• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.290-293
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• 2003

Ohmic contact characteristics of Al ion implanted n-type SiC wafer were investigated. Al ions implanted with high dose to obtain the final concentration of $5{\times}10^{19}/cm^3$, then annealed at high temperature. Firstly, B ion ion implanted p-well region were formed which is needed for fabrication of SiC devices such as DIMOSFET and un diode. Secondly, Al implanted high dose region for ohmic contact were formed. After ion implantation, the samples were annealed at high temperature up to $1600^{\circ}C\;and\;1700^{\circ}C$ for 30 min in order to activate the implanted ions electrically. Both the inear TLM and circular TLM method were used for characterization. Ni/Ti metal layer was used for contact metal which is widely used in fabrication of ohmic contacts for n-type SiC. The metal layer was deposited by using RF sputtering and rapid thermal annealed at $950^{\circ}C$ for 90sec. Good ohmic contact characteristics could be obtained regardless of measuring methods. The measured specific contact resistivity for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$ were $1.8{\times}10^{-3}{\Omega}cm^2$, $5.6{\times}10^{-5}{\Omega}cm^2$, respectively. Using the same metal and same process of the ohmic contacts in n-type SiC, it is found possible to make a good ohmic contacts to p-type SiC. It is very helpful for fabricating a integrated SiC devices. In addition, we obtained that the ratio of the electrically activated ions to the implanted Al ions were 10% and 60% for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.60-64
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• 2023

In this study, the electrical contact resistance characteristics between graphene and metals, which is one of important factors for the performance of graphene-based devices, were compared. High-quality graphene was synthesized by chemical vapor deposition (CVD) method, and Al, Cu, Ni, and Ti as electrode materials were deposited on the graphene surface with equal thickness of 50 nm. The contact resistances of graphene transferred to SiO₂/Si substrates and metals were measured by the transfer length method (TLM), and the average contact resistances of Al, Cu, Ni, and Ti were found to be 345 Ω, 553 Ω, 110 Ω, and 174 Ω, respectively. It was found that Ni and Ti, which form chemical bonds with graphene, have relatively lower contact resistances compared to Al and Cu, which have physical adsorption properties. The results of this study on the electrical properties between graphene and metals are expected to contribute to the realization of high-performance graphene-based devices including electronics, optoelectronic devices, and sensors by forming low contact resistance with electrodes.

• Tribology and Lubricants
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• v.35 no.1
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• pp.16-23
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• 2019

In this study, we aim to analyze the effects of both contact layer properties and surface roughness on contact resistance. The contact has a great influence on performance in terms of electrical conduction and heat transfer. The two biggest factors determining contact resistance are the presence of surface roughness and the surface layer. For this reason we calculated the contact resistance by considering both factors simultaneously. The model of this study to calculate contact resistance is as follows. First, the three representative surface parameters for the GW model are obtained by Nayak's random process. Then, the apparent contact area, real contact area, and contact number of asperities are calculated using the GW model with the surface parameters. The contact resistance of a single surface layer is calculated using Mikic's constriction equation. The total contact resistance is approximated by the parallel connection between the same asperity contact resistances. The results of this study are as follows. The appropriate thickness with reduction effect for contact resistance is determined according to the difference in conductivity between the base layer and surface layer. It was confirmed that the standard deviation of surface roughness has the greatest influence on surface roughness parameters. The results of this study will be useful for selecting the surface material and surface roughness when the design considering the contact resistance is needed.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1352-1353
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• 2008

In this study, aluminium - doped zinc oxide (ZnO:Al) transparent conducting film was deposited on PET(polyethylen terephthalate) substrate by r.f. magnetron sputtering method. PET substrate was surface-treated in an atmospheric pressure DBD(dielectric barrier discharge) plasma to increase deposition rate and to improve electrical propesties. Morphological changes by DBD plasma were obsered using contact angle measurement. The contact angle of water on PET was reduced from 62$^{\circ}$ to 42$^{\circ}$ by DBD plasma surface treatment. The plasma treatment also increased deposition rate and electrical propesties. The electrical resistivity as low as $4.97{\times}10^{-3}[{\Omega}-cm]$ and the deposition rate of 234[${\AA}$-m/min] were obtained in ZnO:Al film with surface treatment time of 5min, and 20min., respectively.

