• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.953-955
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• 2006

In this work we compared different sources of composition of Ag powders obtained by dry and wet process on the photolithographic patterning of PDP electrode and resistance of sintered Ag electrode. It was found that 90 : 10 wt% ratio of Ag powder made by dry and wet processes gave optimum result both on the PDP electrode pattern and resistance of PDP electrode after sintering.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.121-121
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• 2018

Copper is a promising electronic material due to low cost and high electrical conductivity. However, the oxidation problem in an ambient condition makes a crucial issue in practical applications. In here, we developed a simple and cost-effective Cu patterning method on a flexible PET film by combining a solution processable Cu nanoparticle patterning and a low temperature post-processing using acetic acid treatment, laser sintering process and acid-assisted laser sintering process. Acid-assisted laser sintering processed Cu electrode showed superior characteristics in electrical, mechanical and chemical stability over other post-processing methods. Finally, the Cu electrode was applied to the flexible electronics applications such as flexible and transparent heaters and touch screen panels.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.381-384
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• 2003

Photosensitive electordes(Ag and Black) are widely used in the patterning of both address and bus electrodes on the rear and front panel of plasma display panel (PDP). As the need for high resolution(>XGA) and large area(>60 inches) PDP is increased, basic understanding of each component of formulation on the photolithographic process of patterning electrodes are required in order to increase the yield in the production of PDP. In this work, the materials and amount of necessary components of photosensitive electrode paste and their effect on the photolithographic process of patterning electrodes were studied.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.2
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• pp.133-136
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• 2010

Laser direct patterning is one of new methods which are able to replace a conventional photolithography. In order reduce the fabrication cost and to improve the luminous efficiency of AC plasma display panels (PDPs), in this experiment, a Q-switched Nd:$YVO_4$ laser was used to fabricate T-shaped indium tin oxide (ITO) display electrodes. For the laser beam scanning speed from 100 mm/sec to 800 mm/sec, T-shaped ITO patterns were clearly obtained and investigated. The experimental results showed that the optimized T-shaped ITO electrode was obtained when the lasers scanning speed was 300 mm/s.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.2
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• pp.93-99
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• 2006

In this paper, we fabricated and evaluated polydimethylsiloxane(PDMS)-based flexible and implantable micro electrodes. The electrode patterning was carried out with the photolithography and chemical etching process after e-beam evaporation of 100 ATi and 1000 A Au. The PDMS substrate was treated by oxygen plasma using reactive ion etching(RIE) system to improve the adhesiveness of PDMS and metal layers. The minimum line width of fabricated micro electrode was 20 $\mu$m. After finished patterning, we did packaging with PDMS and then brought up the electrode's part about 40 $\mu$m with gold electroplating. The Hank's balanced salt solution(HBSS) test was carried out for 6 month for endurance of fabricated micro electrode. We carried out in-vivo test for the evaluation of biocompatibility by implanting electrodes under the ICR mouse skin for 42 days.

• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.423-429
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• 2005

In this paper, we proposed the fabrication process of the stable e-beam evaporation and the patterning of metals layer on the polydimethylsiloxane (PDMS) substrate. The metal layer was deposited under the various deposition rate, and its effect to the electrical and mechanical properties (e.g.: adhesion-strength of metal layer) was investigated. The influence of surface roughness to the adhesion-strength was also examined via the tape test. Here, we varied the roughness by changing the reactive ion etching (RIE) duration. The electrode patterning was performed through the conventional photolithography and chemical etching process after e-beam deposition of $200{\AA}$ Ti and $1000{\AA}$ Au. As a result, the adhesion strength of metal layer on the PDMS surface was greatly improved by the oxygen plasma treatment. The e-beam evaporation on the PDMS surface is known to create the wavy topography. Here, we found that such wavy patterns do not effect to the electrical and mechanical properties. In conclusion, the metal patterns with minimum $20{\mu}m$ line width was produced well via the our fabrication process, and its electrical conductance was almost similar to the that of metal patterns on the silicon or glass substrates.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.160-160
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• 2003

