• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.469-472
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• 1999

CeO$_2$ thin films have used in wide applications such as SOI, buffer layer, antirflection coating, and gate dielectric layer. CeO$_2$takes one of the cubic system of fluorite structure and shows similar lattice constant (a=0.541nm) to silicon (a=0.543nm). We investigated CeO$_2$films as buffer layer material for nonvolatile memory device application of a single transistor. Aiming at the single transistor FRAM device with a gate region configuration of PZT/CeO$_2$ /P-Si , this paper focused on CeO$_2$-Si interface properties. CeO$_2$ films were grown on P-type Si(100) substrates by 13.56MHz RF magnetron sputtering system using a 2 inch Ce metal target. To characterize the CeO$_2$ films, we employed an XRD, AFM, C-V, and I-V for structural, surface morphological, and electrical property investigations, respectively. This paper demonstrates the best lattice mismatch as low as 0.2 % and average surface roughness down to 6.8 $\AA$. MIS structure of CeO$_2$ shows that breakdown electric field of 1.2 MV/cm, dielectric constant around 13.6 at growth temperature of 200 $^{\circ}C$, and interface state densities as low as 1.84$\times$10$^{11}$ cm $^{-1}$ eV$^{-1}$ . We probes the material properties of CeO$_2$ films for a buffer layer of FRAM applications.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.2
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• pp.357-361
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• 2011

The terminal current in voltage driven systems is an essential role for characterizing the pattern of electric discharge such as corona, breakdown, etc. Until now, to evaluate this terminal current, Sato's equation has been widely used in areas of high voltage and plasma discharge. Basically Sato's equation was derived by using the energy balance equation and its final form described physical meaning explicitly. To give more general abilities in Sato's equation, we present a generalized approach by directly using the Poynting's theorem incorporating the finite element method. When the magnetic field effect or the time-dependent voltage source is considered, this generalized energy method can be easily applicable to those problems with any dielectric media such as gas, fluid, and solid. As an alternative approach, the integral Ohm's law resulting in small numerical errors has an ability to be applied to multi-port systems. To test the generalized energy method and integral Ohm's law, first, the results from two prosed methods were compared to those from Sato's approach and an analytic solution in parallel plane electrodes. After verification, the generalized method was applied to the tip-sphere electrodes for evaluating the terminal current with three carriers and the Fowler-Nordheim field emission condition. From these results, we concluded that the generalized energy method can be a consistent technique for evaluating the discharge current with various dielectric materials or large magnetic field.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.13 no.4
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• pp.152-159
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• 1999

This paper describes the rmtion characteristics of a particle in GIS under AC voltage. To measure the motion characteristics of the particle, a model gas chamber and parallel plain electrodes were designed and manufactured lift-off voltages of wire and spherical particles on the electrode were calculated and rreasured, and electric charge was calculated. By using a high speed carrera, the rmtion characteristics of various particles with aw}ied voltages, such as motion pattern, lift-off time, lift-off height, were analyzed 1be lift-off voltages were greatly affected by diarreters of wire and spherical particles. At voltage around lift-off voltage, the stand-up particle in vertical state rmved up and down between electrodes and the height of the lift-off particle was low. At voltage around breakdown voltage, the particle repeated vertical rotation a few times while they were being lifted off, and then, they were floating between the electrodes.trodes.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.7 no.1
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• pp.21-29
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• 1993

In this paper, we studied the 50% flashover voltage of lightening impulse which affect the most serious damages on the insulation of the electric power network system. Also its V -t characteristics and corona process phenomena of pure $SF_6, N_2, SF_6-N_2$mixtures under the circumstances of nonuniform field gap are researched. Comparing the characteristics of pure $SF_6$ with that of $SF_6, N_2$mixtures, we discussed that breakdown processes and $SF_6, N_2$ mixture's application to economics.As a results, 50% flashover voltage of $SF_6$ 50% - $N_2$ 50% for impulse voltage is higher then that of 80% of pure SF6, measured data and calculated data by equal area law are almost equal from the points of view of V-t characteristics. Therefore, it has been known that $SF_6$ 50% - $N_2$ 50% mixtures can be used as an economic constitution gas of pure $SF_6$, it is verified that corona processes from Lichtenberg figure.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.5
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• pp.319-325
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• 1999

