• Title/Summary/Keyword: Electronic Heating

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A Study on the High Frequency Resonant Inverter of Class D SEPP type using LS-ZVS-LSTC (LS-ZVS-LSTC를 이용한 D급 SEPP형 고주파 공진 인버터에 관한 연구)

  • Park, Dong-Han;Choi, Byeong-Joo;Kim, Jong-Hae
    • Journal of IKEEE
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    • v.24 no.1
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    • pp.260-268
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    • 2020
  • This paper presents the high frequency resonant inverter of class D SEPP(Single-Ended Push Pull) type using LS-ZVS-LSTC, which can reduce the switching losses during the turn-on and turn-off switching time. The analysis of high frequency resonant inverter using LS-ZVS-LSTC(Low-loss Turn-off Snubber Capacitor) proposed in this paper is described in general by adopting the normalized parameters. The operating characteristics of the proposed high frequency resonant inverter were also evaluated by using the control parameters such as the normalized control frequency(μ), the normalized load time constant(τ), the coupling factor(κ) and so on. Based on the characteristic values through the characteristics of evaluation, an example of the design method of the 1.8[kW] class D SEPP type high frequency inverter is suggested, and the validity of the theoretical analysis is verified using the experimental data.

Study on Evaluation of Local Cooling Performance using Piezoelectric and Thermoelectric Modules (압전소자와 열전소자를 이용한 국소부 냉각성능 평가에 관한 연구)

  • Oh, Hoo-suk;Choi, Byung-Hui
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.2
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    • pp.478-483
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    • 2017
  • This paper investigated experimentally the performance of cooling systems using thermoelectric and piezoelectric modules for local heating and temperature control, such as a handheld electronic devices. The temperature distribution of the cooling region using thermoelectric modules was measured when the piezoelectric module was and was not with a frequency of 80Hz and 110Hz. The coefficients of performance were also calculated by the temperature results, and the thermo-flow phenomena in the cold region was visualized under the same conditions. The results of the temperature distribution measurements and the coefficient of performance showed that the cooling performance of the cooling system using thermoelectric modules can be improved by operating the piezoelectric module. In addition, when the piezoelectric module was operated based on the result of visualization in the cold region, which was formed by thermoelectric modules, the performance thermoelectric cooling was improved by the thermo-flow formed in the entire cold region as the forced convection of vibration was generated on the local cold region by the piezoelectric module.

Implementation of Zero-Ripple Line Current Induction Cooker using Class-D Current-Source Resonant Inverter with Parallel-Load Network Parameters under Large-Signal Excitation

  • Ekkaravarodome, Chainarin;Thounthong, Phatiphat;Jirasereeamornkul, Kamon
    • Journal of Electrical Engineering and Technology
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    • v.13 no.3
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    • pp.1251-1264
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    • 2018
  • The systematic and effective design method of a Class-D current-source resonant inverter for use in an induction cooker with zero-ripple line current is presented. The design procedure is based on the principle of the Class-D current-source resonant inverter with a simplified load network model that is a parallel equivalent circuit. An induction load characterization is obtained from a large-signal excitation test-bench based on parallel load network, which is the key to an accurate design for the induction cooker system. Accordingly, the proposed scheme provides a systematic, precise, and feasible solution than the existing design method based on series-parallel load network under low-signal excitation. Moreover, a zero-ripple condition of utility-line input current is naturally preserved without any extra circuit or control. Meanwhile, a differential-mode input electromagnetic interference (EMI) filter can be eliminated, high power quality in utility-line can be obtained, and a standard-recovery diode of bridge-rectifier can be employed. The step-by-step design procedure explained with design example. The devices stress and power loss analysis of induction cooker with a parallel load network under large-signal excitation are described. A 2,500-W laboratory prototype was developed for $220-V_{rms}/50-Hz$ utility-line to verify the theoretical analysis. An efficiency of the prototype is 96% at full load.

The Power System for Home Appliance Air-Conditioner using Partial Switching Power Factor Correction Module (부분 스위칭 PFC 모듈을 이용한 가정용 에어컨 전원장치)

  • Suh, Ki-Young;Mun, Sang-Pil
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.18 no.6
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    • pp.183-190
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    • 2004
  • This paper proposes a methodology to solve problems upon the circuit design applied to inductor load by applying a circuit to improve power factor with is partial switching PFC module to the power supply system for cooling/heating inverter air conditioner and by designing an input power section in compliance with IEC555-2 on the basis of better input power factor and minimized harmonic components of current. On the other hand, this paper suggested how to control the increase of output voltage along with tぉw current waves and partial switching PFC circuit as well, which can provide the output as twice as input voltage This study applied a method to control the compressors of air conditioner by means of increased the voltage applicable to compressor motor by lowering switching number conclusively, it could solve questions about efficiency, economics, electronic noise and so forth. and so that the reasonable voltage for running moor could be set up along with lower power consumption of air conditioner than estimated It was demonstrated that total sum of energy efficiency to operate system was increased to the extent of valid level. And all this merits and appropriateness was proved by computer simulation and experience.

A Study on Development of Large-capacity Aluminum Heat Sinks Brazed with a Batch Furnace (대용량 알루미늄 브레이징 히트싱크 개발에 관한 연구)

  • Lee, Young-Lim;Hwang, Soon-Ho;Jeon, Euy-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.10 no.7
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    • pp.1459-1464
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    • 2009
  • Recently demand for large-capacity aluminum heat sinks has been increased as market for high power electricity expands and high-performance electronic products develop. While the brazed heat sinks are in particular preferred, it is almost impossible to manufacture them with an atmospheric continuous furnace due to insufficient heating rate and various thickness of the parent metals. Therefore, a new index batch furnace is developed and the process variables are optimized. Then, brazing efficiency and tensile stress are obtained for brazed parts of the heat sinks. Finally experiment as well as numerical analysis has been performed to compare thermal efficiency of the brazed heat sinks with that of the silicone-bonded heat sinks.

