• 제목/요약/키워드: Electronic Heating

검색결과 512건 처리시간 0.028초

Thermite Reaction Between CuO Nanowires and Al for the Crystallization of a-Si

  • Kim, Do-Kyung;Bae, Jung-Hyeon;Kim, Hyun-Jae;Kang, Myung-Koo
    • Transactions on Electrical and Electronic Materials
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    • 제11권5호
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    • pp.234-237
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    • 2010
  • Nanoenergetic materials were synthesized and the thermite reaction between the CuO nanowires and the deposited nano-Al by Joule heating was studied. CuO nanowires were grown by thermal annealing on a glass substrate. To produce nanoenergetic materials, nano-Al was deposited on the top surface of CuO nanowires. The temperature of the first exothermic reaction peak occurred at approximately $600^{\circ}C$. The released heat energy calculated from the first exothermic reaction peak in differential scanning calorimetry, was approximately 1,178 J/g. The combustion of the nanoenergetic materials resulted in a bright flash of light with an adiabatic frame temperature potentially greater than $2,000^{\circ}C$. This thermite reaction might be utilized to achieve a highly reliable selective area crystallization of amorphous silicon films.

작물 배양용 램프 개발을 위한 인버터의 열 해석에 관한 연구 (Study about Heating Analysis of Inverter for Development)

  • 윤정필;강병복;박세준;이기제;차인수
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2003년도 추계학술대회 논문집
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    • pp.222-225
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    • 2003
  • BT에 대한 관심이 높아지면서 식물 종자 및 작물의 배양 기술에 관한 연구가 활발해 지고 있다. 이 연구들은 주로 백신, 종자 등에 대해 연구가 이루어지고 있는데, 이를 위해 다양한 연구 환경의 구축이 필요한 시점이다. 본 논문에서는 여러 가지 분야 중에서도 빛의 파장대에 따른 작물의 배양 조건 분류를 위한 특수램프 개발에 주목적을 두고 인버터 최적조건 설계를 위하여 Ansys S/W를 사용, 램프 전원용 인버터의 열 분포를 시뮬레이션 하였다.

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다기능 센서 시스템의 제작 및 동작 특성 (Fabrication and Characteristics of Multi-functional Sensor System)

  • 정재업;이효웅;이성필
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.368-371
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    • 2003
  • The humidity sensors with a stable characteristics and gas sensors operating at room temperature have been fabricated, and a multi-functional sensor system which has gas sensor, humidity sensor, temperature sensor and control circuit has been applied to the microwave oven system. For a suitable cooking state, the humidity sensors was more applicable to heating and defrosting condition than gas sensors, however, the dynamic characteristics of gas sensors were obtained in the easy burning food such as pop corn.

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유도가열조리기의 최적설계 및 누설자속 해석 (The Optimal Design and Leakage Flux Analysis of the Induction Heating Cooker)

  • 변진규;박일한;최경;정현교;한송엽;노희석;권경안;양우종
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1996년도 하계학술대회 논문집 A
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    • pp.157-159
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    • 1996
  • For the optimal design of the induction heating cooker, precise and accurate analysis of the magnetic field inside the jar must be achieved first. Until now, design methods based on experience has been used in industry field. But this takes a lot of trial and error, high cost and also long development time. So the analysis of the magnetic field distribution is very important. In this paper the magnetic field inside the induction heating cooker is analyzed by using axisymmetrical FEM(finite element method). And the method of the coil location design for the optimal heat source distribution using sensitivity analysis is developed. In addition, the shielding effect of the non-axisymmetrical 3-D ferrite structure used in induction heating cooker is also analyzed by the integral method.

