• Transactions on Electrical and Electronic Materials
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• 제14권4호
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• pp.199-202
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• 2013

In order to study the effect of reactive diluents on the electrical insulation breakdown strength and mechanical properties of, a polyglycol and an aliphatic epoxy were individually introduced to an epoxy system. Reactive diluents were used in order to decrease the viscosity of the epoxy system; polyglycol acted as a flexibilizer and 1,4-butanediol diglycidyl ether (BDGE) acted as an aliphatic epoxy, which then acted as a chain extender after curing reaction. The ac electrical breakdown strength was estimated in sphere-to-sphere electrodes and the electrical breakdown strength was estimated by Weibull statistical analysis. The scale parameters of the electrical breakdown strengths for the epoxy resin, epoxy-polyglycol, and epoxy-BDGE were 45.0, 46.2, and 45.1 kV/mm, respectively. The flexural and tensile strengths for epoxy-BDGE were lower than those of the epoxy resin and those for epoxy-polyglycol were lower than those of the epoxy resin.

• Transactions on Electrical and Electronic Materials
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• 제14권2호
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• pp.101-104
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• 2013

The effect of the mixing ratio of spherical silica on the electrical insulation breakdown strength in an epoxy/silica composite was studied. Spherical silicas with two average particle sizes of $5{\mu}m$ and $20{\mu}m$ were mixed in different mixing ratios, and their total filling content was fixed at 60 wt%. In order to observe the dispersion of the silicas and the interfacial morphology between silica and epoxy matrix, scanning electron microscopy (SEM) was used. The electrical insulation breakdown strength was estimated in sphere-sphere electrodes with different insulation thicknesses of 1, 2, and 3 mm. Electrical insulation breakdown strength decreased with increasing mixing ratio of $5/20{\mu}m$ and the thickness dependence of the breakdown strength was also observed.

• 한국전기전자재료학회논문지
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• 제25권11호
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• pp.886-894
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• 2012

In order to develop electrical insulation materials, epoxy-nanosilica-microsilica mixture composites (ENMC) was synthesized, and mechanical properties such as their tensile and flexural strength, and AC insulation breakdown strength were investigated. Properties of mechanical strength and AC insulation breakdown strength are analyzed as scale and shape parameter with respect to weibull plot. Their tensile and flexural strength, AC insulation breakdown strength were compared original epoxy or EMC to ENMC. The 4 phr nano-silica addition and the 65 wt% micron-silica mixture composite (ENMC) was found to have the highest tensile and flexural strength. In the tensile strength was improved 29%, and flexural strength was improved 60.9% higher than those of the original epoxy. In the insulation breakdown strength, ENMC_4 phr was improved 17% and ENMC_5 phr was improved 15.8% higher than those of the EMC.

• 전기학회논문지
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• 제62권2호
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• pp.219-227
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• 2013

This paper reported a study on the thermal, mechanical and electrical insulation properties of epoxy/mica composites. To investigate the effect of mica content, glass transition temperature, mechanical properties such as tensile and flexural strength, and insulation breakdown properties for epoxy composites with various contents of mica. The effect of insulation thickness on insulation breakdown property was also studied. It was observed that tensile and flexural strength decreased with increasing mica content, while elastic modulus increased as the mica content increased. AC insulation breakdown strength for all epoxy/mica composites was higher than that of neat epoxy and that of the system with 20 wt% mica was 14.4% improved. As was expected, insulation breakdown strength at $30^{\circ}C$ was far higher than that at $130^{\circ}C$, and it was also found that insulation breakdown strength was inversely proportion to insulation thickness.

