• Title/Summary/Keyword: Electron cyclotron resonance

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Cyclotron Resonance of the Wannier-Landau Transition System Based on the Ensemble Projection Technique

  • Jung-Il Park
    • Journal of the Korean Magnetic Resonance Society
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    • v.27 no.4
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    • pp.28-34
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    • 2023
  • We study the linear-nonlinear quantum transport theory of Wannier-Landau transition system in the confinement of electrons by a square well confinement potential. We use the projected Liouville equation method with the ensemble density projection technique. We select the dynamic value under a linearly oscillatory external field. We derive the dynamic value formula and the memory factor functions in three electron phonon coupling systems and electron impurity coupling systems of two transition types, the intra-band transitions and inter-band transitions. We obtain results that can be applied directly to numerical analyses. For simple example of application, we analyze the absorption power and line-widths of ZnO, through the numerical calculation of the theoretical result in the Landau system.

Fabrication and Performance of Electron Cyclotron Resonance Ion Milling System for Etching of Magnetic Film Device (자성박막 소자 에칭용 전자 사이클로트론 공명 이온밀링 시스템 제작과 특성연구)

  • Lee, Won-Hyung;Hwang, Do-Guwn;Lee, Sang-Suk;Rhee, Jang-Roh
    • Journal of the Korean Magnetics Society
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    • v.25 no.5
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    • pp.149-155
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    • 2015
  • The ECR (Electron Cyclotron Resonance) Ar ion milling was manufactured to fabricate the device of thin film. The ECR ion milling system applied to the device etching operated by a power of 600W, a frequency of 2.45 GHz, and a wavelength of 12.24 cm and transferred by a designed waveguide. In order to match one resonant frequency, a magnetic field of 908 G was applied to a cavity inside of ECR. The Ar gas intruded into a cavity and created the discharged ion beam. The surface of target material was etched by the ion beam having an acceleration voltage of 1000 V. The formed devices with a width of $1{\mu}m{\sim}9{\mu}m$ on the GMR-SV (Giant magnetoresistance-spin valve) multilayer after three major processes such as photo lithography, ion milling, and electrode fabrication were observed by the optical microscope.

Electrical Properties of Interlayer Low Dielectric Polyimide with Electron Cyclotron Resonance Etching Process (ECR 식각 공정에 따른 층간절연막 폴리이미드의 전기적 특성)

  • 김상훈;안진호
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.3
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    • pp.13-17
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    • 2000
  • The electrical properties of polyimide for interlayer dielectric applications are investigated with ECR (Electron Cyclotron Resonance) etching process. ECR etching with $Cl_2$-based plasma, generally used for aluminum etching, results in an increase in the dielectric constant of polyimide, while $SF_{6}$ plasma exhibits a high polyimide etch rate and a reducing effect of the dielectric constant. The leakage current of the polyimide is significantly suppressed after plasma exposure. Combination of Al etching with $Cl_2$plasma and polyimide etching with $SF_{6}$ plasma is expected as a good tool for realizing the multilevel metallization structures.

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Manufacturing of Ultrahigh Vacuum Electron Cyclotron Resonance Chemical Vapor Deposition Reactor and Si Wafer Surface Cleaning by Hydrogen Plasma (초고진공 전자 사이클로트론 공명 화학 기상증착장치의 제작과 수소 플라즈마를 이용한 실리콘 기판 표면 세정화)

  • 황석희;태흥식;황기웅
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.4
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    • pp.63-69
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    • 1994
  • The Ultrahigh Vacuum Electron Cyclotron Resonance Chemical Vapor Deposition(UHV-ECRCVD) system whose base pressure is 1${\times}10^{9}$ torr has been constructed. In-situ cleaning prior to the epitaxial growth was carried out at 56$0^{\circ}C$ by ECR generated uniform hydrogen plasma whose density is $10^{10}/cm{3}$. The natural oxide was effectively removed without damage by applying positive DC bias(+10V) to the substrate. RHEED(Reflection High Energy Electron Diffraction) analysis has been used to confirm the removal of the surgace oxide and the streaky 2$\times$1 reconstruction of the Si surface, and the suppression of the substrate damage is anaylized by X-TEM(cross-sectional Transmission Electron Microscopy). Surface cleaning technique by ECR hydrogen plasma confirmed good quality epitaxial growth at low temperature.