• Transactions on Electrical and Electronic Materials
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• v.18 no.3
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• pp.148-150
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• 2017

For the improvement of the anti-fouling features of porcelain electrical insulators, in this study, the surface of an insulator was coated with a functional material to expand the insulator's self-cleanness. The anti-fouling and mechanical features of the functional film coating of ceramic substrates made from components like an electrical insulator were analyzed. The coating methods that were used were spray coating, dip coating, and fabric coating. Following the coating, the contact angle of the coated surface was measured, revealing that the spray coating method offered the lowest angle ($13.7^{\circ}$) and a strong hydrophilic feature. The anti-fouling analysis showed that the anti-fouling features improved as the contact angle decreased. The mechanical properties - hardness and adhesion - were both excellent at 9H and 5B, respectively, regardless of the coating method that was used.

• Journal of Mechanical Science and Technology
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• v.16 no.8
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• pp.1117-1126
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• 2002

A conducting crack in an electrostrictive ceramic under combined electric and mechanical loading is investigated. Analysis based on linear dielectric model predicts that the surfaces of the crack are not open completely but they are contact near the crack tip. The complete solution for the crack with a contact zone in a linear electrostrictive ceramic under combined electric and mechanical loading is obtained by using the complex variable formula. The asymptotic problems for a semi-infinite crack with a partial opening zone as well as for a fully open semi-infinite crack in a nonlinear electrostrictive ceramic are analyzed in order to investigate the effect of the electrical nonlinearity on the stress intensity factor under small scale nonlinear conditions. Particular attention is devoted to a finite crack in the nonlinear electrostrictive ceramic subjected to combined electric and mechanical loading. The stress intensity factor for the finite crack under small scale nonlinear conditions is obtained from the asymptotic analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.260-260
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• 2009

In high-efficiency crystalline silicon solar cell, If high-efficiency solar cells are to be commercialized, It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper are applied widely in various electronic manufactures as easily formation is available by plating. Ni is shown to be a suitable barrier to Cu diffusin as well as desirable contact metal to silicon. Nickel monosilicide has been suggested as a suitable silicide due to its lower resistivitym lower sintering temperature and lower layer stress than $TiSi_2$. In this paper, Nickel as a seed layer and diffusion barrier is plated by electroless plating to make nickel monosilicide.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.227-227
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• 2009

To prevent such accidents, molded case circuit breakers with improved short-circuit current interrupting capacity are needed. This paper is focused on understanding the interrupting capability with respect to double contact structure and puffer assisted self quenching that are based on the shape of the contact system in the current molded case circuit breaker. The new arc quenching structure for increasing the interrupting capacity of molded case circuit breakers is investigated by simulation and experiment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.123-123
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• 2009

In our experiment, a PTFE was sputter-coated on substrates to induce water-repellent properties and the RF-magnetron sputtering method for fabrication of PTFE film is used due to the advantages of the simple process, time saving, environmentally friendly, insulating property, and a good adhesion property to substrates. As a result of the correlation between surface roughness of PTFE films and contact angle with water, we found that the roughness surfaces are proportioned to contact angles related to low interfacial energy.

• Bulletin of the Korean Chemical Society
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• v.27 no.10
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• pp.1651-1654
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• 2006

Field emission (FE) currents were measured for silver-pasted and glass-pasted single-walled carbon nanotubes (SWNTs) after illuminating the tubes with a pulsed 532 nm laser. A very low turn-on field of approximately 0.4 V/m m and a high current density ~1700 $\mu A/cm^2$ at 3.5 V/m m was obtained for the silver-pasted SWNTs after laser irradiation but on the whole, no improvements were found for the glass-pasted SWNTs. Two roles of laser irradiation for the silver-pasted SWNTs were proposed. First, the embedded SWNTs and SWNT bundles inside the silver paste were immerged on the outer surface due to an instantaneous melting or annealing of the silver metals by the laser resulting in an increase of the field emission sites. Second, the laser irradiation was thought to improve the electrical contact between SWNTs and the silver metal by reducing the contact resistance via laser-induced thermal annealing, which was responsible for increasing the FE currents.