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레이저 간섭법과 점 가열법을 이용한 용접부의 잔류응력 측정에 관한 연구 (A Study on Welding Residual Stress Measurement by Laser Inteferometry and Spot Heating Method)

  • 홍경민;이동환;강영준
    • 한국정밀공학회지
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    • 제25권3호
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    • pp.101-108
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    • 2008
  • Residual stress is one of the causes which make defects in engineering components and materials. Many methods have been developing to measure the residual stress. Though these methods provide the information of the residual stress, they also have disadvantage like a little damage, time consumption, etc. In this paper, we devised a new experimental technique to measure residual stress in materials with a combination of laser speckle pattern interferometry and spot heating. The speckle pattern interferometer measures in-plane deformation during the heat provides for much localized stress relief. 3-D shape is used for determining heat temperature and other parameters. The residual stresses are determined by the amount of strain that is measured subsequent to the heat and cool-down of the region being interrogated. A simple model is presented to provide a description of the method. In this paper, we could experimentally confirm that residual stress can be measured by using laser interferometry and spot heating method.

전류가열 사출금형에 의한 자동차 부품의 표면개선에 관한 연구 (A Study of Surface Improvement for Automotive Part by Injection Mold of Electronic Heating)

  • 최동혁;황현태;손동일;김대일
    • 한국표면공학회지
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    • 제51권1호
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    • pp.40-46
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    • 2018
  • The light-weight of the research and development materials is actively carried out by overseas automobile companies and technology development continues in Korea. For the sake of fuel efficiency, the development of lightweight technology by improving the manufacturing method has been very effective. Recently, to maximize the effects of light weight, automotive interior parts have been applied by the micro-cellular injection molding using supercritical fluids and we call the Mucell manufacturing. This technique causes a problem in the quality of the surface of the products, because the shooting cells are revealed as the surface layer of the products by forming micro cells at the center of the products during injection molding. To overcome these phenomenon, we increased the temperature of injection molding using joule heating until critical value. In this study, we have predicted the problem of Mucell injection molding through the finite element analysis as changed the temperature by joule heating. From the result of finite element analysis, we have determined the optimized process and made the injection mold included electric current heating system with Mucell manufacturing analyzed the surface characteristics of the injection product according to changing mold temperature.

폴리우레탄 유연 기판을 이용한 Ag 박막형 유연 면상발열체 연구 (Flexible Planar Heater Comprising Ag Thin Film on Polyurethane Substrate)

  • 이성열;최두호
    • 마이크로전자및패키징학회지
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    • 제31권1호
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    • pp.29-34
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    • 2024
  • 전류가 전도체를 통과할 때 발생하는 줄 열을 이용한 발열체는 자동차 창유리, 고속열차 창유리 및 태양전지와 같은 다양한 산업 분야에서 수분 제거 등을 위해 널리 연구되고 개발되고 있고, 최근에는 기계적 변형 조건 하에서도 안정적인 가열을 유지할 수 있는 유연 발열체를 개발하기 위하여 여러 나노 구조의 발열체를 이용한 연구가 활발하게 진행중이다. 본 연구에서는 유연성이 우수한 폴리우레탄을 기판으로 선정하고 마그네트론 스퍼터링을 이용하여 낮은 전기비저항(1.6 μΩ-cm)을 가지는 은 (Ag) 박막을 형성하여 발열층으로 이용한 연구를 진행하였다. 2D 박막구조에서의 전면발열에 의하여 열응답속도가 매우 높아 목표 온도의 95%까지 20초 이내에 도달하였으며 우수한 발열재현성을 보여주었다. 또한 기계적 변형이 가해지는 환경에서도 우수한 발열특성이 유지되었으며 반복적인 굽힘 테스트 (10,000회, 곡률반경 5 mm 기준)에서도 3% 이내의 전기저항 증가만이 발생할 정도로 우수한 유연성을 보유하여, 폴리우레탄/은 구조의 면상발열체는 굴곡진 형태를 가진 다양한 기기에서부터 인체분위와 같이 다양한 응력이 가해지는 환경에서 사용할 수 있는 플렉서블/웨어러블 면상발열체로의 적용이 매우 유망하다는 것을 보여준다. 또한 증착된 은 박막 발열 층 구조는 다양한 목적을 위한 기능을 추가하여 다양한 분야에서 사용할 수 있는 플렉서블/웨어러블 발열체로서의 적용 가능성을 보여줍니다.

