• Journal of the Korean Ceramic Society
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• v.16 no.4
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• pp.225-236
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• 1979

The effect of $Ti^{+4}$ addition on the sinterability, microstructure, and temperature dependence of electromechanical coupling factor of magnetostrictive Ni-Cu-Co ferrite was investigated. The density of Ni-Cu-Co ferrite slightly increased by 2.0 mole % addition of either $TiO_2$ or $Fe_2TiO_4$, but tended to decrease by more than 2.0 mole % addition of $TiO_2$ or $Fe_2TiO_4$. As the content of either $TiO_2$ or $Fe_2TiO_4$ increased, the magnetocrystalline anisotropy compensation temperature also increased. Microstructure studies showed the stable grains when Ni-Cu-Co ferrite was sintered above 1, 20$0^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.630-634
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• 2014

$(Na_{0.525}K_{0.4425}Li_{0.0375})(Nb_{0.9975}Sb_{0.065}Ta_{0.0375})O_3+0.3 wt%CoO$ ceramics were fabricated as a function of CuO addition by traditional solid state sintering process in order to develop excellent lead-free piezoelectric ceramics composition. The addition of CuO in the LNKNTS composition ceramics can effectively enhance the densification of the ceramics, resulting in the oxygen vacancies as hardening effect. The excellent piezoelectric properties of electromechanical coupling factor($k{\small}_P$) of 0.378, piezoelectric constant($d_{33}$) of 152 pC/N were obtained from the 1.0 mol% CuO doped LNKNTS ceramics sintered at $1,020^{\circ}C$ for 3 h.

• Korean Journal of Materials Research
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• v.23 no.7
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• pp.385-391
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• 2013

The influence of Cu and Ni on the ductile-brittle transition behavior of metastable austenitic Fe-18Cr-10Mn-N alloys with N contents below 0.5 wt.% was investigated in terms of austenite stability and microstructure. All the metastable austenitic Fe-18Cr-10Mn-N alloys exhibited a ductile-brittle transition behavior by unusual low-temperature brittle fracture, irrespective of Cu and/or Ni addition, and deformation-induced martensitic transformation occasionally occurred during Charpy impact testing at lower temperatures due to reduced austenite stability resulting from insufficient N content. The formation of deformation-induced martensite substantially increased the ductile-brittle transition temperature(DBTT) by deteriorating low-temperature toughness because the martensite was more brittle than the parent austenite phase beyond the energy absorbed during transformation, and its volume fraction was too small. On the other hand, the Cu addition to the metastable austenitic Fe-18Cr-10Mn-N alloy increased DBTT because the presence of ${\delta}$-ferrite had a negative effect on low-temperature toughness. However, the combined addition of Cu and Ni to the metastable austenitic Fe-18Cr-10Mn-N alloy decreased DBTT, compared to the sole addtion of Ni or Cu. This could be explained by the fact that the combined addition of Cu and Ni largely enhanced austenite stability, and suppressed the formation of deformation-induced martensite and ${\delta}$-ferrite in conjunction with the beneficial effect of Cu which may increase stacking fault energy, so that it allows cross-slip to occur and thus reduces the planarity of the deformation mechanism.

• Journal of Magnetics
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• v.15 no.1
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• pp.32-35
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• 2010

The effects of Cu-addition and die-upset temperature on the texture in the die-upset Nd-lean $Nd_xFe_{93.5-(x+y)}-Cu_yGa_{0.5}B_6$ (x = 9-12, y = 0-2) alloys were investigated. The die-upset Cu-containing Nd-lean $Nd_{12}Fe_{81.5-y}-Cu_yGa_{0.5}B_6$ (y = 1, 2) alloys showed a considerable texture. Texture in the Nd-lean alloys developed through basal plane slip deformation. The Cu-addition reduced the melting point of grain boundary phase facilitating grain gliding during the die-upsetting, and providing a greater chance for the $Nd_2Fe_{14}B$ grains to meet the deformation conditions. Die-upsetting at higher temperature facilitated grain gliding and plastic deformation, thus enhancing texture.

• Journal of the Korean Electrochemical Society
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• v.24 no.3
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• pp.35-41
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• 2021

In this study, the effect of zwitterionic surfactant on Cu electrodeposition was investigated through cyclic voltammetry. With the addition of (dodecyldimethylammonio)propanesulfonate (DDAPS) as a representative zwitterionic surfactant in the electrolyte for Cu electrodeposition, the electrochemical Cu²⁺ reduction was inhibited on Cu and glassy carbon electrodes. Its inhibition effect was similar to that of cationic surfactant rather than anionic surfactant. Moreover, DDAPS interacted with chloride ion and exhibited the mass transfer-dependent inhibition behavior, which indicates that its inhibition function is associated with the formation of its surface aggregates on anion-covered Cu surface. In addition, adsorbed DDAPS slightly reduced the surface roughness of Cu electrodeposits. These characteristics were similar to those of cationic surfactant, but less obvious. It means the effect of DDAPS on Cu electrodeposition originates from the cationic head group which is shield by anionic head group.

