• 대한기계학회논문집A
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• 제28권6호
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• pp.774-782
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• 2004

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• 마이크로전자및패키징학회지
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• 제22권3호
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• pp.57-65
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• 2015

반도체 패키지는 여러 가지 다양한 재료로 구성되어 있으며, 제조시나 사용 환경에서 온도가 변하면 각 재료의 열팽창 계수의 차이로 인하여 굽힘변형이 발생하게 된다. 그림자 무아레 방법은 비접촉으로 전체 영역에 걸친 면외변위를 측정하는 광학적 방법이지만 측정 감도가 $50{\mu}m/fringe$ 이상이어서 반도체 패키지의 굽힘변형을 측정하기에는 적당하지 않은 면이 있었다. 본 논문에서는 그림자 무아레 시스템에 위상이동 기법을 적용하여 $12.5{\mu}m/fringe$의 향상된 감도를 갖는 측정장치를 구성하였다. 그림자 무아레 측정에서 나타나는 탈봇 현상을 고려하여 1/2 탈봇 영역에서 변형을 측정할 수 있도록 실험을 수행하였다. 위상이동에 의해 기록되는 4장의 그림자 무늬를 영상처리하여 감도가 4배 향상된 그림자 무늬를 얻어내었다. 본 논문에서 개발한 측정방법을 기존의 섬유강화 패키지 기판과 무섬유 패키지 기판에 적용하여 상온과 약 $100^{\circ}C$의 환경에서 발생하는 굽힘변형을 측정하였다.

• 한국전기전자재료학회논문지
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• 제27권9호
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• pp.600-605
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• 2014

The interest in development on luminaires which are available up to $-52^{\circ}C$ is surging as demands in vessels navigating a north pole route increase. A conventional incandescent lamp used in vessels is operated stably at $-52^{\circ}C$, but many countries including Korea have eliminated the use of incandescent lamps gradually because of its low luminous efficacy. In this paper, therefore, to develop the LED luminaires with high-efficiency, long lifetime that enables to substitute for incandescent lamp, it has studied about cryogenic characteristics of LED packages, bulbs, driving circuit and power supply. This experiments were carried out according to standards IEC 60945-8.4.1. Temperature range is from $-60^{\circ}C$ to $25^{\circ}C$, and the light output depending on ambient temperature. It showed that, based on $25^{\circ}C$, light output of a CFL decreased by 80% of CFL at $-20^{\circ}C$ while each increased 12% of LED bulbs and 16~19% of LED packages at $-60^{\circ}C$.

• 한국융합학회논문지
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• 제8권11호
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• pp.43-48
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• 2017

반도체는 산업 기술의 발전을 주도하고 있는 첨단기술로서 전자제품의 소형, 경량화 달성으로 전자산업 시장을 끌어가고 있는 상황이다. 특히 반도체 생산 공정은 정밀하고 복잡한 공정으로 이루어져 있어 효과적인 생산이 필요하며, 최근 불량 검출을 위하여 컴퓨터와 카메라를 융합한 비전 시스템이 활용되고 있고, 특수한 공정에 의하여 가공된 미세 패턴의 형상을 측정하기 위한 시스템의 수요가 급속하게 증대되고 있다. 본 논문에서는 반도체 패키지의 스크래치 결함을 검출하기 위하여 마스크 이미지를 이용한 비전 알고리즘을 제안한다. 제안 시스템을 통하여 반도체 패키지 생산 공정에 적용하면 생산관리를 원활하게 할 수 있고, 빠른 패키지의 불량 판정으로 생산의 효율성이 높아질 것으로 기대된다.

• 마이크로전자및패키징학회지
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• 제26권4호
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• pp.47-53
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• 2019

Polydimethylsiloxane (PDMS)를 베이스 기판으로 사용하고 이보다 강성도가 높은 polytetrafluoroethylene(PTFE)를 island 기판으로 사용한 soft PDMS/hard PDMS/PTFE 구조의 강성도 경사형 신축 패키지를 형성하고, 이의 신축변형에 따른 저항특성을 분석하였다. PDMS/PTFE 기판패드에 50 ㎛ 직경의 칩 범프들을 anisotropic conductive paste를 사용하여 실장한 플립칩 접속부는 96 mΩ의 평균 접속저항을 나타내었다. Soft PDMS/hard PDMS/PTFE 구조의 신축 패키지를 30% 변형률로 인장시 PTFE의 변형률이 1%로 억제되었으며, PTFE 기판에 형성한 회로저항의 중가는 1%로 무시할 정도였다. 0~30% 범위의 신축변형 싸이클을 2,500회 반복시 회로저항이 1.7% 증가하였다.

• 한국전기전자재료학회논문지
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• 제17권3호
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• pp.267-271
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• 2004

The joint strength and fracture surface of Sn-Pb solder bump in photo diode packages after isothermal aging testing were studied experimentally. Cu/Sn-Pb solders were adopted, and aged for up to 900 hours at 12$0^{\circ}C$ and 17$0^{\circ}C$ to analyze the effect of intermetallic compound(IMC). In 900-hour aging experiments, the maximum shea strength of Sn-Pb solder decreased by 20％ and 9％. The diffraction patterns of Cu$_{6}$Sn$_{5}$, scallop-shape IMC, and planar-shape Cu$_3$Sn were observed by Transmission Electron Microscopy (TEM).EM).

• International Journal of Internet, Broadcasting and Communication
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• 제7권2호
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• pp.161-167
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• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

• 한국전기전자재료학회논문지
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• 제30권7호
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• pp.463-468
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• 2017

Eight types of LED packages were manufactured according to the type and composition ratio of phosphors by using commercially available white LED phosphors. CRI (Ra), a conventional color quality evaluation method was evaluated by using manufactured white LED; the Rf, Rg, color vector graphic, and color distortion graphic were evaluated with a new method, IES TM-30-15. The results of the evaluation confirmed that the new method compensated for the disadvantages of CRI, which was found to be inadequate when the color was saturated. The added evaluation index identified the chroma variation and color change. Furthermore, the study showed that the changes of Rf and Rg are small when controlling phosphors based on CRI, questioningthe necessity of identifyingchroma variation and color change.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.221-224
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• 2001

In this paper, the bonding wire interconnection has been studied from the points of view of modeling and electrical characterization. The bonding wire is measured by TDR(Time Domain Reflectometry) and Network analyzer(1-10㎓). First, one gold bonding wire mounted on 2mm gap substrate measured 3.68nH by TDR and 3.39nH by Network analyzer(6㎓). Two gold bonding wire mounted on 2mm gap substrate measured 3.14nH by TDR and 2.80nH by Network analyzer. This result presented that inductance of bonding wire could be employed as inductors for radio frequency circuit packaging.