• Journal of Electrochemical Science and Technology
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• v.11 no.1
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• pp.60-67
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• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

• Nano
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• v.13 no.11
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• pp.1850134.1-1850134.10
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• 2018

Increasing active sites and enhancing electric conductivity are critical factors to improve sensing performance toward phenol. Herein, Ni nanoparticle was successfully anchored on acidified multiwalled carbon nanotube (a-MWCNT) surface by electroless plating technique to avoid Ni nanoparticle agglomeration and guarantee high conductivity. The crystal structure, phase composition and surface morphology were characterized by XRD, SEM and TEM measurement. The as-prepared Ni/a-MWCNT nanohybrid was immobilized onto glassy carbon electrode (GCE) surface for constructing phenol sensor. The phenol sensing performance indicated that Ni/a-MWCNT/GCE exhibited an amazing detection performance with rapid response time of 4 s, a relatively wide detection range from 0.01 mM to 0.48 mM, a detection limit of $7.07{\mu}M$ and high sensitivity of $566.2{\mu}A\;mM^{-1}\;cm^{-2}$. The superior selectivity, reproducibility, stability and applicability in real sample of Ni/a-MWCNT/GCE endowed it with potential application in discharged wastewater.

• Journal of Electrochemical Science and Technology
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• v.13 no.4
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• pp.472-478
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• 2022

Solar energy harvesting is practiced by various nations for the purpose of energy security and environment preservation in order to reduce overdependence on oil. Converting solar energy into electrical energy through Photovoltaic (PV) module can take place either in on-grid or off-grid applications. In recent time Lithium battery is exhibiting its presence in on-grid applications but its role in off-grid application is rarely discussed in the literature. The preliminary capacity and Peukert's study indicated that the battery quality is good and can be subjected for life cycle test. The capacity of the battery was 10.82 Ah at 1 A discharge current and the slope of 1.0117 in the Peukert's study indicated the reaction is very fast and independent on rate of discharge. In this study Lithium Iron Phosphate battery (LFP) after initial characterization was subjected to life cycle test which is specific to solar off-grid application as defined in IEC standard. The battery has delivered just 6 endurance units at room temperature before its capacity reached 75% of rated value. The low life of LFP battery in off-grid application is discussed based on State of Charge (SOC) operating window. The battery was operated both in high and low SOC's in off-grid application and both are detrimental to life of lithium battery. High SOC operation resulted in cell-to-cell variation and low SOC operation resulted in lithium plating on negative electrode. It is suggested that to make it more suitable for off-grid applications the battery by default has to be overdesigned by nearly 40% of its rated capacity.

• Corrosion Science and Technology
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• v.17 no.5
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• pp.231-241
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• 2018

Atmospheric corrosion is generally an electrochemical degradation process of metal. It can be caused by various corrosion factors of atmospheric component, weather, and air pollutants. Moisture, particles of sea salts, and sulfur dioxide are major factors in atmospheric corrosion. Galvanizing coating is one of the most efficient ways to protect iron from corrosion by zinc plating on the surface of the iron. Galvanized steels are being widely used in automobiles, building structures, roofing, and other industrial structures due to their high corrosion resistance compared to bare iron. Atmospheric corrosion of galvanized steel has shown complex corrosion behavior depending on coating process, coating thickness, atmospheric environment, and air pollutants. In addition, different types and kinds of corrosion products can be produced depending on the environment. Lifespan of galvanized steels is also affected by the environment. Therefore, the objective of this study was to determine the corrosion behavior of galvanized steel under atmospheric corrosion at six locations in Korea. When the exposure time was increased, content of zinc from GA surface decreased while contents of iron and oxygen tended to increase. On the other hand, content of iron was constant even after 36 months of exposure of GI.

• Journal of Korean Society on Water Environment
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• v.23 no.3
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• pp.377-384
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• 2007

This study has carried out a performance of dimensionally stable anode for the purpose of decolorization of Rhodamine B (RhB) in water. Seven kinds of 1, 2 and 3 component electrodes were prepared by plating and thermal deposition, which were coated by the oxides of Pt, Ru, Ir, Sn-Sb, Ir-Sn-Sb, Ru-Sn-Sb and Ru-Sn-Ti on Ti metal surface, respectively. Performance for RhB decolorization of the seven electrodes lay in: Ru-Sn-Ti/Ti ${\fallingdotseq}$ Ru-Sn-Sb/Ti > Ir-Sn-Sb/Ti > Sn-Sb/Ti > Ru/Ti > Ir/Ti > Pt/Ti. The effects of electrode area and distance, electrolyte type and concentration, current density and pH were investigated on the decolorization of RhB using Ru-Sn-Ti/Ti electrode. Decolorization of RhB was not influenced by electrode area and distance largely, however wattage was influenced by them. NaCl was superior to the decolorization of RhB than $Na_2SO_4$. Optimum NaCl dosage and current density were 0.5 g/L and $0.183A/cm^2$, respectively. The pH effect of decolorization of RhB was not significant within the range of 3-7.