Direct current(d.c.)leakage current voltage characteristics of radio-frequencymagnetron sputtered BaTa\sub 2\O\sub 6\ film capacitors with aluminum(A1) top and indium tin oxide (ITO) bottom electrodes have been investigatedas a function of applied field and temperature. In order to study surfacetreatment effect on the electrical characteristics of as-deposited film weperformed exposure of oxygen plasma on $BaTa_2O_6$ surface. d. c.current-voltage (I-V), bipolar pulse charge-voltage (Q-V), d. c. current-time (I-t) andcapacitance-frequency (C-f) analysis were performed on films. All ofthe films exhibita low leakage current, a high breakdown field strength (3MV/cm-4.5MV/cm), and high dielectric constant (20-30). From the temperature dependence of leakage current,we can conclude that the dominant conduction mechanism is ascribed toSchottky emission at high electric field (>1MV/cm) and hopping conduction at lowelectric field (<1MV/cm). According to our results, the oxide plasma surfacetreatmenton as-deposited $BaTa_2O_6$ resulted in lowering interfacebarrier height and thus, leakage current when a negative voltage applied to the A1 electrode. This can be explained by reduction of surface contamination via etching surface and filling defects such as oxygen vacancies.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.591-593
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• 2000

In this paper, we describe the results of a combined experimental theoretical study designed to understand and predict the dielectric properties of SF$_{6}$ and SF$_{6}$+Ar mixtures. The electron transport, ionization, and attachment coefficients for pure SF$_{6}$ and gas mixtures containing SF$_{6}$ has been analysed over the E/N range 30~300[Td] by a two term Boltzmann equation and by a Monte Carlo Simulation using a set of electron cross sections determined by other authors, experimentally the electron swarm parameters for 0.2[%] and 0.5[%] SF$_{6}$+Ar mixtures were measured by time- of- flight method, The results show that the deduced electron drift velocities, the electron ionization or attachment coefficients, longitudinal and transverse diffusion coefficients and mean energy agree reasonably well with the experimental and theoretical for a rang of E/N values. Electron energy distribution functions computed from numerical solutions of the electron transport and reaction coefficients as functions of E/N. We have calculated $\alpha$,η and $\alpha$-η the ionization, attachment coefficients, effective ionization coefficients, and (E/N), the limiting breakdown electric-field to gas density ratio, in SF$_{6}$ and SF$_{6}$+Ar mixtures by numerically solving the Boltzmann equation for the electron energy distribution. The results obtained from Boltzmann equation method and Monte Carlo simulation have been compared with present and previously obtained data and respective set of electron collision cross sections of theections of the

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1502-1504
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• 2006

본 연구는 $SF_6$와 Dry-air(건조공기)가 혼합된 절연매체의 절연 특성과 부분방전 특성 연구를 위하여 기초실험용 쳄버와 70kV급 GIS mock up 을 이용하여 교류전압을 인가하여 실험이 수행되었다. 전자의 경우, Sphere gap 및 Needle/Plate 전극시스템을 이용하여 순수 $SF_6$가스와 Dry-air의 절연내력을 비교하고, 챔버의 압력을 5기압으로 유지한 상태에서 Dry-air와 $SF_6$가스의 혼합비를 변화시키면서 절연내력이 측정되었다. 후자의 경우, 기초실험에서 도출된 $SF_6$가스와 Dry-air의 최적의 혼합비율을 선택한 후, 방전 개시전압과 부분방전 양상을 순수 $SF_6$가스의 결과와 비교 분석하기 위한 실험을 수행하였다. 이를 위하여 GIS 사고의 주요원인이 되는 결함들, 즉 Protrusion, Floating, Free moving particle 들을 인위적으로 모의하여 Mock up 내부에 설치하고 내부 압력을 5기압으로 유지한 상태에서 수행되었다. 전자의 경우, $0.5{\sim}5$ 기압 범위내 에서 Dry-air 압력을 변화시켰을 때 절연내력은 전극시스템에 무관하게 순수 $SF_6$가스의 결과치의 $40{\sim}50%$정도이다. 또한 챔버 압력이 5기압일 경우, Needle/Plate 전극을 이용했을 경우, Dry-air 가 80% 혼합된 절연매체는 순수 $SF_6$가스 절연내력의 80%정도이다. 후자의 경우, 인가전압을 고정 시켰을 때, 부분방전 패턴과 방전크기는, 순수 $SF_6$가스와 Dry-air 가 80% 혼합된 절연매체는 동일한 패턴과 방전크기를 나타내고 있다. 이러한 결과를 근거로, 가스 압력이 5기압에서 운전되는 전력기기의 절연 매체로서 혼합가스를 사용할 경우, $SF_6$가스와 Dry-air의 혼합비는 2:8정도가 적절한 것으로 제안한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1122-1127
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• 1998