• Korean journal of food and cookery science
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• v.18 no.1
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• pp.87-93
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• 2002

Effect of copper ions (Cu$\^$+/ and Cu$\^$2+/) on the fermentation of kimchi, especially on their effect on the prevention of over-acidification of kimchi, was investigated. The effect of Cu$\^$2+/ ion on the growth of individual lactic acid bacterium originally isolated from kimchi was also investigated. The addition of Cu$\^$+/($\geq$4.0mM) or Cu$\^$2+/($\geq$3.0mM) ions in kimchi effectively inhibited growth of lactic acid bacteria and maintained a titratable acidity of less than 1.0% for a periods of 14 days. Leuconostoc mesenteroides significantly decreased at the 10th day of fermentation in control kimchi, whereas the group with Cu$\^$+/ and Cu$\^$2+/ showed 10$\^$5/-10$\^$6/ CFU/ml at the 14th day of fermentation. This indicates that the addition of Cu$\^$+/ and Cu$\^$2+/ inhibited the production of excessive acids by inhibiting lactic acid bacteria, and allowed Leu. mesenteroides stay alive longer. Fe$\^$2+/ and SO$_4$$\^$2-/ ions did not have any effect on the fermentation of kimchi. Cu$\^$2+/ inhibited growth of all lactic acid bacteria tested, such as Leu. mesenteroides 6, Streptococcus faecalis 12, Lactobacillus plantarum 14, Lac. brevis 15, Leu. mesenteroides LA 10, and Lac. plantarum LA 97.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.13-19
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• 2000

Shear strengths of BGA solder joints on Cu pads were studied for Cu-containing Sn (0, 1.5, and 2.5 wt.% Cu) and Sn-40Pb (0 and 0.5wt.% Cu) solders, with emphasis on the roles of the Cu-Sn intermetallic layer thickness and the roughness of the interface between the intermetalic layer and solder. The shear strength test was performed for as-soldered solder joints with various soldering reaction times up to 4 min. The addition of Cu to the pure Sn solder results in an enhanced growth of the intermetallic layer whereas the effect of Cu addition to the Sn-40Pb solder is primarily on the reduction of the roughness of the intermetallic/solder interface. The critical thickness of the intermetallic layer for a maximum shear strength depends on the solder materials, which was measured to be ~ 2.3 $\mu\textrm{m}$ for Sn-Cu solders and ~ 1.2 $\mu\textrm{m}$ for Sn-Pb-Cu solders. The shear strength at the critical intermetallic layer thickness seems to increase as the intermetallic/solder interface becomes rougher. This is in accordance with the observation that the sheared fracture occurred initially within the solder tends to shift towards the intermetallic/solder interface as the intermetallic layer grows above the critical thickness.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1000-1001
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• 2006

Two atomized alloy powders were pre-compacted by cold and subsequently hot forged at temperatures ranging from 653K to 845K. The addition of Cu and Mg causes a decrease in the eutectic reaction temperature of Al-10Si-5Fe-1Zr alloy from 841K to 786K and results in a decrease of flow stress at the given forging temperature. TEM observation revealed that in addition to Al-Fe based intermetallics, $Al_2Cu$ and $Al_2CuMg$ intermetallics appeared. The volume fraction of intermetallic dispersoids increased by the addition of Cu and Mg. Compressive strength of the present alloys was closely related to the volume fraction of intermetallic dispersoids.

• Korean Journal of Materials Research
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• v.11 no.4
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• pp.266-271
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• 2001

Effect of Cd addition on the stress corrosion cracking(SCC) resistance of Al-Cu-Mn cast alloy was investigated by C-ring test and electrical conductivity measurement. With increasing Cd contents, the electrical conductivity and the SCC resistance were increased. The PFZ and coarse precipitates along the grain boundary were observed from TEM micrographs. The fracture made of the alloys was confirmed as intergranular type and showed brittle fracture surface. As a result, it was concluded that the SCC mechanism of these alloys is the anodic dissolution model. The maximum hardness was increased from 127Hv in the Cd-free alloy to 138∼145Hv in the Cd addition alloys.

• Journal of Powder Materials
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• v.7 no.4
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• pp.218-227
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• 2000

It is well known that the Cu-Cr alloys are very difficult to be made by conventional sintering methods. This difficulty originates both from limited solubility of Cr in the Cu matrix and from limited sintering temperature due to high vapor pressures of Cr and Cu components at the high temperature. Densification of Cu-50%Cr Powder compacts by conventional Powder metallurgy Process has been studied. Three kinds of sintering methods were tested in order to obtain high-density sintered compacts. Completely densified Cu-Cr compacts could be obtained neither by solid state sintering method nor by liquid phase sintering method. Both low degree of shrinkage and evolution of large pores in the Cu matrix during the solid state sintering are attributed to the anchoring effect of large Cr particles, which inhibits homogeneous densification of Cu matrix and induces pore generation in the Cu matrix. In addition, the effect of undiffusible gas coming from the reduction of Cu-oxide and Cr-oxide was observed during liquid phase sintering. A two-step sintering method, solid state sintering followed by liquid phase sintering, was proved to have beneficial effect on the fabrication of high-dendsity Cu-Cr sintered compacts. The sintered compacts have properties similar to those of commercial products.