Journal of Electrochemical Science and Technology

The Korean Electrochemical Society (한국전기화학회)
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Non-sintering Preparation of Copper (II) Oxide Powder for Electroplating via 2-step Chemical Reaction

  • Lee, Seung Bum (Department of Chemical Engineering, Dankook University) ;
  • Jung, Rae Yoon (Department of Chemical Engineering, Dankook University) ;
  • Kim, Sunhoe (Department of New Energy & Resource Engineering, Sangji University)
  • Received : 2017.02.01
  • Accepted : 2017.04.03
  • Published : 2017.06.30
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Abstract

In this study, copper (II) oxide was prepared for use in a copper electroplating solution. Copper chloride powder and copper (II) oxide are widely used as raw materials for electroplating. Copper (II) oxide was synthesized in this study using a two-step chemical reaction. Herein, we developed a method for the preparation of copper (II) oxide without the use of sintering. In the first step, copper carbonate was prepared without sintering, and then copper (II) oxide was synthesized without sintering using sodium hydroxide. The optimum amount of sodium hydroxide used for this process was 120 g and the optimum reaction temperature was $120^{\circ}C$ regardless of the starting material.

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References

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