• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.123.1-123.1
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• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• 청정기술
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• 제20권2호
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• pp.136-140
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• 2014

본 연구에서 폴리프로필렌을 모재로 사용하여 Co/Ni/P/Mn 4가지 금속을 무전해도금 방법으로 코팅하였다. 이 때 도금욕의 시약의 양을 조절함으로써 폴리프로필렌 위에 도금된 금속의 조성을 다르게 조정하였다. 이러한 조건으로 만들어진 도금 금속에 대하여 두께, 전기적 표면 저항, 주사형 전자현미경을 사용한 표면상태, 에너지 분산형 분석기를 통한 금속조성을 측정하였다. 인 함량이 높을수록 전지저항이 커지는 것이 관찰되어 인 함량과 전지전도성간의 상관성이 있는 것이 관찰되었다. 또한 코팅 금속의 수용액에서의 부식성을 3.5 wt% 염화나트륨 용액과 5.0 wt% 황산용액에서 비교한 결과 인을 많이 포함할수록 내식성이 강함을 알 수 있었다.

• 한국표면공학회지
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• 제29권5호
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• pp.545-548
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• 1996

$CrN_x$ films were deposited on SKD61 and S45C by cathodic arc ion plating process. In this study, the microstructure, microhardness, a hesion, wear and corrosion properties of the CrNx films were studied for various nitrogen partial pressures and the results were compared with those from the electroplated hard Cr. The crystal structure of the films was characterized by X-ray diffraction. Wear tests were performed under no lubricant condition at atmosphere by ball-on-disc type tribotester. Corrosion resistance of the films were studied by electrochemical corrosion test, measuring current demsity-potential curves. The results indicated that the $CrN_x$ films formed using ion plation method showed higer hardness and lower current density, friction coefficient than electroplated hard Cr. Consequently, the application of the CrNx coationgs by ion plating which is free of environmental pollution, is expected to improve lifetime of components in industrial practice.

• 한국표면공학회지
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• 제46권4호
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.

• Journal of Electrochemical Science and Technology
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• 제11권2호
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• pp.180-186
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• 2020

In this work, a metal-ligand solution (Cu-EDTA) was prepared based on the molecular precursor method and the solution was spin-coated onto 3D printed flexible photosensitive resin sheets. After being processed by microwave, a laser with a wavelength of 355 nm was utilized to scan the spin-coated sheets and then the sheets were immersed in an electroless copper plating solution to deposit copper wires. With the help of microwave processing, the adhesion between copper wires and substrate was improved which should result from the increase of roughness, decrease of contact angle and the consistent orientation of coated film according to the results of 3D profilometer and SEM. XPS results showed that copper seeds formed after laser scanning. Using the 3D printed flexible sheets as cathode and galvanized iron as anode, electrochemical machining was conducted.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2005년도 추계학술발표회 및 workshop
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• pp.138-138
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• 2005

• 전기화학회지
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• 제10권2호
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• pp.88-93
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• 2007

Nano-sized Sn particles were coated with Ni-P layer using an electroless deposition method and their anodic performance was tested for lithium secondary batteries. Uniform coating layers were obtained, of which the thickness was controlled by varying the $Ni^{2+}$ concentration in the plating bath. It was found that the Ni-P layer plays two important roles in improving the anodic performance of Sn powder electrode. First, it prevents the inter-particle aggregation between Sn particles during the charge/discharge process. Second, it provides an electrical conduction pathway to the Sn particles, which allows an electrode fabrication without an addition of conductive carbon. A pseudo-optimized sample showed a good cyclability and high capacity ($>400mAh\;g^{-1}$) even without conductive carbon loading.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.943-946
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• 1997

Electropolishing is the controlled electrochemical removal of surface metal, resultmg in a brilliant appearance andimproved properties. Sometimes described as "reverse plating," the process has a leveling effect, which produces smoothnessand increased reflectivity. Unlike conventional mechanical finishing systems, the electropolishing does not smear, bend,stress or fracture the crystalline metal surface to achieve smoothness. Instead, electropolishing removes metal from thesurface producing a unidirectional pattern that is stress-free, microscopically smooth and often highly reflective. In addition,improved corrosion resistance and passivity are achieved on many ferrous and some non-ferrous alloys. Pure aluminium doesnot electropolish well, if at all, but most other alloys of aluminum electropolish excellently.Therefore, the aim of this study is to determine the characteristics of electropolishing aluminium alloy in term of currentdensity, machining time, temperature, electrode gap and workpiece surface measurementkpiece surface measurement

• Journal of Electrochemical Science and Technology
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• 제8권2호
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• pp.146-154
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• 2017

In this study, copper (II) oxide was prepared for use in a copper electroplating solution. Copper chloride powder and copper (II) oxide are widely used as raw materials for electroplating. Copper (II) oxide was synthesized in this study using a two-step chemical reaction. Herein, we developed a method for the preparation of copper (II) oxide without the use of sintering. In the first step, copper carbonate was prepared without sintering, and then copper (II) oxide was synthesized without sintering using sodium hydroxide. The optimum amount of sodium hydroxide used for this process was 120 g and the optimum reaction temperature was $120^{\circ}C$ regardless of the starting material.

• Macromolecular Research
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• 제12권5호
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• pp.431-436
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• 2004

Cross-linked network solid polymer electrolytes were prepared by means of in situ hydrosilylation between poly[hydromethylslioxane-g-oligo(ethylene oxide)] and diallyl or triallyl group-containing poly(ethylene glycols). The conductivities of the resulting polymer electrolytes were greatly enhanced upon the addition of poly(ethylene glycol) dimethyl ether (PEGDME) as an ion-conducting plasticizer. Conductivities of the cross-linked polymer electrolytes were more dependent on the molecular weight of PEGDME than on the cross-linkers. The maximum conductivity was found to be 5.6${\times}$10$\^$-4/ S/cm at 30$^{\circ}C$ for the sample containing 75 wt% of PEGDME (M$\_$n/ =400). These electrolytes exhibited electrochemical stability up to 4.5 V against the lithium reference electrode. We observed reversible electrochemical plating/stripping of lithium on the nickel electrode.