• Title/Summary/Keyword: Electric Circuit Board

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Use of an Electric Muscle Stimulation Thigh Band and High-intensity Circuit Training to Activate the Thigh Muscle (무릎 밴드를 이용한 EMS와 High-intensity Circuit Training의 대퇴근육 활성화 효과)

  • Hanna Park;Jinhee Park;Jooyong Kim
    • Journal of Fashion Business
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    • v.27 no.2
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    • pp.39-51
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    • 2023
  • The purpose of this study was to effectively improve the thigh muscles of adult women working from home due to COVID-19. In this study, ten adult women working from home performed 1) an electromyography test, 2) a static balance test on a balance board, and a 3) dynamic balance test by squatting on a Bosu ball four times: before electric muscle stimulation (EMS), after EMS, after high-intensity circuit training (HICT), and after EMS plus HICT. For this test, EMS was attached to a medical knee support to manufacture an EMS knee band that could be easily worn regardless of the location. For the experiment, EMS(electric muscle stimulation) was attached to the medical knee protector to manufacture an EMS knee band that can be easily worn regardless of location, and was measured based on the right foot. The study results confirmed that in all tests (electromyography test, static balance test on the balance board, and dynamic balance test by squatting on a Bosu ball), thigh strength improved in the order of treatment before EMS, after EMS, after HICT, and after EMS plus HICT. The study showed that people working from home or with activity restrictions due to COVID-19 had better exercise effects when wearing the EMS knee band and performing HICT, even in a small space.

A Study on the Electromagnetic Properties due to Circuit Patters in the Printed Circuit Hoard using Computer Simulation (컴퓨터 시뮬레이션을 이용한 PCB기판에서의 회로패턴에 따른 전자기적 특성에 관한 연구)

  • 이찬오;이성일;김용주;박광현;이준웅
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.11a
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    • pp.265-269
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    • 1996
  • In this paper, electric field interference was analyzed in the Printed Circuit Board to restrain the elcctromagnetic wave using Boundary Element Method and Finite Element Method. First, charge density distribution was simulated using Boundary Element Method and the characteristic impedance was caculated to restrain the reflex wave, and mutual capacitance was caculated in the multi-strip line PCB. Finally, electric field was simulated in the variable patterns using Finite Element Method. As a result, the optimal structure and characteristics of strip line was obtained and the imformations about the optimal design pattern could be obtained with the analysing the feild distribution.

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Design of Sub Control Part for VMS(Variable Message Signboard) (VMS(Variable Message Signboard)의 서브 컨트롤부 설계)

  • Shin, Jae-Heung;Lee, Sang-Cheol;Moon, Sung-Chang
    • Proceedings of the KIEE Conference
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    • 2004.07e
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    • pp.80-83
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    • 2004
  • Previously, in order to send information from the local controller to the display board, the hardware or software had to be handled and run through 3-phases, which include the PC-card or PC-add Board, I-F card and Sub board. This study will attempt to design a board that handles information by connecting the USB port of the PC directly to the Sub board. In addition, an MPU will be attached to the previously complex hardware circuit to design a software drive engine module, which allows for the development of new products by modifying only the software engine and not the hardware.

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Process Development of a Standard Operating Procedure (SOP) for the Manufacturing of Standardized Distribution Boards (규격화된 분전반 제작을 위한 표준작업절차(SOP)의 공정 개발)

  • Ko, Wan-Su;Lee, Byung-Seol;Choi, Chung-Seog
    • Journal of the Korean Society of Safety
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    • v.33 no.5
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    • pp.21-27
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    • 2018
  • The purpose of this study is to develop a SOP (Standard Operating Procedure) for a distribution board that can monitor the leakage current of a load distribution line in real time. The developed distribution board was fabricated by applying IEC 61439-1. It consists of the distribution board and an alarm device. The work process for making the distribution board was compliant with the KEMC (Korea Electrical Manufacturers Cooperative) regulations. And the AC distribution board range is 1,000 V. In addition, the voltage in DC is less than 1500 V. The distribution board receives a 3-phases and 4-wires power supply system and can supply power to the load of a maximum of 32 single or three phase distribution circuits. Also, leakage current measured on the power distribution board was used by sensors installed. The SOP of the developed distribution board consists of the installation standards for the short circuit alarm device and sensor, the surge protection device, switches and indication lamps, and other devices. The operation procedure was prepared so that each manufacturing step of the distribution board must be confirmed by the persons in charge of preparation, production, quality control and approval before moving forward to the next step.

Design of the Resonant Converter with a Double Sided LCC Compensation Circuit for Wireless Charger. (양면 LCC 보상 회로를 가진 무선 전력 충전기용 공진 컨버터의 설계)

  • Vu, Van-Binh;Tran, Duc-Hung;Choi, Woojin
    • Proceedings of the KIPE Conference
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    • 2015.07a
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    • pp.321-322
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    • 2015
  • The aim of this paper is to propose a design method for the double-sided LCC compensation circuit for 6.6kW electric vehicle (EVs) wireless charger. The analysis and comparison with several compensation topologies such as SS, SP, PS, PP and the hybrid LCC compensation is presented. It has been found that the hybrid LCC compensation has superior performance in comparison with other topologies. The design procedure for the EV charger is presented and the PSIM simulation results are provided.