• Journal of Korean Society on Water Environment
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• v.23 no.5
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• pp.613-619
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• 2007

This study has carried out a performance of dimensionally stable anode for the purpose of disinfection of Legionella pneumophila in water. Three kinds of electrode were prepared by plating and thermal deposition, which were coated by the oxides of Pt, Ru and Ir on Ti metal surface, respectively. The order of disinfection performance for Legionella pneumophila was Ru/Ti > Ir/Ti > Pt/Ti. Free Cl and $ClO_2$ generation of Ir/Ti electrode was higher than that of two electrodes. However, the concentrations of generated $H_2O_2$ and $O_3$ of the Ru/Ti electrode were highest among the three electrodes. The higher NaCl concentration was, the more oxidants was generated and disinfection effect was increased. However, optimum NaCl dosage was 0.0125% due to the regulation on the conductivity and $Cl^-$ concentration for the cooling water quality of air conditioning and refrigeration equipment. With the increase of current, oxidants was more generated and following disinfection effect was increased. The increase of electrode distance reduced oxidants generation due to the low electric power, and their disinfection effect was decreased accordingly.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.12-12
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• 2008

Ruthenium is one of the noble metals having good thermal and chemical stability, low resistivity, and relatively high work function(4.71eV). Because of these good physical, chemical, and electrical properties, Ru thin films have been extensively studied for various applications in semiconductor devices such as gate electrode for FET, capacitor electrodes for dynamic random access memories(DRAMs) with high-k dielectrics such as $Ta_2O_5$ and (Ba,Sr)$TiO_3$, and capacitor electrode for ferroelectric random access memories(FRAMs) with Pb(Zr,Ti)$O_3$. Additionally, Ru thin films have been studied for copper(Cu) seed layers for Cu electrochemical plating(ECP) in metallization process because of its good adhesion to and immiscibility with Cu. We investigated Ru thin films by thermal ALD with various deposition parameters such as deposition temperature, oxygen flow rate, and source pulse time. Ru thin films were grown by ALD(Lucida D100, NCD Co.) using RuDi as precursor and $O_2$ gas as a reactant at 200~$350^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• v.15 no.1
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• pp.11-18
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• 1982

80% Ni-Permalloy is soft magnetic material with high initial permeability and low magnetic coercive force Hc, and is used to computer memory cores and minirelays of communication e-ngineering. In this paper 80 Permalloy thin film on copper cathode was alloy-deposited from Watts so-lution contatining FeSO4$.$7H2O. The amount of FeSO4$.$7H2O in the solution, pH, temperature of the solution and plating current density were varied as parameters and the resulting comp-osition changes of deposited film were analyzed electrochemically with respect to the parame-ters. From the above procedure electroplating conditions for deposition of 80 Permalloy were est-ablished as following: 17-21 g/$\ell$ of FeSO4$.$7H2O in Watts solution, current density 1.0-2.0 Amp/dm2, pH 2.5-3.0 and temperature range of 50-60$^{\circ}C$.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.7
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• pp.46-52
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• 2006

The effects of surface treatment on the hydrogen storage properties of a $Mg_2Ni$ alloy particle were investigated by the microvoltammetric technique, in which a carbon-filament microelectrode was manipulated to make electrical contact with the particle in a KOH aqueous solution. It was found that the hydrogen storage properties of $Mg_2Ni$ at room temperature were improved by the surface treatment with a nickel plating solution. The sodium salts(sodium phosphate and sodium dihydrogen citrate) contained in the nickel plating solution made the alloy form an amorphous-like state, resulting in an improved hydrogen charge/discharge capacity at room temperature as high as about 150[mAh/g] from the original value of 17[mAh/g]. Potential-step experiment was carried out to determine the apparent chemical diffusion coefficient of hydrogen atom($D_{app}$) in the alloy. Since the alloy particle we used here was a dense, conductive sphere, the spherical diffusion model was employed for data analysis. $D_{app}$ was found to vary the order between $10^{-8}{\sim}10^{-9}[cm^2/s]$ over the course of hydrogenation and dehydrogenation process.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.229-229
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• 2010

With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.