• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.125-126
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• 2005

Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.

• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2002년도 연료전지심포지움 2002논문집
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• pp.93-98
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• 2002

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.301-301
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• 2014

• 센서학회지
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• 제24권1호
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• pp.29-34
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• 2015

This study aimed to evaluate the characterization of a metal oxide semiconductor and electrochemical gas sensor array for measuring wastewater odor. The sensitivity of all gas sensors observed in sampling method by stripping was 6.7 to 20.6 times higher than that by no stripping, except sensor D (electrochemical gas sensor). The average reduction ratio of sensor signal as a function of initial dilution rate of wastewater was in the order of food plant > food waste reutilization facility > plating plant. The sensitivity of gas sensors was dependent on both the type of wastewater and the dilution rate. The sensor signals observed by the gas sensor array were correlated with the dilution factor (OU) calculated by the air dilution sensory test with several wastewater ($r^2=0.920{\sim}0.997$), except the sensor signals of sensor D measured in the plating plant wastewater. It seems likely that the gas sensor array plays a role in the evaluation of odor in wastewater and is useful tool for on-site odor monitoring in the wastewater facilities.

• International Journal of Precision Engineering and Manufacturing
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• 제9권2호
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• pp.75-80
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• 2008

The fabrication of complex three-dimensional electrodes for micro electrical discharge machining (micro-EDM) is an important issue in the field of micromachining Localized electrochemical deposition (LECD) is a simple and inexpensive technique for fabricating micro-EDM electrodes. This study presents a new process for manufacturing electrodes with complex cross-sections using masks of different shapes, In this process, a non-conductive mask is placed between an anode and cathode that are immersed in a plating solution of acidified copper sulfate. The LECD is achieved by applying a pulsed voltage between the anode and cathode, which are separated by a small distance. In this setup, the cathode is placed above the anode and the mask, so that the deposited electrode can be used directly for EDM without changing the tool orientation. We found that the microstructure of the deposited electrode is influenced by the concentration of the plating solution and organic additives. Moreover, the values of the voltage, frequency, and duty cycle of the pulsed input have significant effects on the microstructure of the fabricated electrode. Finally, the optimum values of the voltage, frequency, and duty cycle were determined for the most effective fabrication of complex-shaped electrodes.

• 대한금속재료학회지
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• 제50권5호
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• pp.395-400
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• 2012

In this study, we have investigated the surface morphology of hydroxyapatite (HA) coated Ti alloy surface using pulsed laser plating. The HA (tooth ash) films were grown by pulsed KrF excimer laser, film surfaces were analyzed for topology, chemical composition, crystal structure and electrochemical behavior. The Ti-6Al-4V alloy showed ${\alpha}$ and ${\beta}$ phase, Cp-Ti showed ${\alpha}$ phase and the HA coated surface showed HA and Ti alloy peaks. The HA coating layer was formed with $1-2{\mu}m$ droplets and grain-like particles, particles which were smaller than the HA target particle, and the composition of the HA coatings were composed of Ca and P. From the electrochemical test, the pitting potential (1580 mV) of HA coated Ti-6Al-4V alloy was higher than those of Cp-Ti (1060 mV) and HA coated Cp-Ti (1350 mV). The HA coated samples showed a lower current density than non-HA coated samples, whereas, the polarization resistance of HA coated samples showed a high value compared to non-HA coated samples.

• 수산해양기술연구
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• 제39권3호
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• pp.211-217
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• 2003

해양환경의 비저항 변화에 따른 모재, Ni도금 및 Cr도금의 분극저항, 부식전류밀도, 부식억제율 및 분극지배기구에 관하여 연구한 결과 다음과 같은 결론을 얻었다. 1) Cr도금 및 Ni도금의 분극저항은 모재의 분극저항보다 더 높게 나타나고, 이들 재료의 분극저항은 비저항이 감소함에 따라 낮아진다. 2) 비저항이 낮아질수록 Cr도금 및 Ni도금의 부식전류밀도는 모재의 부식전류보다 더 억제됨에 따라 Ni 및 Cr도금의 부식억제율은 더 높게 된다. 3) 해양환경의 비정항에 따른 모재, Ni도금 및 Cr 도금의 부식반응은 음극지배로 판단된다.(이 논문의 결론부분임)

• 한국표면공학회지
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• 제36권2호
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• pp.168-175
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• 2003

The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.

• Bulletin of the Korean Chemical Society
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• 제34권5호
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• pp.1462-1466
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• 2013

We demonstrate that ruthenium oxide ($RuO_2$) nanotubes with controlled dimensions can be synthesized using facile electrochemical means and anodic aluminum oxide (AAO) templates. $RuO_2$ nanotubes were formed using a cyclic voltammetric deposition technique and an aqueous plating solution composed of $RuCl_3$. Linear sweep voltammetry (LSV) was used to determine the effective electrochemical oxidation potential of $Ru^{3+}$ to $RuO_2$. The length and wall thickness of $RuO_2$ nanotubes can be adjusted by varying the range and cycles of the electrochemical cyclic voltammetric potentials. Thick-walled $RuO_2$ nanotubes were obtained using a wide electrochemical potential range (-0.2~1 V). In contrast, an electrochemical deposition potential range from 0.8 to 1 V produced thin-walled and longer $RuO_2$ nanotubes in an identical number of cycles. The dependence of wall thickness and length of $RuO_2$ nanotubes on the range of cyclic voltammetric electrochemical potentials was attributed to the distinct ionic diffusion times. This significantly improves the ratio of surface area to mass of materials synthesized using AAO templates. Furthermore, this study is directive to the controlled synthesis of other metal oxide nanotubes using a similar strategy.

• 한국표면공학회지
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• 제37권3호
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• pp.179-184
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• 2004

Hard chromium coating technology using hexavalent chromium bath is widely used in various industries. Because of the serious health and environmental problems of hexavalent chromium, many attempts to alternate the hexavalent chromium plating have been made over 50 years. Trivalent chromium plating is one of the challengeable technologies to alternate hexavalent chromium plating. It is relatively none-toxic. Although some papers have described hard chromium coatings produced from trivalent chromium solution, it has limited the industrialization because of chemical and electrochemical problems of trivalent chromium ions. This paper introduces a number of factors for successful trivalent chromium plating, to give a some information about trivalent chromium process.