• Carbon letters
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• 제10권3호
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• pp.213-216
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• 2009

The electrochemical deposition of Pt nanoparticles on carbon nanotubes (CNTs) supports and their catalytic activities for methanol electro-oxidation were investigated. Pt catalysts of 4~12 nm average crystalline size were grown on supports by potential cycling methods. Electro-plating of 12 min time by potential cycling method was sufficient to obtain small crystalline size 4.5 nm particles, showing a good electrochemical activity. The catalysts' loading contents were enhanced by increasing the deposition time. The crystalline sizes and morphology of the Pt/support catalysts were evaluated using X-ray Diffraction (XRD) and Transmission Electron Microscopy (TEM). The electrochemical behaviors of the Pt/support catalysts were investigated according to their characteristic current-potential curves in a methanol solution. In the result, the electrochemical activity increased with increased plating time, reaching the maximum at 12 min, and then decreased. The enhanced electroactivity for catalysts was correlated to the crystalline size and dispersion state of the catalysts.

• 전기화학회지
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• 제3권4호
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• pp.196-199
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• 2000

무전해 도금은 내식성, 내구성, 전도성 특별히 비전도성 물질의 도금이 요구되는 모든 재료에 폭 넓게 사용되는 우수한 표면 처리 방법이다. 무전해 니켈 도금은 비자성, 무정형 구조,내구성, 내식성 그리고 열정 안정성 등의 많은 장점을 갖는다. 본 연구에서는 무전해 니켈 도금의 열처리에 따른 무전해 니켈-인 도금의 경도와 내식성의 변화를 연구하였다. 가장 높은 경도 값은 $500^{\circ}C$열처리에서 얻어졌다. $300^{\circ}C$에서 열처리한 도금의 내식성이 60시간 동안 1몰의 황산 수용액에서 테스트 한 결과 가장 우수하였다.

• Korean Chemical Engineering Research
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• 제53권6호
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• pp.814-817
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• 2015

A new ionic mass transfer correlation is derived for the fluid-saturated, horizontal porous layer. Darcy-Forchheimer model is used to explain characteristics of fluid motion. Based on the microscales of turbulence a backbone mass transfer relation is derived as a function of the Darcy-Rayleigh number, $Ra_D$ and the porous medium Schmidt number, $Sc_p$. For the Darcy's limit of $Sc_p{\gg}Ra_D$, the Sherwood number, Sh is a function of $Ra_D$ only. However, for the region of high $Ra_D$, Sh can be related with $Ra_DSc_p$. Based on the present backbone equation and the electrochemical mass transfer experiments which are electro plating or electroless plating, the new ionic mass transfer correlation is suggested in the porous media.

• Journal of Electrochemical Science and Technology
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• 제7권3호
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• pp.241-244
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• 2016

Anodic stripping voltammetry (ASV) is successfully applied in mM level detection of mercury ion in an electroplating bath which is currently used in preparing a cathodic electrolyzer. Glassy carbon electrode is used for the detection and the optimum condition obtained is 10 s deposition at −1.4 V vs. Ag/AgCl and stripping by scanning from −1.4 to +0.4 V vs Ag/AgCl at 50 mV/s. By applying the method, the mercury ion concentration in the electroplating bath could be successfully monitored during the plating.

• Corrosion Science and Technology
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• 제18권5호
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• pp.190-195
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• 2019

SA508 low-alloy steel for a reactor vessel was exposed to primary water in a pressurized water reactor (PWR) plant because the cladding layer of type 309 stainless steel for the RPV was removed, due to an accident in which the detachment of the thermal sleeve occurred. The major advantage of the electrochemical deposition (ECD) Ni plating technique is that the reactor pressure vessel can be repaired without significant thermal effects, and Ni has solid corrosion resistance that can withstand boric acid. The corrosion rate assessment of the damaged part was performed, and its trend was analyzed. Essential variables of the Ni plating for repair of the damaged part were derived. These conditions are applicable variables for the repair plating device, and have been carefully adjusted using the repair plating device. The process for establishing ASME technical standards called Code Case N-840 is described. The process of developing Ni-plating devices, and the electroplating procedure specification (EPS) are described.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.252-255
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• 2004

반도체는 high integrated, high speed, low power를 위하여 design 뿐만 아니라 재료 측면에서도 많은 변화를 가져오고 있으며, RC delay time을 줄이기 위하여 Al 배선보다 비저항이 낮은 Cu와 low-k material 적용이 그 대표적인 예이다. 그러나, Cu 배선의 경우 dry etching이 어려우므로, 기존의 공정으로는 그 한계를 가지므로 damascene 또는 dual damascene 공정이 소개, 적용되고 있다. Damascene 공정은 절연막에 photo와 RIE 공정을 이용하여 trench를 형성시킨 후 electrochemical plating 공정을 이용하여 trench에 Cu를 filling 시킨다. 이후 CMP 공정을 이용하여 절연막 위의 Cu와 barrier material을 제거함으로서 Cu 배선을 형성하게 된다. Dual damascene 공정은 trench와 via를 동시에 형성시키는 기술로 현재 대부분의 Cu 배선 공정에 적용되고 있다. Cu CMP는 기존의 metal CMP와 마찬가지로 oxidizer를 이용한 Cu film의 화학반응과 연마 입자의 기계가공이 기본 메커니즘이다. Cu CMP에서 backside pressure 영향이 uniformity에 미치는 영향을 살펴보았으며, electrochemical plating 공정에서 발생하는 hump가 CMP 결과에 미치는 영향과 dishing 결과를 통하여 그 영향을 평가하였다.