A Study on Plate & Shell type Evaporator in HVAC System for Offshore Plant (해양플랜트 HVAC 시스템용 플레이트·쉘 타입 증발기에 관한 연구)

  • Park, Jae-Hong
    • Journal of the Korean Institute of Gas
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    • v.24 no.1
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    • pp.33-40
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    • 2020
  • Chiller systems which have better temperature stability than Direction expansion coils are often used as condensing units in HVAC systems for offshore plants. Large capacity compressors and electronic expansion valves in chiller systems are mostly imported, and the size of a chiller system depends on heat exchangers such as evaporators and condensers which are locally produced. Due to limited space in the offshore plants, shipyards are demanding manufacturers to make equipment compact. In this paper, a shell & tube heat exchanger, which is used as an evaporator in the conventional flooded chiller system, is replaced by a newly developed compact plate & shell heat exchanger. The main development process of the plate & shell heat exchanger is introduced, and its performances were experimentally evaluated with a real flooded chiller system, and the results are presented.

Smart Manhole Device for Underground Facility Management (지중 시설물 관리를 위한 스마트 맨홀 디바이스)

  • Kim, Jong-Duk;Han, Seung-Heon;Kim, Yong-Kil
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.23 no.8
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    • pp.996-1003
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    • 2019
  • The undergrounding of diverse ground facilities has led to a decrease in issues, such as foul smell of water supply systems and wastewater, a fall of telephone poles, electromagnetic waves and breaking of wires caused by a railway work. On the other hand, there are new issues, including a fall accident, explosion affected by flammable gas, a choking accident by harmful gas and a lack of oxygen concentration, a fire coming from high-tension wire heating and flooding in the manhole. Besides, these issues damage the civil society and are an anxiety to public safety. Therefore, this paper is focused on a smart manhole device for stable communication environments inside and outside the manhole and wireless communication with various devices for managing facilities in the manhole, and aims to make a contribution to public safety by suggesting a direction of future underground facility management.

Measurement of Thermal Characteristics of Thin Film Patterned Heating Heater on Silicon Semiconductor Substrate (실리콘 반도체 기판에 제작된 박막 패턴 발열 히터의 열특성 측정)

  • Park, Hyun-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.6
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    • pp.9-13
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    • 2019
  • In this study, a miniature thin film-patterned heater was fabricated on a silicon substrate using semiconductor process technology and the thermal characteristics of the applied voltage, power, and temperature of the thin film heater were measured and analyzed. The temperature of the thin film pattern heater increased with increasing power, but the temperature increase rate was gradual at high power intervals. The characteristics of the high temperature section of the platinum thin film-patterned heater were analyzed using the heat resistance model under atmospheric and vacuum conditions. The thermal resistance measured in a vacuum atmosphere was 0.79 [K/mW] higher than the heat resistance value 0.69 [K/mW] in air. The temperature of the thin film pattern heater can be maintained at a low power in a vacuum rather than in air, and these results are expected to be utilized in the structural design of a thin film-patterned heater element.

Study on Electrical Characteristics of FDM Conductive 3D Printing According to Annealing Conditions (FDM 3D 전도성 프린팅 어닐링 조건 따른 전기적 특성 연구)

  • Lee, Sun Kon;Kim, Yong Rae;Yoo, Tae Jung;Park, Ji Hye;Kim, Joo Hyung
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.6
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    • pp.53-60
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    • 2018
  • In this paper, the effect of different 3D printing parameters including laminated angle and annealing temperature is observed their effect on FDM conductive 3D printing. In FDM 3D printing, a conductive filament is heated quickly, extruded, and then cooled rapidly. FDM 3D Print conductive filament is a poor heat conductor, it heats and cools unevenly causing the rapid heating and cooling to create internal stress. when the printed conductive specimens this internal stress can be increase electrical resistance and decrease electrical conductivity. Therefore, This experiment would like to use annealing to remove internal stress and increase electrical conductivity. The result of experiment when 3D printing conductive specimen be oven cooling of annealing temperature $120^{\circ}C$ electrical resistance appeared decrease than before annealing. So We have found that 3D printing annealing removes internal stresses and increases the electrical conductivity of printed specimens. These results are very useful for making conductive 3D printing electronic circuit, sensor ect...with electrical conductance suitable for the application.

Analysis of Causes PCB Failure for Collective Protection Equipment and Improvement of Quality (집단보호장비 내의 회로카드조립체 고장 원인 분석 및 품질 향상)

  • Pak, Se-Jin;Ki, Sang-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.5
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    • pp.87-92
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    • 2019
  • This study is the analysis of causes of printed circuit board (PCB) in collective protection equipment failure and quality improvement. The equipment is a component of the weapon system currently in operation and serves to defend against enemy chemical and biological attack as well as heating and cooling functions. However, during operation in the military, fans of condensate assembly failed to operate. The cause of the failure is the burning of PCB. It was found that the parts were heated according to the continuous cooling operation under the high temperature environmental conditions. Accordingly, the electronic components exposed to high temperature were deteriorated and destroyed. To solve this problem, PCB apply to heatsink. The performance test of improved PCB has been completed. Futhermore system compatibility, positive pressure maintenance and noise test were performed. This improvement confirmed that no faults have occurred in PCB so far. Therefore, the quality of the equipment has improved.