• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 추계학술발표대회 논문집
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• pp.350-355
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• 2009

The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6${\Omega}$ cm, $20{\times}20mm^2$, CZ(Czochralski) wafer.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 춘계학술발표강연 및 눈문개요집
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• pp.13-13
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• 1999

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• 한국환경과학회지
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• 제17권3호
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• pp.335-342
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• 2008

This study based on electro-coagulation & oxidation reaction is applied to wastewater treatment. Electro-oxidation reaction is used to remove cyanide(CN) which is contained in plating wastewater. Cyanide is transferred by gases such as $NH_3,\;NO_x,\;CO_2$. Analysis result and removal efficiency of Cyanide which is contained in heavy metal wastewater of plating plant, are shown as following paragraph. In electrode arrangement experiment, removal efficiency of carbon electrode(-)/STS316L electrode(+) arrangement method is superior to carbon electrode(-)/carbon electrode(+) arrangement method. Removal efficiencies of cyanide in different HRT such as 30 min, 45 min, 60 min, 75 min and 90 min are 85.5%, 93.1%, 98.0%, 98.7% and 99.4% respectively in carbon electrode(-)/STS316L electrode(+) arrangement method. Finally we can estimate the critical point at HRT of 60 min which the variation of removal efficiency is decreased and HRT to obtain removal efficiency of less than 1 mg/LCN is minimum 90 min.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.342-345
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• 2009

Electro galvanized steel is electroplated cold roller steel for improving corrosion resistance and paintability, and is widely used in automobiles and home appliances. In the electroplating line for manufacturing electro galvanized steel if plating process is carried out with impurity on conductor roll surface, the defects in manufacturing process occurs because of steel fault. For quality, polishing is always required to separate impurity on surface of conductor roll. In this study, finite element analysis of wear for polisher brush is carried out for replaced time of it.

• 한국표면공학회지
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• 제53권6호
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• pp.312-321
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• 2020

Morphology of porous cobalt electro-deposits was systematically investigated as functions of cobalt precursors in the plating bath and applied cathodic current density with a special focus on cobalt nano-rod formation. It was proved that the concentration of cobalt precursor plays little effect on the morphology of cobalt electro-deposits at relatively low plating current density while it significantly affects the morphology with increasing plating current density. Such a dependence was discussed in terms of the kinetics of two competitive reactions of cobalt reduction and hydrogen evolution. Cobalt nano-rod structure was created at specific ranges of cobalt precursor content and applied cathodic current density, and its diameter and length varied with plating time without notable formation of side branches which is usually found during dendrite formation. Specifically, the nano-rod length was preferentially increased in relative short plating time (<15 s), resulting in higher aspect ratio of nano-rod with plating time. Whereas, both the nano-rod length and diameter were increased nearly at the same level in a prolonged plating time, making the aspect ratio unchanged. From the analysis of crystal structure, it was confirmed that the cobalt nano-rod preferentially grew in the form of single crystal on a dense poly-crystalline cobalt thin film initially formed on the substrate.

• Corrosion Science and Technology
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• 제23권3호
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• pp.215-220
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• 2024

Recently, the demand for Zn-Ni electrogalvanized steel sheets for home appliances and automobiles is increasing. Products should have a thick plating (30 to 40 g/m²) on both side with a thin thickness (≤ 0.8 mm) and the highest surface quality. By a high current density operation, current is concentrated in the edge part of the steel sheet, resulting in large surface dent defects due to dendritic plating. This can lead to a low productivity due to low line speed operation. To solve this problem, this study aimed to identify factors influencing dendritic plating. A cylindrical electroplating device was manufactured. Effects of cut edge shape and thickness of steel plate, current density, temperature, flow rate, electrolyte concentration, and pH on dendrite generation of Zn-Ni electroplating were examined. To investigate effect of edge shape of the steel sheet, the steel sheet was manufactured using three processing methods: shearing, polishing after shearing, and laser. Relative effects thickness and cut edge processing methods of the steel plate, current density, temperature, flow rate, electrolyte concentration, and pH of plating solution on dendrite plating were investigated. To prevent dendrite plating, an edge mask was manufactured and its application effect was investigated.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2017년도 제48회 춘계학술대회논문집
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• pp.857-863
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• 2017

본 논문은 다단연소사이클 엔진의 연소실 내벽을 고온, 고압의 환경으로부터 보호하기 위한 열차폐 코팅 공정 개발에 관한 내용이다. 기존 연소기 내벽에는 열차폐 특성이 우수한 Zr 기반의 세라믹용사코팅을 적용했지만, 세라믹의 특성상 연소실 내벽(금속)과 열팽창계수 차이로 인해 박리가 발생할 수 있다. 때문에 로켓 선진국에서는 열차폐 효과를 다소 희생 하더라도 밀착력 향상을 위하여 금속계 코팅인 Ni-Cr 도금을 적용하고 있다. 본 연구에서는 연소기에 적용 가능한 상향 순환식 유동셀을 적용한 도금조를 개발했으며, 반복적인 공정 개선을 통해 도금 두께 $100{\mu}m$이상, ${\pm}10%$의 두께 균일도를 만족하는 Ni, Cr 도금 공정조건을 확립했다.

• 항공우주기술
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• 제8권1호
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• pp.138-143
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• 2009

액체로켓엔진 연소기에 적용된 대기 플라즈마 코팅 및 전해/무전해 도금 코팅의 열차폐 효율과 내구성 평가를 수행하였다. 연소시험 결과 대기 플라즈마 방식의 $ZrO_2$, NiCrAlY 코팅은 로켓엔진 연소기의 초음속 유동영역에서 코팅이 표면에서 박리되는 현상이 간헐적으로 발생하였으며 따라서 이러한 문제를 극복할 수 있는 대체 코팅 방식이 요구되었다. 시험 결과 열차폐 효율 및 내구성 관점에서 대기 플라즈마 방식의 $ZrO_2$, NiCrAlY 코팅의 대안으로 무전해/전해 방식을 사용한 니켈-크롬 코팅을 사용할 수 있음을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.64-64
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• 2009

As the advanced packaging technology developing, Copper electro-plating processing has be wildly utilized in the semiconductor interconnect technique. Chemical solution monitoring methods, including PH and gravity measurement exist in industry, but economical and practical real-time monitoring has not been achieved yet. Red-green-blue (RGB) color sensor can successfully monitor the condition of $CuSO_4$ solution during electric copper plating process. Comparing the intensity variations of the RGB data and optical spectroscopy data, strong correlation between two in-situ sensors have shown.