This paper describes some of the key issues associated with the patterning of metal electrodes of sub-micron (especially at the critical dimension (CD) of 0.15 $\mu\textrm{m}$) dynamic random access memory (DRAM) devices. Due to reactive ion etching (RIE) lag, the Pt etch rate decreased drastically below the CD of 0.20 $\mu\textrm{m}$ and thus the storage node electrode with the CD of 0.15 $\mu\textrm{m}$ could not be fabricated using the Pt electrodes. Accordingly, we have proposed novel techniques to surmount the above difficulties. The Ru electrode for the stack-type structure is introduced and alternative schemes based on the introduction of the concave-type structure using Pt or Ru as an electrode material are outlined.

• Journal of the Korean Ceramic Society
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• v.40 no.2
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• pp.153-158
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• 2003

Self-patterning of thin films using photosensitive sol solution has advantages such as simple manufacturing process compared to photoresist/dry etching process. In this study,$La_{0.5}SR_{0.5}CoO_3$(LSCO) thin films as an electrode material for ferroelectric memories have been prepared by spin coating method using photosensitive sol solution. La-2methoxyethoxide, Sr-ethoxide, Co-2methoxyethoxide were used as starting materials. As UV exposure time to the LSCO gel thin film increased, the UV absorption peak intensity of metal${beta}$-diketonate decreased due to reduced solubility by M(metal)-O-M bond formation. Solubility difference by UV irradiation on LSCO gel thin film allows to obtain a fine patterning of thin film. The LSCO thin films annealed over$680{\circ}C$ in air showed perovskite phase and the lowest resistivity$(4{ imes}10^{-3}{Omega}cm)$ of the thin films were obtained by annealing at$740{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.6
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• pp.122-128
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• 2016

The Biosensor biosensor pattern was developed by via an EHD (electro-hydro-dynamics (EHD) patterning process that was performed under atmospheric pressure at room temperature in a single step. The drop diameter was smaller than nozzle diameter and applied high viscosity conductive ink was applied in the EHD patterning method to provide a clear advantage over the piezo and thermal inkjet printing techniques. The Biosensor's biosensor's micro electrode pattern was printed by via a continuous EHD patterning method using 3three- type types of control parameters parameter (input voltage, patterning speed, nozzle pressure). High viscosity (1000 cps) conductive ink with 75 wt% of silver nanoparticles was used for experimentation. The incremental result of impedance of biosensor impedance was measured between the antibody ($10ug{\mu}g/ml$) to spore (0.1 ng/ml, 10 ng/ml, and $1ug{\mu}g./ml$) reaction at frequency 493 MHz frequency.

• Journal of Information Display
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• v.10 no.3
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• pp.111-116
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• 2009

In this paper, a plasma-assisted patterning method for the organic layers of organic light-emitting diodes (OLEDs) and its effect on the OLED performances are reported. Oxygen plasma was used to etch the organic layers, using the top electrode consisting of lithium fluoride and aluminum as an etching mask. Although the current flow at low voltages increased for the etched OLEDs, there was no significant degradation of the OLED efficiency and lifetime in comparison with the conventional OLEDs. Therefore, this method can be used to reduce the ohmic voltage drop along the common top electrodes by connecting the top electrode with highly conductive bus lines after the common organic layers on the bus lines are etched by plasma. To further analyze the current increase at low voltages, the plasma patterning effect on the OLED performance was investigated by changing the device sizes, especially in one direction, and by changing the etching depth in the vertical direction of the device. It was found that the current flow increase at low voltages was not proportional to the device sizes, indicating that the current flow increase does not come from the leakage current along the etched sides. In the etching depth experiment, the current flow at low voltages did not increase when the etching process was stopped in the middle of the hole transport layer. This means that the current flow increase at low voltages is closely related to the modification of the hole injection layer, and thus, to the modification of the interface between the hole injection layer and the bottom electrode.