• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.5-11
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• 2022

Despite the increasing importance of manufacturing and application R&D for ultrapure deionized water and electrolyzed ion water, various and systematic studies have not been conducted until now. In this study, the electrostatic discharge (ESD) behavior of electrolyzed ion water using a proton exchange membrane(PEM) was evaluated according to the type, flow rate, and bubble of electrolyzed ion water. In addition, by observing that Oxidation Reduction Potential (ORP) value returns to the unique value of electrolyzed ion water after electrostatic discharge, the possibility of two types of ions participating in electrostatic discharge ((H₂O)_n⁺ (assumed)) and ions for maintaining the characteristics of electrolyzed water could be inferred. In order to confirm the chemical structure and characteristics of the cations, in-depth research related to water molecular orbital energy or band gap should be followed.

• Journal of IKEEE
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• v.21 no.3
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• pp.234-239
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• 2017

In this paper, we propose an ESD (Electrostatic Discharge) protection circuit based on a new structure of SCR (Silicon Controlled Rectifier) embedded with PMOS structure. The proposed ESD protection circuit has a built-in PMOS structure and has a latch-up immunity characteristic and an improved tolerance characteristic. To verify the characteristics of the proposed ESD protection circuit and to analyze its operating characteristics, we compared and analyzed the characteristics of the existing ESD protection circuit using TCAD simulation. Simulation results show that the proposed protection ESD protection circuit has superior latch-up immunity characteristics like the existing SCR-based ESD protection device HHVSCR (High Holding Voltage SCR). Also, according to the results of the HBM (Human Body Model) maximum temperature test, the proposed ESD protection circuit has a maximum temperature value of 355K, which is about 20K lower than the existing HHVSCR 373K. In addition, the proposed ESD protection circuit with improved electrical characteristics is designed by applying N-STACK technology. As a result of the simulation, the proposed ESD protection circuit has a holding voltage characteristic of 2.5V in a single structure, and the holding voltage increased to 2-STACK 4.2V, 3-STACK 6.3V, 4-STACK 9.1V.

• Journal of Satellite, Information and Communications
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• v.9 no.3
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• pp.15-21
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• 2014

An electrostatic discharge (ESD) protection device, so called, N-type embedded silicon controlled rectifier (NESCR), was analyzed for high voltage operating I/O applications. A conventional NESCR standard device shows typical SCR-like characteristics with extremely low snapback holding voltage, which may cause latch-up problem during normal operation. However, our modified NESCR_CPS_PPW device with proper junction/channel engineering such as counter pocket source (CPS) and partial P-well structure demonstrates highly latch-up immune current-voltage characteristics with high snapback holding voltage and on-resistance.

• Journal of Satellite, Information and Communications
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• v.9 no.2
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• pp.12-17
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• 2014

In this paper, modified EDNMOS device with DPS (double polarity source) structure are suggested to realize stable and robust ESD (electrostatic discharge) protection performance of high voltage operating microchip. This DPS structure inserts the P+ diffusion layer on N+ source side, which in intended to block lateral extension of the electron rich region from N+ source side. Based on our simulation results, the inserted P+ diffusion layer effectively prevents the formation of deep electron channeling induced by high electron injection. As a result, our proposed DPS_EDNMOS devices could overcome the double snapback effect of conventional Std_EDNMOS device.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.7
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• pp.1079-1083
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• 2002

We made ESD tester to measure ESD threshold voltage of semiconductor devices. The HBM ESD test is the most popular method to measure the ESD threshold voltage of MMSIC. We use flyback method which is one of the DC-DC converter to get high ESD voltage. With flvback method, we can isolate the 1ow voltage part from the high voltage part of HBM ESD tester. We use an air gap of the relay which is used for switch to satisfy the rise time of ESD standard(MIL-STD). As a result, with the flyback method and the air gap of relay, we can make ESD tester whose parasitic components are minimized.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.469-472
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• 2002

We made ESD tester to measure ESD threshold voltage of semiconductor devices. The HBM ESD test is the most popular method to measure the ESD threshold voltage of MMIC. We use flyback method which is one of the DC-DC converter to get high ESD voltage. With flyback method, we can isolate the low voltage part from the high voltage part of HBM ESD tester. We use an air gap of the relay which is used for switch to satisfy the rise time of ESD standard(MIL-STll-883D). As a result, with the flyback method and the air gap of relay, we can make ESD tester whose parasitic components are minimized.

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.455-459
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• 2004

Electrostatic discharge(ESD) is a serious reliability concern. It causes approximately most of all field failures of integrated circuits. Inevitably, future IC technologies will shrink the dimensions of interconnects, gate oxides, and junction depths, causing ICs to be increasingly susceptible to ESD-induced damage [1][2][3]. This thesis shows the optimization of the ESD protection circuit based on the tested results of MM (Machine Model) and HBM (Human Body Model), regardless of existing Reference in fully silicided 0.18 um CMOS process. His thesis found that, by the formation of silicide in a source and drain contact, the dimensions around the contact had a less influence on the ESD robustness and the channel width had a large influence on the ESD robustness [8].

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.587-588
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• 2006

This paper presents the new structural zener triggered silicon-controlled rectifier (ZTSCR) electrostatic discharge (ESD) protection circuit. The proposed ESD protection circuit has lower triggering voltage than conventional circuits. The proposed ZTSCR has the triggering voltage of 4V. In the ESD event, this proposed novel ZTSCR ESD protection device could trigger quickly and provide an effective discharging path.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.8
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• pp.587-595
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• 1998

Transient thermal analysis simulations are carried out using a modeling program to understand the human body model HBM ESD. The devices were simulated a one-dimensional device subjected to ESD stress by solving Poison's equation, the continuity equation, and heat flow equation. A ramp rise with peak ESD voltage during rise time is applied to the device under test and then discharged exponentially through the device. LDD and NMOS structures were studied to evaluate ESD performance, snap back voltages, device heating. Junction heating results in the necessity for increased electron concentration in the space charge region to carry the current by the ESD HBM circuit. The doping profile adihacent to junction determines the amount of charge density and magnitude of the electric field, potential drop, and device heating. Shallow slopes of LDD tend to collect the negative charge and higher potential drops and device heating.

• Journal of Satellite, Information and Communications
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• v.10 no.4
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• pp.6-11
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• 2015

The ESD(electrostatic discharge) protection performance of PPS(PMOS pass structure) embedded N-type silicon controlled rectifier(NSCR_PPS) device with different GPNS(Gate to Primary $N^+$ Diffusion Space) structure was discussed for high voltage I/O applications. A conventional NSCR_PPS standard device with FPW(Full P-Well) structure and non-CPS(Counter Pocket Source) implant shows typical SCR-like characteristics with low on-resistance(Ron), low snapback holding voltage(Vh) and low thermal breakdown voltage(Vtb), which may cause latch-up problem during normal operation. However, our proposed NSCR_PPS devices with modified PPW(Partial P-Well) structure and optimal CPS implant demonstrate the improved ESD protection performance as a function of GPNS variation. GPNS was a important parameter, which is satisfied design window of ESD protection device.