• Title/Summary/Keyword: Electronic Heating

Search Result 512, Processing Time 0.031 seconds

Induction Melting Process using Graphite Crucible for Metallurgical Grade Silicon (Graphite Crucible을 이용한 실리콘 유도 용융 공정)

  • Park, Sung-Soon;Jang, Bo-Yun;Kim, Joon-Soo;Ahn, Young-Soo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2010.06a
    • /
    • pp.223-223
    • /
    • 2010
  • 태양 전지에 사용되는 실리콘의 전자기 유도 용융 기술은 잉곳(ingot)의 성장 및 금속 정련 등의 핵심 공정인 실리콘 용융에서 사용되는 중요한 기술이다. 하지만, 유도 용융에 사용되는 흑연 도가니에 의한 실리콘의 오염은 실리콘의 순도저하에 요인으로 작용한다. 흑연 도가니와 용융된 실리콘이 접하는 계면에서 탄소의 오염이 발생하게 되며, 실리콘 내부에 흡수한 탄소는 대표적인 비금속 불순물로 태양전지 효율을 감소시킨다. 본 연구에서 사용되는 흑연 도가니는 유도 코일의 전자기력에 의해 실리콘과 무접촉 또는 연접촉이 가능한 구조이다. 또한, 유도 자기장을 이용하여 실리콘과 같은 반도체를 용융할 경우, 고상에서의 낮은 전기전도도로 인해 효과적인 줄-발열(Joule Heating)이 불가능하므로 플라즈마와 같은 보조 열원을 필요로 한다. 본 연구에서는, 보조 열원 없이 세그먼트(segment)된 흑연 도가니를 이용한 실리콘 용융 연구를 진행하였다.

  • PDF

Development of Micro Cooling System for Telecommunication System using Oscillating Heat Pipe (진동 세관형 히트파이프를 이용한 통신 기기용 마이크로 냉각시스템의 개발)

  • Ha, Soo-Jung;Bae, Nae-Soo;Park, Chul-Min;Kim, Jung-Soo
    • Proceedings of the KSME Conference
    • /
    • 2003.04a
    • /
    • pp.1499-1505
    • /
    • 2003
  • Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices. So, in this paper, characteristics on oscillating heat pipe according to operating conditions(environment temperature, charging ratio of working fluid, inclination) based on experimental study was investigated. From the experimental results, $25^{\circ}C$environment temperature), R-141b(working fluid)40%(charging ratio) was best performace at others of inclination angle and The top heating mode of OCHP performed 80% efficiency of the bottom heating mode.

  • PDF

The characteristics analyses of deteriorated PVC insulated flexible cords by over-current (과전류에 의해 열화된 비닐코드의 특성 분석)

  • Kim, Hyang-Kon;Choi, Chung-Seog;Kim, Dong-Ook;Chung, Hun-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2003.07a
    • /
    • pp.489-492
    • /
    • 2003
  • In this paper, we experimented on the deterioration process of power supply cords and analyzed the heating temperature of each part of those cords. We also analyzed the surface states, metallurgical structures surface structures and compositions of the wire melted by over-current. In the results of the analyses, the covering began to be deteriorated from the inside. The heating temperature of extension cord was higher than that of plug body. The dendrite structures appeared at the melted wire. By the SEM and EDS analyses, the dendrite structure showed the growth of copper oxide. We found out the characteristics of PVC insulated flexible cords by over-current from the above experiments and analyses. These results may be useful data in the analyses of deterioration causes of power supply cords.

  • PDF

Fabrication and Characterization of Thermal Probe Array on SOI Substrates (SOI 기판을 이용한 Thermal Probe 어레이 제작 및 특성 평가)

  • Cho, Ju-Hyun;Na, Kee-Yeol;Park, Keun-Hyung;Lee, Jae-Bong;Kim, Yeong-Seuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.18 no.11
    • /
    • pp.990-995
    • /
    • 2005
  • This paper reports the fabrication and characterization of $5\;\times\;5$ thermal cantilever array for nano-scaled memory device application. The $5\;\times\;5$ thermal cantilever array with integrated tip heater has been fabricated with MEMS technology on SOI wafer using 7 photo masking steps. All single-level cantilevers have a diode in order to eliminate any electrical cross-talk between adjacent tips. Electrical measurements of fabricated thermal cantilever away show its own thermal heating mechanism. Thermal heating is demonstrated by the reflow of coated photoresist on the cantilever array surface.

Crystallization behavior of ITO thin films sputtered on substrates with and without heating (가열기판 및 비가열 기판에 증착한 ITO 박막의 결정화 거동)

  • Park, Ju-O;Lee, Joon-Hyung;Kim, Jeong-Joo;Cho, Sang-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2003.08a
    • /
    • pp.89-92
    • /
    • 2003
  • ITO thin films were deposited by RF-magnetron sputtering method and crystallization behavior of the films with and without external heating as a function of deposition time was examined. X-ray diffraction results indicated an amorphous state of the film when the deposition time is short about 10 min. When the deposition time was increased over 20 min development of crystallization of the films is observed. Because RF-sputtering transfers the high-energy to the growing film by energetic bombardment, it is believed that considerable activation energy for the crystallization of the film has transferred during deposition, which resulted in the crystallization of ITO thin films without external energy supply.

