• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.5
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• pp.353-360
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• 2012

As semiconductor device technology continuously shrinks, low-open area etch process prevails in front-end etch process, such as contact etch as well as one cylindrical storage (OCS) etch. To eliminate over loaded wafer processing test, it is commonly performed to emply diced small coupons at stage of initiative process development. In nominal etch condition, etch responses of whole wafer test and coupon test may be regarded to provide similar results; however, optical emission spectroscopy (OES) which is frequently utilize to monitor etch chemistry inside the chamber cannot be regarded as the same, especially etch mask is not the same material with wafer chuck. In this experiment, we compared OES data acquired from two cases of etch experiments; one with coupon etch tests mounted on photoresist coated wafer and the other with coupons only on the chuck. We observed different behaviors of OES data from the two sets of experiment, and the analytical results showed that careful investigation should be taken place in OES study, especially in coupon size etch.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.433-433
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• 2012

As the requirement in patterning geometry continuously shrinks down, the termination of etch process at the exact time became crucial for the success in nano patterning technology. By virtue of real-time optical emission spectroscopy (OES), etch end point detection (EPD) technique continuously develops; however, it also faced with difficulty in low open ratio etching, typically in self aligned contact (SAC) and one cylinder contact (OCS), because of very small amount of optical emission from by-product gas species in the bulk plasma glow discharge. In developing etching process, one may observe that coupon test is being performed. It consumes costs and time for preparing the patterned sample wafers every test in priority, so the coupon wafer test instead of the whole patterned wafer is beneficial for testing and developing etch process condition. We also can observe that etch open area is varied with the number of coupons on a dummy wafer. However, this can be a misleading in OES study. If the coupon wafer test are monitored using OES, we can conjecture the endpoint by experienced method, but considering by data, the materials for residual area by being etched open area are needed to consider. In this research, we compare and analysis the OES data for coupon wafer test results for monitoring about the conditions that the areas except the patterns on the coupon wafers for real-time process monitoring. In this research, we compared two cases, first one is etching the coupon wafers attached on the carrier wafer that is covered by the photoresist, and other case is etching the coupon wafers on the chuck. For comparing the emission intensity, we chose the four chemical species (SiF2, N2, CO, CN), and for comparing the etched profile, measured by scanning electron microscope (SEM). In addition, we adopted the Dynamic Time Warping (DTW) algorithm for analyzing the chose OES data patterns, and analysis the covariance and coefficient for statistical method. After the result, coupon wafers are over-etched for without carrier wafer groups, while with carrier wafer groups are under-etched. And the CN emission intensity has significant difference compare with OES raw data. Based on these results, it necessary to reasonable analysis of the OES data to adopt the pre-data processing and algorithms, and the result will influence the reliability for relation of coupon wafer test and whole wafer test.

• Journal of the Korea Society of Computer and Information
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• v.18 no.10
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• pp.81-88
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• 2013

Since nowadays mobile phone messages are flourishing, the application of electronic coupon (e-coupon) will become a trend for mobile users. E-coupon for mobile commerce can provide mobility for users and distribution flexibility for issuers. In this paper, we propose a mobile e-coupon system that just applies some simple cryptographic techniques, such as one-way hash function and XOR operation. In our system, the customer can control the number of issued e-coupons and the issuer can prevent them from double-redeeming. The customer does not need to perform any exponential computation in redeeming and transferring the coupons. Our scheme uses one-way hash chains for preventing from double-spending.

• Journal of Korea Multimedia Society
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• v.19 no.5
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• pp.948-956
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• 2016

Many franchise stores are in the surrounding. These stores offer many membership services. But, small traders do not provide much customer management service. For example, non-franchised cafes provide the services through paper coupons. However, most of paper coupons are available only in one store that issued the coupon. Besides, these coupons are in stamp format. Due to the absence of customers' management service, it is hard for small traders to attract customers compared to the franchise. Therefore, in this paper, We had implemented a mobile application, and applied to new customer management service in order to increase the price competitiveness of small traders. This service issues electronic coupon through a mobile app. customers can receive a relatively large amount of discount, and a deadline of coupons are short. When customers use coupons, new coupons are issued at the same time. This structure can be powerful means to lead customers' frequent visit. Small traders can gain a lot of regular customers by using this service.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.8
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• pp.76-82
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• 2016

