Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study of the IMC Growth and Shear Strength of Solder Bump and TiW/Cu/electroplating Cu UBM

솔더범프와 TiW/Cu/electroplating Cu UBM 층과의 금속간 화합물 형성과 범프 전단력에 관한 연구

  • 장의구 (중앙대학교 전자전기공학부) ;
  • 김남훈 (중앙대학교 전자전기공학부) ;
  • 김남규 (중앙대학교 전자전기공학부) ;
  • 엄준철 (중앙대학교 전자전기공학부)
  • Published : 2004.03.01
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Abstract

The joint strength and fracture surface of Sn-Pb solder bump in photo diode packages after isothermal aging testing were studied experimentally. Cu/Sn-Pb solders were adopted, and aged for up to 900 hours at 12$0^{\circ}C$ and 17$0^{\circ}C$ to analyze the effect of intermetallic compound(IMC). In 900-hour aging experiments, the maximum shea strength of Sn-Pb solder decreased by 20％ and 9％. The diffraction patterns of Cu$_{6}$Sn$_{5}$, scallop-shape IMC, and planar-shape Cu$_3$Sn were observed by Transmission Electron Microscopy (TEM).EM).

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References

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