• Membrane and Water Treatment
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• 제11권3호
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• pp.217-222
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• 2020

An electrochemical oxidation process was applied to remove cyanide (CN^-) from real plating wastewater. CN^- removal efficiencies were investigated under various operating factors: current density and electrolyte concentration. Electrolyte concentration positively affected the removal of both CN^- and Chemical Oxygen Demand (COD). As the electrolyte concentration increased from 302 to 2,077 mg Cl^-/L, removal efficiency of CN^- and COD increased from 49.07% to 98.30% and from 23.53% to 49.50%, respectively, at 10 mA/㎠. Current density affected the removal efficiency in a different way. As current density increased at a fixed electrolyte concentration, CN^- removal efficiency increased while COD removal efficiency decreased, this is probably due to lowered current efficiency caused by water electrolysis.

• Journal of Electrochemical Science and Technology
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• 제7권2호
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• pp.132-138
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• 2016

In this study, we report the fabrication of functional complex fibers, which have been studied widely globally for numerous applications. Here, we fabricated conductive complex fibers with antibacterial properties by coating metal ions on the surface of plastic (polypropylene) fibers using the electroless and electrochemical deposition. First, we polished the polypropylene melt-blown fiber surface and obtained an absorbing Pd seed layer on its surface. Subsequently, we substituted the Pd with Cu. Bis-3-sulfopropyl-disulfide disodium salt (SPS), polyethylene glycol (PEG), and ethylene thiourea (ETU) were used as the brightener, carrier, and leveler, respectively for the electroplating. We focused on most achieving the stable plating condition to remove dendrites, which are normally during electroplating metals so that smooth layer is formed on the fiber surface. The higher the amount of SPS, the higher was the extent of irregular plate-like growth. Many irregularities in the form of round spheres were observed with increase in the amount of PEG and ETU. Hence, when the additives were used separately, a uniform coating could not be obtained. A stable coating was obtained when the three additives were combined and a uniform 5-9 μm thick copper layer with a stable morphology could be obtained around the fiber. We believe that our results can be applied widely to obtain conductive fibers with antibacterial properties and are useful in aiding research on conductive lightweight composite fibers for application in information technology and robotics.

• Corrosion Science and Technology
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• 제23권1호
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• pp.64-71
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• 2024

The objective of this study was to investigate corrosion and cavitation-erosion characteristics of the electroless nickel plating layer with heat treatment. The crystallization temperature of the electroless nickel plating layer was about 410 ℃. The phase transformation energy was confirmed to be 12.66 J/g. With increasing heat treatment temperature, the amorphous electroless nickel plating layer gradually changed to crystalline Ni and Ni₃P. At the same time, the crystal grain size was also increased. Additionally, when heat treatment was performed at a temperature above 400 ℃, NiO phase was observed due to oxidation phenomenon. As a result of the electrochemical polarization experiment, the corrosion resistance of the heat-treated electroless nickel plating layers was superior to that of the as-deposited plating layer. This was because crystal grains became larger and grain boundaries decreased during heat treatment. The cavitation-erosion resistance of heat-treated plating layers tended to be superior to that of as-deposited plating layers due to increased microhardness.

• 전기화학회지
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• 제2권3호
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• pp.138-143
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• 1999

최근 large scale integrated circuits(LSI) 및 printed circuit board(PCB)의 세밀화가 전자기기의 소형화로 인하여 필수 불가결하게 되었다. 전해 도금은 LSI및 PCB의 전도도 및 부식저항을 향상시키기 위해서 전도성 라인의 말단에 적용되고 있다. 그러나 회로 기판의 소형화 및 고직접화로 인하여 적용되지 못하고 있다. 따라서 최근 무전해 도금은 복잡한 장치와 외부에서 전원을 필요치 않는 작동의 간편함 때문에 매우 각광 받고 있는 방법 중의 하나이다. 본 연구는 무전해 니켈/금도금의 도금 기술 개발을 위해 시험하였다. 무전해 니켈 도금은 $85^{\circ}C$의 도금 욕에서 PCB기판 위에 침적 시켰고 그 다음 금층은 동일한 방법으로 $90^{\circ}C$에서 니켈 층위에 침적 시켰다. Bonderbility는 무전해 니켈/금도금의 안정성을 평가하기 위해 gold wire 또는 solder ball 테스트로 실험하였다.