Group II-AF_2$films such as $CaF_2$, $SrF_2$, and $BaF_2$ have been commonly used many practical applications such as silicon on insulatro(SOI), three-dimensional integrated circuits, buffer layers, and gate dielectrics in filed effect transistor. This paper presents electrical and structural properties of fluoride films as a gate dielectric layer. Conventional gate dielectric materials of TFTs like oxide group exhibited problems on high interface trap charge density($D_it$), and interface state incorporation with O-H bond created by mobile hydrogen and oxygen atoms. To overcome such problems in conventional gate insulators, we have investigated $CaF_2$ films on Si substrates. Fluoride films were deposited using a high vacuum evaporation method on the Si and glass substrate. $CaF_2$ films were preferentially grown in (200) plane direction at room temperature. We were able to achieve a minimum lattice mismatch of 0.74% between Si and $CaF_2$ films. Average roughness of $CaF_2$ films was decreased from 54.1 ${\AA}$ to 8.40 ${\AA}$ as temperature increased form RT and $300^{\circ}C$. Well fabricated MIM device showed breakdown electric field of 1.27 MV/cm and low leakage current of $10^{-10}$ A/$cm^2$. Interface trap charge density between $CaF_2$ film and Si substrate was as low as $1.8{\times}10^{11}cm^{-2}eV^{-1}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.45-45
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• 2007

Capacitors among the embedded passive components are most widely studied because they are the major components in terms of size and number and hard to embed compared with resistors and inductors due to the more complicated structure. To fabricate a capacitor-embedded PCB for in-line process, it is essential to adopt a low temperature process (<$200^{\circ}C$). However, high dielectric materials such as ferroelectrics show a low permittivity and a high dielectric loss when they are processed at low temperatures. To solve these contradicting problems, we studied BMN materials as a candidate for dielectric capacitors. processed at PCB-compatible temperatures. The morphologies of BMN thin films were investigated by AFM and SEM equipment. The electric properties (C-F, I-V) of Pt/BMN/Cu/polymer were evaluated using an impedance analysis (HP 4194A) and semiconductor parameter analyzer (HP4156A). $Bi_2Mg_{2/3}Nb_{4/3}O_7$(BMN) thin films deposited on copper clad laminate substrates by sputtering system as a function of Ar/$O_2$ flow rate at room temperature showed smooth surface morphologies having root mean square roughness of approximately 5.0 nm. 200-nm-thick films deposited at RT exhibit a dielectric constant of 40, a capacitance density of approximately $150\;nF/cm^2$, and breakdown voltage above 6 V. The crystallinity of the BMN thin films was studied by TEM and XRD. BMN thin film capacitors are expected to be promising candidates as embedded capacitors for printed circuit board (PCB).

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.551-555
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• 1999

The deposition condition to obtain stoichiometric $Ta_2$O\ulcorner films, which is still controversial, using magnetron reactive sputtering was studied. The films were deposited by varying $O_2$gas flow rate with sputtering power and Ar gas flow rate of 200W and 60 sccm fixed. At the conditions of $O_2$ gas flow rate over 20 sccm, amorphous Tantalum oxide films with the refractive index of 2.1 and dielectric constant of 25 were deposited. Among those films, the capacitors dielectric properties of the film deposited at the condition of $O_2$ gas flow rate 50 sccm was best, the leakage current was 1$\times$10\ulcornerA/$\textrm{cm}^2$ at the electric field strength of 0.5 MC/cm and the breakdown field strength was over 2.0 MV/cm. This result could be explained from the analysis comparing with a standard sample using RBS because the composition of the film deposited at this condition was closest to the stoichiometric $Ta_2$O\ulcorner. The result of XPS analysis convinced that this film was stoichiometric $Ta_2$O\ulcorner film. A maximum cathode voltage was observed when $O_2$gas flow rate was 30 sccm. This shows that the Schiller's proposition that one can obtain stoichiometric films at the condition of maximum cathode voltage is not correct and more oxygen than that of the maximum voltage condition is necessary to deposit the stoichiometric Ta$_2$O\ulcorner films.