• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.886-887
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• 2007

현재까지 많은 연구자들이 초음파 모터의 회전자와 고정자 사이의 접촉 메커니즘을 규명하고 이를 통해 초음파 모터의 특성을 해석하고자 하였다. 하지만 초음파 모터의 비선형적이고 복잡한 접촉 메커니즘으로 인해 접촉 메커니즘의 명확한 규명과 이를 통한 정확하고 완전한 모터의 특성 해석이 불가능한 상황이다. 따라서 본 논문에서는 현재까지 제안된 접촉 메커니즘을 고려한 초음파 모터 해석 방법 중 Hertzian Contact Model을 이용하는 Flynn에 의해 제안된 방법을 유한 요소법과 결합하여 초음파 모터의 특성을 해석하는 기법을 제시하고자 한다.

• 한국표면공학회지
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• 제25권6호
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• pp.309-317
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• 1992

Evaluation of electroplated gold has been carried out to obtain the data base for electrical, mechanical and environmental properties for telecommunication component applications. Gold plating was performed to a various thickness of $0.1\mu\textrm{m}$ to 1.$25\mu\textrm{m}$ after Ni plating of $3\mu\textrm{m}$ on C52100 bronze. Electrical properties were evaluated by measuring contact resistance using 4-wire method under static contact and dynamic contact during wear. Reciprocating wear test was performed to study the wear behavior as well as failure of gold contacts. Environmental characteristics were evaluated by using salt spray testing and SO2 test. Hardness of soft gold film was measured to be 53KHN under 5g load. Friction coefficient was initially obtained to be 0.15 and 0.25 under 100g and 200g loads respectively, and then raised up to 0.8 with increasing reciprocating wear cycles. Static contact resistance was 2 to 3m$\Omega$ regardless of gold film thickness while drastic changes of contact resistance were occured upon stripping of the gold film during wear. The lifetime of contact wear showing stable contact resistance increased up to 6 times for $1\mu\textrm{m}$ thickness compared to that of$ 0.1\mu\textrm{m}$ thickness under 100g load. All gold plating appeared to be stable under salt atmosphere while only the gold plating over 1$\mu\textrm{m}$ was stable under SO2 atmosphere.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.349-349
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• 2010

Great performance of many semiconductor devices requirs the use of low-resistance ohmic contact. Typically, transmission line method (TLM) patterns are used to measure the specific contact resistance between silicon and metal. In this works, we investigate contact resistance for metal dependent (Cr/Ag, Ni) using TLM pattern based on silicon-on-insulator (SOI) wafer. The electrode with Ni linearly increases contact resistance as the pattern distance increase from $15{\mu}m$ to $75{\mu}m$ in accumulation part, but non-linearly increase in inversion part. In additional, the electrode with Cr/Ag linearly increases contact resistance as the pattern distance increase from $15{\mu}m$ to $75{\mu}m$ in inversion part, but non-linearly increase in accumulation part.

• 전기학회논문지
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• 제62권12호
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• pp.1803-1808
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• 2013

To maintain contact between catenary and pantograph copper is important in order to transmit power smoothly on Current collection system. But, Arc discharge with strong light is generated because of contact loss. Therefore, Arc discharge detection is important measurement factor judging performance of current collection system. In this paper, It is described to results of arc discharge applying UV detection technology using arc generator. And Arc discharge was detected using the most commonly used processing catenary and rigid catenary and pantograph copper of electric rolling stock for securing arc detection instrument reliability. Results of contact loss detection instrument in this paper will be used for maintenance of current collection quality and system.

• 한국전기전자재료학회논문지
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• 제15권9호
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• pp.822-829
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• 2002

This paper deals with the distribution characteristics of the current density and axial magnetic flux density for each slits made on the contact electrode in the vacuum interrupter with axial magnetic field type using 3-dimension finite element analysis. It has been known that the presence of an axial magnetic field parallel to the current flow in the arc plasma can increase the high current breaking capacity of vacuum interrupter by carrying out the arc plasma from constricted mode to diffusion mode. The axial magnetic field is created of itself by current flow in the segments of coil electrode behind the contact electrode. The analyzed results show that if the slits are made in the contact electrode, they can increase the current density and axial magnetic flux density in the contact electrode surface and at the gap distance, which is due to decrease the effect of eddy currents flowing in the contact electrode. The phase shift due to eddy currents, defined 3s time difference between the maximum value of current and axial magnetic field, is decreased still more by increasing the number of slits made in the contact electrode at the center point of gap distance. These results demonstrate that 3-dimension finite element analysis has a great deal of merits in the development and evaluation of new electrode at the design of vacuum interrupter.