교류자기장에 의한 유도가열체를 이용한 평판 디스플레이용 COG (Chip On Glass) 접속기술 (COG (Chip On Glass) Bonding Technology for Flat Panel Display Using Induction Heating Body in AC Magnetic Field)

  • 이윤희;이광용;오태성
    • 마이크로전자및패키징학회지
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    • 제12권4호통권37호
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    • pp.315-321
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    • 2005
  • 교류자기장에 의한 유도가열체를 이용하여 LCD 평판 디스플레이 패널의 가열을 최소화하면서 IC 칩을 실장시킬 수 있는 COG 접속기술에 대해 연구하였다. 크기 5mm${\times}$5mm, 두께 $600{\mu}m$의 Cu 도금막으로 제조한 유도가열체에 14 kHz, 230 Oe의 교류자기장을 인가시 60초 이내에 유도가열체의 온도가 Sn-3.5Ag 무연솔더의 리플로우에 필요한 $250^{\circ}C$에 도달하였으며, 유도가열체로부터 2 mm 떨어진 부위에서부터 기판의 온도는 $100^{\circ}C$ 이하로 유지되었다. 이와 같은 Cu 도금막 유도가열체에 14 kHz, 230 Oe의 교류자기장을 120초 동안 인가하여 Sn-3.5Ag 솔더범프를 리플로우 시켜 COG 실장을 하는 것이 가능하였다.

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이산화탄소 급탕 열펌프의 난방 성능에 관한 실험적 연구 (Experimental Study on the Heating Performance of a $CO_2$ Heat Pump Water Heater)

  • 백창현;이응찬;강훈;김용찬;조홍현;조성욱
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2008년도 동계학술발표대회 논문집
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    • pp.310-315
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    • 2008
  • In this study, experimental study on the heating performance of a $CO_2$ heat pump water heater with a variation of operating conditions such as refrigerant charge amount, outdoor temperature, compressor frequency, EEV opening and water mass flow rate. Based on the test results, the optimum charge amount was 1800 g. At the water mass flow rates of 75, 85, 95 kg/hr, the water heating temperature was 62, 67, $74^{\circ}C$ and COP was 2.6, 2.8, 3.0, respectively. Besides, the water mass flow rate and compressor frequency were varied to maintain above the water heating temperature of $60^{\circ}C$ with the decrease of outdoor temperature. So, The compressor frequency increased beyond 65 Hz and the water mass flow rate was 45 kg/hr at the outdoor temperature of $-13^{\circ}C$, 65 kg/hr at $-8^{\circ}C$, 75 kg/hr at $-3^{\circ}C$ and 85 kg/hr at 2, $7^{\circ}C$. As the outdoor temperature decreased, the heating COP decreased by 2.5-39.8%.

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다수의 균일발열부품이 접촉된 광대역 회선분배 시스템 냉각용 히트파이프 시스템의 비정상 동작특성에 관한 수치적 연구 (Numerical study on the transient operation characteristics of the heat pipe cooling system with the multiple uniform heating components for broadband digital cross-connect system)

  • 노홍구;이재헌
    • 대한기계학회논문집B
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    • 제22권6호
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    • pp.734-749
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    • 1998
  • A numerical study t predict the characteristics on transient operation of the heat pipe cooling system with multiple heaters for electronic system has been performed. The heat pipe cooling system of 45 cm length and 16 mm diameter was composed of evaporator section with four heaters which simulate electronic components, insulated transport section, and condenser section with a conductor which was cooled under the constant heat flux boundary condition. Two test cases were investigated in present study; Case 1 indicated that the 1st and 2nd heaters among four heaters were heated off, while the 3rd and the 4th heaters were heated on. Case 2 was the inverse situation switched from heating locations of Case 1. Case 3 indicated that the 1st and 4th heaters among four heaters were heated off, while the 2nd and 3rd heaters were heated on. The results showed that the transient time to reach the steady state is shorter for Case 1 than for Case 2. Especially, the maximum temperature among the heaters which simulate electronic components during switching operation is relatively small compared to the maximum allowable operating temperature in electronic system. It is concluded that the heat pipe cooling system in present study operate with the good thermal reliability even for sudden switching situation of the heaters.