study reliability prediction of electronic components, that is the interface card, which is used in the CNC(Computerized Numerical Controller) of machine tools, was carried out using PRISM reliability prediction specification. Reliability performances such as MTBF(Mean Time Between Failure), failure rate and reliability were obtained, and the variation of failure rate for electronic components according to temperature change was predicted. The results obtained from this study are useful information to consider a counter plan for weak components before they are used.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.389.2-389.2
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• 2014

Polydimethylsiloxane (PDMS) based electronic devices are widely used for various applications in large area electronics, biomedical wearable interfaces and implantable circuitry where flexibility and/or stretchability are required. A few fabrication methods of electronic devices directly on PDMS substrate have been reported. However, it is well known that micro-cracks appear in the metal layer and in the lithography pattern on a PDMS substrate. To solve the above problems, a few studies for fabrication of stiff platform on PDMS substrate have been reported. Thin-film islands of a stiff region are fabricated on an elastomeric substrate, and electronic devices are fabricated on these stiff islands. When the substrate is stretched, the deformation is mainly accommodated by the substrate, and the stiff islands and electronic devices experience relatively small strains. Here, we report a new method to achieve stiff islands structures on an elastomeric substrate at a various thickness, as the platform for stretchable electronic devices. The stiff islands were defined by conventional photolithography on a stress-free elastomeric substrate. This technique can provide a practical strategy for realizing large-area stretchable electronic circuits, for various applications such as stretchable display or wearable electronic systems.

• Nuclear Engineering and Technology
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• 제56권5호
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• pp.1863-1873
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• 2024

In the Korean domestic nuclear industry, to analyze the reliability of instrumentation and control (I&C) systems, the failure rates of the electronic components constituting the I&C systems are predicted based on the MIL-HDBK-217F standard titled 'Reliability Prediction of Electronic Equipment'. Based on these predicted failure rates, the mean time to failure of the I&C systems is calculated to determine the replacement period of the I&C systems. However, this conventional approach to the prediction of electronic component failure rates assumes that factors affecting the failure rates such as ambient temperature and operating voltage are static constants. In this regard, the objective of this study is to propose a prediction method for the remaining useful life (RUL) of electronic components considering mean time to failure calculations reflecting dynamic environments, such as changes in ambient temperature and operating voltage. Results of this study show that the RUL of electronic components can be estimated depending on time-varying temperature and electrical stress, implying that the RUL of electronic components can be predicted under dynamic stress conditions.

• Journal of Korean Society of Industrial and Systems Engineering
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• 제43권4호
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• pp.67-75
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• 2020

This paper proposes a methodology for gantry route optimization in order to maximize the productivity of a odd-type surface mount device (SMD). A odd-type SMD is a machine that uses a gantry to mount electronic components on the placement point of a printed circuit board (PCB). The gantry needs a nozzle to move its electronic components. There is a suitability between the nozzle and the electronic component, and the mounting speed varies depending on the suitability. When it is difficult for the nozzle to adsorb electronic components, nozzle exchange is performed, and nozzle exchange takes a certain amount of time. The gantry route optimization problem is divided into the mounting order on PCB and the allocation of nozzles and electronic components to the gantry. Nozzle and electronic component allocation minimized the time incurred by nozzle exchange and nozzle-to-electronic component compatibility by using an mixed integer programming method. Sequence of mounting points on PCB minimizes travel time by using the branch-and-price method. Experimental data was made by randomly picking the location of the mounting point on a PCB of 800mm in width and 800mm in length. The number of mounting points is divided into 25, 50, 75, and 100, and experiments are conducted according to the number of types of electronic components, number of nozzle types, and suitability between nozzles and electronic components, respectively. Because the experimental data are random, the calculation time is not constant, but it is confirmed that the gantry route is found within a reasonable time.

• Proceedings of the Korean Magnestics Society Conference
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• 한국자기학회 2009년도 정기총회 및 동계학술연구발표회
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• pp.136-137
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• 2009

• The Transactions of the Korean Institute of Electrical Engineers D
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• 제52권12호
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• pp.671-678
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• 2003

This paper proposes an expert system to generate automatically the test table of test system which can highly enhance the quality and productivity of product by inspecting quickly and accurately the defect device on the electronic circuit board tested. The expert system identifies accurately the tested components and the circuit patterns by tracing automatically the connectivity of circuit from electronic circuit database. And it generates automatically the test table to detect accurately the missing components, the misplaced components, and the wrong components for analog components such as resistance, coil, condenser, diode, and transistor, based on the experience knowledge of veteran expert. It is implemented in C computer language for the purpose of the implementation of the inference engine using the dynamic memory allocation technique, the interface with the electronic circuit database and the hardware direct control. And, the validity of the builded expert system is proved by simulating for a typical electronic board model.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제32권5호
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• pp.426-431
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• 2019

In this study, we report the effect of pre-treatment of alpha-$Ga_2O_3$ grown on a sapphire substrate by halide vapor phase epitaxy (HVPE). During the pre-treatment process, 10 sccm of GaCl gas was injected to the sapphire substrate at $470^{\circ}C$. The surface morphologies of the alpha-$Ga_2O_3$ layers grown with various pre-treatment time (3, 5, and 10 min) were flat and crack-free. The transmittance of the alpha-$Ga_2O_3$ epi-layers was measured to analyze their optical properties. The transmittance was over 80% within the range of visible light. The strain in the alpha-$Ga_2O_3$ grown with a pre-treat 5 min was measured, and was found to be close to the theoretical XRD peak position. This can be explained by the reduction of strain having caused a lattice mismatch between the alpha-$Ga_2O_3$ layer and sapphire substrate. The calculated dislocation density of the screw and edge were $2.5{\times}10^5cm^{-2}$ and $8.8{\times}10^9cm^{-2}$, respectively.

• The Transactions of the Korean Institute of Power Electronics
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• 제24권4호
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• pp.244-258
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• 2019

The reliability of power electronic systems becomes increasingly important, as power electronic systems have gradually gained an essential status in a wide range of industrial applications. Accordingly, recent research has made an effort to improve the reliability of power electronic systems to comply with stringent constraints on safety, cost, and availability. The condition monitoring of power electronic components is one of the main topics in the research area of the reliability of power electronic systems. In this paper, condition-monitoring methods of reliability-critical components in power electronic systems are discussed to provide the current state of knowledge by organizing and evaluating current representative literature.

• Journal of Sensor Science and Technology
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• 제28권2호
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• pp.106-112
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• 2019

Flexible impact force sensors composed of piezoelectric PZT/PDMS composite sandwiched between Al/PET films were fabricated and their voltage signal characteristics were evaluated under varying impact forces for electronic mitt applications. The piezoelectric impact force sensor on an ethylene-vinyl acetate (EVA) substrate exhibited an output voltage difference of no greater than 40 mV a periodical impact test in with the impact load was increased by as much as 240 N by a restoration time of 5 s in a five-time experiment, implying good sensing ability. Moreover, the impact force sensor embedded four electronic mitts showed a reliable sensitivity of less than 1 mV/N and good repeatability under 100 N-impact force during a cycle test executed 10,000 times. This indicated that the fabricated flexible piezoelectric impact sensor could be used in electronic mitt applications. However, the relatively low elastic limit of substrate material such as EVA or poly-urethane slightly deteriorated the sensitivity of the impact sensor embedded electronic mitt at over 200 N-impact forces.

• Transactions on Electrical and Electronic Materials
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• 제9권1호
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• pp.33-37
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• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.