• Transactions on Electrical and Electronic Materials
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• 제16권3호
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• pp.112-116
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• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

• 한국전기전자재료학회논문지
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• 제18권12호
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• pp.1087-1091
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• 2005

Four-probe device of single ZnO nanowire was fabricated by electron beam lithography. Electrical characterizations in a two-probe and a four-probe configuration with a back-gate were carried out to clarify the relative contribution of the contact and the intrinsic part in a ZnO nanowire. I-V characteristic in four-probe measurement showed an ohmic behavior with a high conductivity, 100 S/cm, which was better than those of two-probe measurement by 10 times. At the same values of the current between two-probe and four-probe, the net voltage applied inside the nanowire were extracted with calculated voltages at the contact. Four-probe current-gate voltage characteristics showed bigger tendencies than those of two-probe measurement at low temperatures, indicating the reduced gate dependence in two-Probe measurements by the existence of the contact resistance.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 춘계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.82-84
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• 2003

In case contact between point of contacts is not achieved well, contact resistance is grown, and by current concentration at current conducting contacts can weld. In order to decrease contact resistance between contacts in case of busbar, installing spring between fixed contact and moving contact. and then force on faying surface of contacts increase and contact resistance decrease. But, in case increase force of spring to widen contact area, operating force moving contact can grow, on the contrary force of spring is small, contact resistance becomes low. Therefore, need to optimize force and number of spring. position, and also need to examine force change on contact surface at point of contact moving. In this paper, dynamic kinetics analysis for force on faying surface of contacts is performed at unsteady state. It is showed to not uniform force on surface between contacts, and we can got more uniform force by means of change spring position.

• 한국안전학회지
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• 제34권5호
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• pp.22-30
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• 2019

In 2018, overload, overcurrent, insulation aging, and a contact failure caused 659 electric fires. There is almost no failure of electrical socket outlets during their manufacturing or installation period. After several months or several years, overload or overcurrent of electrical socket outlets leads to a contact failure or short circuit which causes an electric fire. Therefore, this paper analyzed for thermal characteristics based on a current value and the change in insulation resistance along with a temperature rise caused by electrical socket outlets and the state of laboratory use in workplaces. As a results, regarding the thermal characteristics based on the current value of each installation year, a temperature increase was related to a current value, an installation year, and whether the contact unit is corroded. Insulation resistance began to decrease when a temperature increased to a certain level. With a lapse of installation year, the temperature at which insulation resistance began to decrease was lowered. This paper can be applicable for the survey data about electrical socket outlet induced fire accidents and management guidelines.

• 한국전기전자재료학회논문지
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• 제15권1호
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• pp.15-23
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• 2002

In this study, metal/ZnO contacts were thermally annealed at different temperatures (as-dep., 400$^{\circ}C$, 600$^{\circ}C$, 800$^{\circ}C$, 1000$^{\circ}C$) for the investigation of electrical properties, and surface and interface characteristics. The analysis of the element composition and the chemical bonding state of the surface was made by the XPS(X-ray photoelectron spectroscopy). An attempt was made to establish the electrical property-microstructure relationship for the (Ti, Au)/ZnO. The Ti/ZnO contact exhibits an ohmic characteristics with a relatively high contact resistance of 4.74${\times}$10$\^$-1/ $\Omega$$\textrm{cm}^2$ after an annealing at 400$^{\circ}C$. The contact showed a schottky characteristics when the samples were annealed at higher temperature than 400$^{\circ}C$. The transition from the ohmic to schottky characteristics was contributed from the formation of the oxide layers as was confirmed by the peaks for O-O and Ti-O bondings in XPS analysis. For the Au/ZnO contact the lowest contact resistance was obtained from the as-deposited sample. The resistance was slowly increased with annealing temperature up to 600$^{\circ}C$. The ohmic characteristics were maintained eden fort 600$^{\circ}C$ annealing. The XPS analysis showed that the Au-O intensity was dramatically decreased with temperature above 600$^{\circ}C$.