• Transactions on Electrical and Electronic Materials
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• 제13권4호
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• pp.200-203
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• 2012

Epoxy/mica composite was synthesized, in order to use it as an impregnation resin in a vacuum pressure impregnation (VPI) process, for manufacturing a high voltage rotary machine. The average particle size of the mica was 5~7 ${\mu}m$ and its content was 0, 20, 30 and 40 wt%. A plasticizer or a low molecular aliphatic epoxy was also used, to decrease the viscosity of the composite. The AC electrical breakdown strength was estimated in sphere-to-sphere electrodes, and the electrical breakdown data were estimated by Weibull statistical analysis. The electrical breakdown strength became higher with the addition of mica; and that of the system with 20 wt% mica was highest. The electrical breakdown strength of the system with an aliphatic epoxy was higher than that of the system with a, plasticizer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.87-93
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• 2004

Laminated Polypropylene Paper (LPP) and Kraft paper were used as ac power insulation for conventional cable as well as high temperature superconducting (HTS) cable because of its prominent insulating characteristics. However, researches on the use of LPP/Kraft paper in HTS cables are thinly scattered. In this paper, the effect of laminate polypropylene paper on the breakdown strength of LPP/Kraft multi-layer sample impregnated with liquid nitrogen (LN2)under ac and impulse applied voltage was studied. In addition, the breakdown strength characteristics of LPP and Kraft multi-layer sample were also investigated. It was found from the experimental data that the LPP has higher breakdown strength value than Kraft paper in ac and impulse. Especially in the ac case, the breakdown strength increases as the component ratio of LPP in the LPP/Kraftsample increases and slightly affected by the inserting position of LPP but in impulse case, the breakdown strength strongly depends on the number of LPP and the relative position of LPP.

• Transactions on Electrical and Electronic Materials
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• 제13권6호
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• pp.301-304
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• 2012

Epoxy/microsilica (65 phr)/nanosilica (0~5 phr) composites (EMNC) were prepared in order to develop a high-voltage insulation material, where phr means parts per hundred relative to the epoxy oligomer. Tensile and flexural tests of the composites were carried out, and the AC electrical breakdown strength was measured, after which all the data were estimated by Weibull statistical analysis. As the nanosilica content increased, the tensile strength increased, and the highest value was 117.7 MPa in the EMNC system with 3 phr nanosilica, which was ca. 10% higher than that of the system without nanosilica. The value then decreased after 3 phr. The flexural strength and AC electrical breakdown strength showed the same tendencies as the tensile strength. The highest value of the flexural strength was 184.6 MPa in the EMNC system with 3 phr of nanosilica, which was ca. 15% higher than that of the system without nanosilica. The strongest value of the AC electrical breakdown strength was 79.0 kV/0.5 mm in the EMNC system with 3 phr of nanosilica, which was ca. 34% higher than that of the system without nanosilica.

• Transactions on Electrical and Electronic Materials
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• 제14권2호
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• pp.105-109
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• 2013

In order to develop high voltage (HV) insulation materials, epoxy/spherical alumina composites with two different particle sizes (in ${\mu}m$) were prepared and a dynamic mechanical analysis (DMA) and electrical insulation breakdown strength test were carried out in sphere-sphere electrodes and the data were estimated using Weibull statistical analysis. Alumina content varied from 50 to 70 wt%. The electrical insulation breakdown strength for epoxy/alumina (50 wt%) was 44.0 kV/1 mm and this value decreased with increasing alumina content. The effects of insulation thickness and alumina particle size on the insulation breakdown strength were also studied. The insulation thickness varied from 1 mm to 3 mm, and the particle sizes were 7.3 or $40.3{\mu}m$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• 한국안전학회지
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• 제19권1호
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• pp.56-59
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• 2004

In this paper, we investigated the influence of gap length and tip radius on breakdown of mineral based insulation oil. Applied voltages were DC and AC voltage. Electrode system was needle-plane structure. The tip radius of needle electrode was 5, 10, 20 and 25${\mu}m$, respectively. We measured breakdown voltage for each of tip radius with increasing electrode gap, 2mm to 12mm. Electric breakdown strength at tip was calculated using Mason's equation contained geometric figure. As gap length increased, breakdown strength increased linearly. But, as tip radius of needle increased, breakdown strength decreased exponentially. It can be explained by the phenomenon that electron is easily injected, as tip radius increases, and effective work function decreases. When appling DC voltage, breakdown strength was higher when polarity of needle was negative than positive. It is because of the space charge effect in accordance with the influence of liquid motion.