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Electromagnetic Electron-Cyclotron Wave for Ring Distribution with Alternating Current (AC) Electric Field in Saturn Magnetosphere

  • Haridas, Annex Edappattu;Kanwar, Shefali;Pandey, Rama Shankar
    • Journal of Astronomy and Space Sciences
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    • v.39 no.2
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    • pp.35-42
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    • 2022
  • During their respective missions, the spacecraft Voyager and Cassini measured several Saturn magnetosphere parameters at different radial distances. As a result of information gathered throughout the journey, Voyager 1 discovered hot and cold electron distribution components, number density, and energy in the 6-18 Rs range. Observations made by Voyager of intensity fluctuations in the 20-30 keV range show electrons are situated in the resonance spectrum's high energy tail. Plasma waves in the magnetosphere can be used to locate Saturn's inner magnetosphere's plasma clusters, which are controlled by Saturn's spin. Electromagnetic electron cyclotron (EMEC) wave ring distribution function has been investigated. Kinetic and linear approaches have been used to study electromagnetic cyclotron (EMEC) wave propagation. EMEC waves' stability can be assessed by analyzing the dispersion relation's effect on the ring distribution function. The primary goal of this study is to determine the impact of the magnetosphere parameters which is observed by Cassini. The magnetosphere of Saturn has also been observed. When the plasma parameters are increased as the distribution index, the growth/damping rate increases until the magnetic field model affects the magnetic field at equator, as can be seen in the graphs. We discuss the outputs of our model in the context of measurements made in situ by the Cassini spacecraft.

A Study on the Law Temperature Plasma Etching using Electron Cyclotron Resonance (전자 공명을 이용한 저온 플라즈마 식각에 관한 연구)

  • Lee, Seok-Hyun;Kim, Jae-Sung;Whang, Ki-Woong;Kim, Won-Kyu
    • Proceedings of the KIEE Conference
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    • 1992.07b
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    • pp.850-853
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    • 1992
  • A cryogenic electron cyclotron resonance plasma etching system has been built to study wafer-temperature in the silicon etching characteristics. The wafer temperature was controlled from -150 to +30 $^{\circ}C$ during etching using the liquid nitrogen cooled helium gas. Although silicon was etched isotropically in $SF_6$ plasma at room temperatures, we found that it is possible to suppress the etch undercut in Si by reducing a substrate temperature without side wall passivation. In addition, the selectivity of silicon to photoresist was improved considerably at a low wafer temperature. Etch rates, anisotropy and selectivity to photo resist are measured as a function of the wafer temperature in the region of -125 $\sim$ 25$^{\circ}C$ and rf bias power of 20W $\sim$ 80W.

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Three-Dimensional Particle-in-cell Simulation of Electron Cyclotron Resonance Plasma with Belt-type Magnet Assembly

  • Lee, Hui Jea;Kim, Seong Bong;Yoo, Suk Jae;Cho, Moohyun;Namkung, Won
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.242.1-242.1
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    • 2014
  • The electron cyclotron resonance plasma source with a belt-type magnet assembly (BMA) is designed for effective plasma confinements. For characterizing the plasma source, the plasma parameters are measured by Langmuir probe. However, the plasma parameters and the motion of charged particles near the ECR zone are not easy to diagnostics, because of the high plasma density and temperature. Thus, as an alternative method, the electromagnetic simulation of the plasma source has been performed by using three-dimensional particle-in-cell and Monte Carlo collisional (PIC-MCC) simulation codes. For considering the limitation of simulation resources and time, the periodic boundary condition is applied and the coulomb collision is neglected. In this paper, we present the results of 3D PIC simulations of ECR plasmas with BMA and we compare them with the experimental results.

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The Effect of Substrate DC Bias on the Low -Temperature Si homoepitaxy in a Ultrahigh Vacuum Electron Cyclotron Resonance Chemical Vapor Deposition (초고진공 전자 사이클로트론 화학 기상 증착 장치에 의한 저온 실리콘 에피 성장에 기판 DC 바이어스가 미치는 영향)

  • 태흥식;황석희;박상준;윤의준;황기웅;송세안
    • Journal of the Korean Vacuum Society
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    • v.2 no.4
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    • pp.501-506
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    • 1993
  • The spatial potential distribution of electron cyclotron resonance plasma is measured as a function of tehsubstrate DC bias by Langmuir probe method. It is observed that the substrate DC bias changes the slope of the plasma potential near the subsrate, resulting in changes in flux and energy of the impinging ions across plasma $_strate boundary along themagnetric field. The effect of the substrate DC bias on the low-temperature silicon homoepitaxy (below $560^{\circ}C$) is examine dby in situ reflection high energy electron diffraction (RHEED), cross-section transmission electron microscopy (XTEM),plan-view TEM and high resolution transmision electron microscopy(HRTEM). While the polycrystalline silicon layers are grow withnegative substrate biases, the single crystaline silicon layers are grown with negative substrate biases, the singel crystalline silicon layers are grown with positive substrate biases. As the substrate bias changes form negative to positive values, the growth rate decreases. It is concluded that the control of the ion energy during plasma deposition is very important in silicon epitaxy at low temperatures below $560^{\circ}C$ by UHV-ECRCVD.VD.

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