• Title/Summary/Keyword: Electron backscatter diffraction (EBSD)

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Study of the Microstructural Evolution of Tempered Martensite Ferritic Steel T91 upon Ultrasonic Nanocrystalline Surface Modification

  • He, Yinsheng;Yang, Cheol-Woong;Lee, Je-Hyun;Shin, Keesam
    • Applied Microscopy
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    • v.45 no.3
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    • pp.170-176
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    • 2015
  • In this work, various electron microscopy and analysis techniques were used to investigate the microstructural evolution of a 9% Cr tempered martensite ferritic (TMF) steel T91 upon ultrasonic nanocrystalline surface modification (UNSM) treatment. The micro-dimpled surface was analyzed by scanning electron microscopy. The characteristics of plastic deformation and gradient microstructure of the UNSM treated specimens were clearly revealed by crystal orientation mapping of electron backscatter diffraction (EBSD), with flexible use of the inverse pole figure, image quality, and grain boundary misorientation images. Transmission electron microscope (TEM) observation of the specimens at different depths showed the formation of dislocations, dense dislocation walls, subgrains, and grains in the lower, middle, upper, and top layers of the treated specimens. Refinement of the $M_{23}C_6$ precipitates was also observed, the size and the number density of which were found to decrease as depth from the top surface decreased. The complex microstructure and microstructural evolution of the TMF steel samples upon the UNSM treatment were well-characterized by combined use of EBSD and TEM techniques.

Three-Dimensional Automated Crystal Orientation and Phase Mapping Analysis of Epitaxially Grown Thin Film Interfaces by Using Transmission Electron Microscopy

  • Kim, Chang-Yeon;Lee, Ji-Hyun;Yoo, Seung Jo;Lee, Seok-Hoon;Kim, Jin-Gyu
    • Applied Microscopy
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    • v.45 no.3
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    • pp.183-188
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    • 2015
  • Due to the miniaturization of semiconductor devices, their crystal structure on the nanoscale must be analyzed. However, scanning electron microscope-electron backscatter diffraction (EBSD) has a limitation of resolution in nanoscale and high-resolution electron microscopy (HREM) can be used to analyze restrictive local structural information. In this study, three-dimensional (3D) automated crystal orientation and phase mapping using transmission electron microscopy (TEM) (3D TEM-EBSD) was used to identify the crystal structure relationship between an epitaxially grown CdS interfacial layer and a $Cu(In_xGa_{x-1})Se_2$ (CIGS) solar cell layer. The 3D TEM-EBSD technique clearly defined the crystal orientation and phase of the epitaxially grown layers, making it useful for establishing the growth mechanism of functional nano-materials.

The Orientation Comparison of the Primary and Secondary Beads Grain by EBSD (EBSD를 이용한 1, 2차 용융흔 결정립의 방위 비교 분석)

  • Park, Kwang-Muk;Bang, Sun-Bae;Yang, Sung-Chae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.11
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    • pp.728-733
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    • 2017
  • Herein, for the quantitative analysis of the arc beads related to electric fire, we used electron backscatter diffraction (EBSD), a measuring device for grain orientation of materials, we compared and analyzed the surface texture of primary and secondary beads according to the difference in cooling rate at ambient temperature. This analysis revealed that the primary beads showed similar distribution at both low and high angles, while the secondary beads showed a higher distribution at low angles than at high angles. Thus, EBSD can be used for quantitative analysis of the beads and can be applied to identify beads in the future.

Analysis of Plastic Deformation Behavior according to Crystal Orientation of Electrodeposited Cu Film Using Electron Backscatter Diffraction and Crystal Plasticity Finite Element Method (전자 후방 산란 분석기술과 결정소성 유한요소법을 이용한 전해 도금 구리 박막의 결정 방위에 따른 소성 변형 거동 해석)

  • Hyun Park;Han-Kyun Shin;Jung-Han Kim;Hyo-Jong Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.2
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    • pp.36-44
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    • 2024
  • Copper electrodeposition technology is essential for producing copper films and interconnects in the microelectronics industries including semiconductor packaging, semiconductors and secondary battery, and there are extensive efforts to control the microstructure of these films and interconnects. In this study, we investigated the influence of crystallographic orientation on the local plastic deformation of copper films for secondary batteries deformed by uniaxial tensile load. Crystallographic orientation maps of two electrodeposited copper films with different textures were measured using an electron backscatter diffraction (EBSD) system and then used as initial conditions for crystal plasticity finite element analysis to predict the local plastic deformation behavior within the films during uniaxial tension deformation. Through these processes, the changes of the local plastic deformation behavior and texture of the films were traced according to the tensile strain, and the crystal orientations leading to the inhomogeneous plastic deformation were identified.

Sample Preparation for EBSD Analysis: Tips for Metals with Delicate Surfaces (표면처리가 어려운 금속재료의 EBSD 분석을 위한 시편 준비)

  • Kang, Joo-Hee;Kim, Su-Hyeon
    • Korean Journal of Metals and Materials
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    • v.48 no.8
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    • pp.730-740
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    • 2010
  • Aluminum, magnesium, titanium and high Mn steel are difficult to use in electron backscatter diffraction (EBSD) sample preparation due to the formation of an oxidation layer under conventional polishing. Alcohol-based polishing with colloidal silica suspension was introduced for these delicate samples. A hard particle-embedded sample was analyzed successfully using mechanical polishing. Ion-milling was effective in removing oxidized, deformed and transformed layers after mechanical polishing and was able to reduce artifacts significantly. The microstructure of a cross-section of a thin copper film was evaluated by attachment of a dummy to the film for mechanical polishing.