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Study of EMI Suppression Method Applied on DC Motor Driver of Power Tail Gate (파워테일게이트의 DC모터구동회로에 적용된 EMI 저감기법에 대한 연구)

  • Kim, Yeong-Sik;Yoon, Yong-Soo;Jung, Hun;Gohng, Jun-Ho;Lee, Sang-Ho
    • Transactions of the Korean Society of Automotive Engineers
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    • v.16 no.1
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    • pp.1-7
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    • 2008
  • This paper presents electromagnetic interference(EMI) suppression method applied on the direct current(DC) motor driver for power tail gate control. EMI noise is generated by the fast switching of power devices connected to electric loads. It has become a matter of concern because of the vast increase in the number and sophistication of electronic system in automotive environment. The proposed EMI reduction method is based on the principle of reducing the transient speed of power devices by changing the parameters of the driver circuit related to the power MOSFET. In this paper, power losses were calculated by loss equations and thermal simulation was used to evaluate the effect on printed circuit board. Based on these results, the DC motor driver was fabricated and tested. The proposed method can help to design a DC motor driver which allows it to obtain an acceptable compromise between power losses and EMI.

Design of SECE Energy Harvest Interface Circuit with High Voltage Comparator for Smart Sensor (고전압 비교기를 적용한 스마트 센서용 SECE 에너지 하베스트 인터페이스 회로 설계)

  • Seok, In-Cheol;Lee, Kyoung-Ho;Han, Seok-Bung
    • The Journal of the Korea institute of electronic communication sciences
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    • v.14 no.3
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    • pp.529-536
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    • 2019
  • In order to apply a piezoelectric energy harvester to a smart sensor system, an energy harvest interface circuit including an AC-DC rectifier is required. In this paper, we compared the performance of full bridge rectifier, which is a typical energy harvester interface circuit, and synchronous piezoelectric energy harvest interface circuit by using board-level simulation. As a result, the output power of a synchronous electric charge extraction(: SECE) circuit is about four times larger than that of the full bridge rectifier, and there is little load variation. And a high voltage comparator, which is essential for the SECE circuit for the piezoelectric energy harvester with an output voltage of 40V or more, was designed using 0.35 um BCD process. The SECE circuit using the designed high-voltage comparator proved that the output power is 427 % higher than the FBR circuit.

A study on the improvement in Q-factor chracteristics of VCO resonance part (VCO 공진부의 Q-factor 특성향상에 관한 연구)

  • Lee, Hyun-Jong;Kim, In-Sung;Min, Bok-Gi;Song, Jae-Sung
    • Proceedings of the KIEE Conference
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    • 2005.07b
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    • pp.1506-1508
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    • 2005
  • VCO(voltage controlled oscillator) using mobile communication device decides direct characteristics as parts that affect important in stable oscillation and distortion characteristics of system. VCO used 900 MHz band was designed by the transformation of Colpitts circuit form use ADS that consider Q-factor to minimize phase noise. VCO manufactured together evaluation board and voltage control oscillator to FR-4 PCB. VCO experimented chracteristics after control through resonance department tuning. In our research, the designed VCO has 15.5 dBm output level at the bias condition of 6V and 10mA and the operating frequency range of 917 MHz$\sim$937 MHz band. Phase noise is -98.28 dBc/Hz at 1 MHz frequency offset from the carrier.

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A System IC for Controlling the Fire Prevention (화재방지제어 시스템 IC)

  • Kim, Byung-Cheul
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.13 no.4
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    • pp.737-746
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    • 2009
  • In this study, we have developed one chip system IC for preventing the overload, detecting an abnormal conditions, and controlling the fire prevention in the intelligent home appliances. For the purpose, a circuit detectable an electric leak for preventing an electric shock, and a circuit detectable arc that has effect directly on the fire are designed. The circuits designed on every block are verified by comparing simulation with bread-boarding using a standard transistors. The system IC is fabricated by using 34 V 2 metal $1.5{\mu}m$ bipolar transistor process from evaluation results. The electrical performances of IC application circuits and the system IC equipped on PCB board are evaluated. It is confirmed that the system IC is well operated for arc and ground fault(GF) signal.

Effect of underlayer electroless Ni-P plating on deposition behavior of cyanide-free electroless Au plating (비시안 무전해 Au 도금의 석출거동에 미치는 하지층 무전해 Ni-P 도금 조건의 영향)

  • Kim, DongHyun;Han, Jaeho
    • Journal of the Korean institute of surface engineering
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    • v.55 no.5
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    • pp.299-307
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    • 2022
  • Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.