  • PDF

A study on Characteristics analysis of time sharing type high frequency resonant inverter using a Phase-Shift (Phase-Shift를 이용한 시분할방식 고주파 공진 인버터의 특성 해석에 관한 연구)

  • Cho, G.P.;Lee, E.W.;Bae, Y.H.;Yoon, S.H.;Kim, J.K.
    • Proceedings of the KIEE Conference
    • /
    • 2000.07b
    • /
    • pp.1168-1170
    • /
    • 2000
  • A half bridge time sharing type high frequency resonant inverter to give VVVF function in the inverter used as power source of induction heating at high frequency is presented in this paper, this paper also realize the output control of independence irrespective of the switching frequency using Phase-Shift. The analysis of the proposed circuit is generally described by using the normalized parameters. Also, the principle of basic operation and the its characteristics are estimated by the parameters, such as switching frequency, the variation of phase angle(${\varphi}$) of Phase-Shift. It is certain that the proposed circuit will be used and expanded in the high frequency power supplies like induction heating systems.

  • PDF

Statistical Modeling of the Pretilt Angle Control in Nematic Liquid Crystal using In-situ Photoalignment Method on Plastic Substrate

  • Kang, Hee-Jin;Lee, Jung-Hwan;Yun, Il-Gu;Seo, Dae-Shik
    • Transactions on Electrical and Electronic Materials
    • /
    • v.7 no.3
    • /
    • pp.145-148
    • /
    • 2006
  • In this study, the response surface modeling of the pretilt angle control using in-situ photoalignment method with oblique UV exposure .on plastic substrate is investigated. The pretilt angle is the main factor to determine the alignment of the liquid crystal display. The response surface model is used to analyze the variation of the pretilt angle on the various process conditions. Heating temperature and UV exposure time are considered as input factors. The liquid crystal (LC) pretilt angle increased with increasing heating temperature and UV exposure time. The analysis of variance is used to analyze the statistical significance and the effect plots are also investigated to examine the relationship between the process parameters and the response.

The Aging Behavior of Overhead Conductor due to Forest Fire (산불에 의한 가공송전선의 열화거동)

  • Kim, Byung-Geol;Kim, Shang-Shu;Han, Se-Won;Kim, Jin-Han
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.20 no.12
    • /
    • pp.1105-1111
    • /
    • 2007
  • Because forest fire can give a serious damage to overhead conductors, the thorough understanding about aging behavior of burned conductor is very important in maintaining the transmission line safely. Therefore, a systematic investigation was carried out by heating method. As the heating temperature increases, drastic change of tensile strength of Al wire due to the softening of Al wire occurred. When Al wire is exposed to the flame(about $800\;^{\circ}C$) during only 13 seconds, the remained tensile strength of Al wire showed under 90 %. The detailed results will be given in the text.

The Study on Activity Star Problem and Optimum Construction Method Through the Defect Case of Zero Energy House in the Existing Building (기축건물의 제로에너지 하우스 하자 사례를 통한 공종별 문제점 및 최적구축 방안에 관한 연구)

  • Kim, Sun-Geun;Kwon, Soon-Wook
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.28 no.4
    • /
    • pp.262-270
    • /
    • 2015
  • In this paper existing buildings, not a new buildings and house for living people not just a displaying and a viewing, created by the imagine effect or virtual simulation was applied various Active and Passive elements. After constructing zero-energy houses, through default case happened during operation period it is described problems and solutions about field part, work classification, installation by Location part, and Installation equipment part. Since then, to take advantage of this thesis, it's the purpose of this paper using as the baseline data for building a zero-energy house in another similar case.

Experimental fabrication and analysis of thermoelectric devices (복합재료에 의한 열전변환 냉각소자의 개발에 관한 연구)

  • 성만영;송대식;배원일
    • Electrical & Electronic Materials
    • /
    • v.9 no.1
    • /
    • pp.67-75
    • /
    • 1996
  • This paper has presented the characteristics of thermoelectric devices and the plots of thermoelectric cooling and heating as a function of currents for different temperatures. The maximum cooling and heating(.DELTA.T) for (BiSb)$\_$2/Te$\_$3/ and Bi$\_$2/(TeSe)$\_$3/ as a function of currents is about 75.deg. C, A solderable ceramic insulated thermoelectric module. Each module contains 31 thermoelectric devices. Thermoelectric material is a quaternary alloy of bismuth, tellurium, selenium, and antimony with small amounts of suitable dopants, carefully processed to produce an oriented polycrystalline ingot with superior anisotropic thermoelectric properties. Metallized ceramic plates afford maximum electrical insulation and thermal conduction. Operating temperature range is from -156.deg. C to +104.deg. C. The amount of Peltier cooling is directly proportional to the current through the sample, and the temperature gradient at the thermoelectric materials junctions will depend on the system geometry.

  • PDF