Domain Wall Motions in a Near-Morphotropic PZT during a Stepwise Poling Observed by Piezoresponse Force Microscopy

  • Kim, Kwanlae
    • Korean Journal of Materials Research
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    • v.27 no.9
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    • pp.484-488
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    • 2017
  • In the present study, domain evolution processes of a near-morphotropic PZT ceramic during poling was studied using vertical piezoresponse force microscopy (PFM). To perform macroscopic poling in bulk polycrystalline PZT, poling was carried out in a stepwise fashion, and PFM scan was performed after unloading the electric field. To identify the crystallographic orientation and planes for the observed non-$180^{\circ}$ domain walls in the PFM images, compatibility theory and electron backscatter diffraction (EBSD) were used in conjunction with PFM. Accurate registration between PFM and the EBSD image quality map was carried out by mapping several grains on the sample surface. A herringbone-like domain pattern consisting of two sets of lamellae was observed; this structure evolved into a single set of lamellae during the stepwise poling process. The mechanism underlying the observed domain evolution process was interpreted as showing that the growth of lamellae is determined by the potential energy associated with polarization and an externally applied electric field.

EBSD Microstructural Characterisation of Oxide Scale on Low Carbon Steel

  • Birosca, S.;De Cooman, B.C.
    • Corrosion Science and Technology
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    • v.7 no.3
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    • pp.182-186
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    • 2008
  • The microstructures of the oxide scale developed at high temperature on steels are very complex and their development depends on many factors including time, temperature, oxidation conditions and alloying elements. The classical model of an oxide scale on steel consisting of wüstite, magnetite and haematite layers, is more complicated in reality and its properties change with the factors that affect their development. An understanding of the oxide scale formation and its properties can only be achieved by careful examination of the scale microstructure. The oxide scale microstructure may be difficult to characterise by conventional techniques such as optical or standard scanning electron microscopy. An unambiguous characterisation of the scale and the correct identification of the phases within the scale are difficult unless the crystallographic structure for each phase in the scale is considered and a simultaneous microstructure-microtexture analysis is carried out. In the current study Electron Backscatter Diffraction (EBSD) has been used to investigate the microstructure of iron oxide layers grown on low carbon steels at different times and temperatures. EBSD has proved to be a powerful technique for identifying the individual phases in the oxide scale accurately. The results show that different grain shapes and sizes develop for each phase in the scale depending on time and temperature.

Effect of Manganese on the Microstructure of Cemented Carbides

  • Weidow, Jonathan;Norgren, Susanne;Elfwing, Mattias;Andren, Hans-Olof
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.348-349
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    • 2006
  • The plastic deformation behavior of cemented carbides is related to the WC grain boundary strength. Ab initio calculations predict that Co and Mn segregate to WC/WC grain boundaries. To experimentally study the effect of Mn, a WC-Co-Mn material was manufactured and compared to a WC-Co material. The microstructure was studied using scanning electron microscopy (SEM), including electron backscatter diffraction (EBSD). Special attention was paid to the WC grain size and the frequency of special low-energy grain boundaries. Mn was found to have negligible effect on both the WC grain growth and the fraction of $\sum2$ WC/WC boundaries in the as-sintered material.

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Texture Evolution of Extruded AZ80 Mg Alloy under Various Compressive Forming Conditions (AZ80 마그네슘 합금 압출재의 압축 성형조건에 따른 방위특성 분석)

  • Yoon, J.H.;Lee, S.I.;Lee, J.H.;Park, S.H.;Cho, J.H.
    • Transactions of Materials Processing
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    • v.21 no.4
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    • pp.240-245
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    • 2012
  • With the increasing demand for light-weight materials to reduce fuel consumption, the automobile industry has extensively studied magnesium alloys which are light weight metals. The intrinsic poor formability and poor ductility at ambient temperature due to the hexagonal close-packed (HCP) crystal structure and the associated insufficient number of independent slip systems restricts the practical usage of these alloys. Hot working of magnesium alloys using a forging or extrusion enables net-shape manufacturing with enhanced formability and ductility since there are several operative non-basal slip systems in addition to basal slip plane, which increases the workability. In this research, the thermomechanical properties of AZ80 Mg alloy were obtained by compression testing at the various temperatures and strain rates. Optical microscopy and EBSD were used to study the microstructural behavior such as misorientation distribution and dynamic recrystallization. The results were correlated to the hardening and the softening of the alloy. The experimental data in conjunction with a physical explanation provide the optimal conditions for net-shape forging under hot or warm temperatures through control of the grain refinement and the working conditions.

Influence of hot deformation and composition on microstructure development of magnesium-stannide alloys

  • Pandel, Divija;Banerjee, Malay K.
    • Advances in materials Research
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    • v.9 no.3
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    • pp.171-187
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    • 2020
  • The microstructural evolution of different compositions of Mg-Sn alloys (30%Sn-70%Mg, 40%Sn-60%Mg and 50%Sn-50%Mg) is studied at first to understand the changes observed with change in tin content and deformation conditions. The Mg2Sn phase increases with increase in tin content and a significant substructure development is found in 50%Sn-50%Mg alloy. The above observation led to further deformation studies on Mg2Sn based thermoelectric materials with higher tin percentage. The microstructure in terms of Electron backscatter diffraction (EBSD)measurements is studied in detail followed by the determination of thermoelectric properties i.e., Seebeck coefficient and electrical conductivity for both as cast and extruded Mg(2+x)Sn-Ag alloys. The electrical conductivity of the extruded Mg(2+x)Sn-.3wt%Ag {x =1} alloy was found to be more than its as cast counterpart while the Seebeck coefficient values remained almost the same.