In this paper, we evaluated shielding effectiveness (SE) of carbon nanotube (CNT) film using near field scanning (NFS) in near field analysis. We adopted CNT film with deposit carbon density of 5% and thickness of 1mm for evaluation of shielding characteristic. Using a test coupon analogized to an actual IC package, we measured SE according to measuring position and SE according to distances between the CNT film and the test coupon. As a result, the measured SE in the near field varied with frequency. Especially, the measured electric field SE in the center of the test coupon is better than that of the measured edge point of the test coupon where it is affected by fringing effect. The results show that the measured SE in the near field is affected not only by frequency but also by measurement environment such as position and height of the probe and height of shielding film. In conclusion, we should choose proper methods for SE measurement considering interference distance in the electronic control system because there is little correlation between the proposed evaluation method in the near field and ASTM D 4935-10.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.305-305
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• 2008

LTCC는 고주파영역에서 손실이 낮고 적층구조의 모듈제작이 가능하여 고주파용 모듈제작에 응용이 가능하다. 최근 수동소자가 내장된 ASM이나 FEM 등의 모듈은 그 집적도가 높고 기판의 두께가 감소함에 따라 소재의 고강도 특성이 요구되고 있다. 이와 같은 경향에 따라 Anorthite계 결정화 유리로 알려진 300MPa 이상의 고강도를 나타내는 CaO-Al2O3-SiO2계 소재가 선행 연구 과정을 통하여 개발되었다. 본 실험에서는 기 개발된 조성의 고강도 소재를 이용하여 RF부품에 적용하기 위한 테스트 쿠폰을 제작하였다. 고강도 소재를 이용하여 green sheet를 제조하고 수동소자인 R, L, C 등을 기판 내에 내장화 하기위해 LTCC 공정을 이용하여 각 층에 다양한 선폭 및 크기의 패턴을 인쇄한 뒤 적층하여 $900^{\circ}C$에서 소결하였다. 이 과정에서 공정에 대한 적용성이 각 공정별로 평가되었으며 완성된 테스트 쿠폰을 이용하여 소재의 전기적인 특성을 평가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.311-312
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• 2005

Applying a designed test coupon pattern for fabricating resistors various resistors were formed using PTF(polymer thick film) pastes. Aspect ratio from 0.25 to 4 were selected for fabricating resistors. Formed resistors were cured at $170^{\circ}C$ and $240^{\circ}C$. Electrical properties of fabricated resistors were measured and their values analyzed in relation to cure temperature and formed geometry via printing. Also effects of substrates used for fabricating resistors were observed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.212-213
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• 2006

Polymer thick film resistor paste was fabricated using various materials. Inorganic materials of carbon black and graphite were selected as fillers and epoxy resin was selected as organic material. Solvent with high boiling temperature was applied to adjust viscosity. A designed test coupon pattern was used to evaluate fabricated resistors. Aspect ratio of 1 was selected for evaluating resistor values. Electrical properties of fabricated resistors were measured and their values analyzed in relation to paste composition. PTF fabricated using carbon black as fillers achieved resistor value of $530{\Omega}/sq$.

• Smart Media Journal
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• v.5 no.2
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• pp.77-83
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• 2016

Today, the great revolution in all financial industrial such as bank have been progressing through the utilization of IT technology actively, it is called the fintech. In this paper, we draw the draft design of NFC-based electronic payment and coupon system using FIDO framework to apply the 2 factor authentication technique for strength security. In detailed, we will study that the terminal device in front-end will be applied the 2 factor authentication and electric signature, and cloud-based payment gateway in back-end will be applied malicious code detection technique of distributed avoidance type.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.12
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• pp.73-81
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• 2011

As high speed digital systems continue to use components with faster edge rate and clock speeds, transmission of the digital information, it can bring about many troubles. The increasing requirement for controlled impedance PCBs becomes both a critical success factor and a design challenge to implement a system. Especially, the noise sources in high frequency digital systems include the noise in power supply, ground and packaging, and they destroy the fidelity of signals. Therefore PCB design with impendence matching is needed to improve fidelity of signal in H/W. In this paper, we have developed an impedance control and analysis tool for multi-layer PCB design, and simulates the tracks controlled impedance with the test coupon. So, it can save the design time and support the economical PCB design.