• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.10
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• pp.1036-1043
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• 2003

In this paper, novel lumped equivalent circuits for a conventional parallel directional coupler are proposed. This novel equivalent circuits only have self inductance and self capacitance, so we can design exact lumped equivalent circuit. The equivalent circuit and design formula for the presented lumped element coupler is derived based on the even- and odd-mode properties of a parallel-coupled line. By using the derived design formula, we have designed the 3 dB and 10 dB lumped element directional couplers at the center frequency of 100 MHz and 2 GHz, respectively a chip type directional coupler has been designed with multilayer configurations by employing commercial EM simulator. Designed chip-type directional couplers have a 3 dB-coupling value at the center frequency of 2 GHz and fabricated lumped directional coupler on fr4 organic substrate has a 3 dB, 10 dB-coupling values at the center frequency of 100 MHz. Excellent agreements between simulation results and measurement results on the designed directional couplers show the validity of this paper. Furthermore, in order to adapt to multi-layer process such as Low Temperature Cofired Ceramic (LTCC), chip-type lumped element couplers have been designed by using this method.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.8 no.4
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• pp.390-402
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• 1997

The ignition noises from the vehicle are measured and the measurement data are statistically treated for modeling. The low-noise amplifier and band-pass filter are added between the receiver and the three axes antenna for low noise level measurement and the APD and PSD are measured in 800 MHz frequency range. The measured APD curves can be expressed in terms of sensitivity study of each model through 3(class A) or 6(Class B) parameters variation, and these optimal parameter can easily be calculated by using the Composite Approximation Algorithm. The selected APD parameter can be used for making the Data Base EM-environments and also applied to determine the output and sensitivity margin for the transmitter and receiver. 'Digital microwave transmission systems are equipped with equalizer against fading during multipath fading. In this paper, we proposed variable reference tap position equalizer that varies the reference tap according to fading type to archive better performance. We got the perf？mance improvement about 4~5 dB in MP condition and 2~3 dB in NMP condition from simulation results.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.2
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• pp.164-171
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• 2014

Transmit(Tx)/Receive(Rx) dual band operation microstrip array for X-band satellite communications are designed, fabricated, and measured in this paper. The microstrip array antenna has Right Handed Circular Polarization(RHCP) for Tx band and Left Hand Circular Polarization(LHCP) for Rx band. Two stacked patches are used for wideband characteristics and corner-truncated square patches are adopted for a circular polarization. To enhance bandwidth characteristics of a circular polarization, $2{\times}2$ sequential rotation array are applied. From the measured result, $8{\times}12$ microstrip array antennas have a good agreement with those of the simulation. Therefore the array antennas are applicable to military satellite communication antennas.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.6
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• pp.452-458
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• 2017

Multi-layered Waveguide-Below-Cutoff Array(WBCA) used in air duct and water pipe has advantages in manufacturing process as well as flow characteristics. In addition, it is possible to increase the Shielding Effectiveness(SE) by increasing the number of layers. However, since the SE of the multi-layered WBCA can not be predicted by the conventional SE equation, we propose the modified SE equation. The modified SE equation is obtained for both air and arbitrary fluid flowing in a multi-layered WBCA by increasing the number of layers from 2 to 64. In order to confirm the validity, the results of the proposed SE equations are compared with the EM simulation results.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.12
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• pp.1069-1077
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• 2011

In this paper, a design and fabrication of a miniaturized 2.5 GHz 8 W power amplifier using selectively anodized aluminum oxide(SAAO) substrate are presented. The process of SAAO substrate is recently proposed and patented by Wavenics Inc. which uses aluminum as wafer. The selected active device is a commercially available GaN HEMT chip of TriQuint company, which is recently released. The optimum impedances for power amplifier design were extracted using the custom tuning jig composed of tunable passive components. The class-F power amplifier are designed based on EM co-simulation of impedance matching circuit. The matching circuit is realized in SAAO substrate. For integration and matching in the small package module, spiral inductors and single layer capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 40 % and harmonic suppression above 30 dBc for the second(2nd) and the third(3rd) harmonic at the output power of 8 W.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.3
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• pp.432-438
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• 2001

In this paper, after applying Defected Ground Structure(DGS) to DC block, changes of gap and length of λ/4 coupled line are investigated by EM simulation and fabrication. As a result, on condition of the same output with the case using typical DC block, the gap between λ/4 coupled line is widen from 0.1 mm to 0.46 mm by 0.36 mm and the length of λ/4 coupled line gets shorter from 17.7 mm to 13.2 mm by 4.5 mm. Also three type power amplifiers using blocking capacitor, typical DC block and DGS DC block are fabricated and investigated. At first, when S parameter characteristics of each amplifier are considered at frequency band of 3.2 +-0.O5 GHz, every amplifier has similar characteristics of gain and S parameter. Second when the output power of amplifiers is 25 dBm after putting CW signal of 3.2 GHz into three type amplifiers, the difference of dominant signal and 2nd harmonic signal using blocking capacitor, typical DC block and DGS DC block is each -44.83 dBc, -66.84 dBc and -64.33 dBc. Therefore harmonic characteristics of amplifiers using typical DC block and DGS DC block is almost same.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.7
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• pp.671-677
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• 2013

In this paper, we propose a method of near-field analysis for vehicle LF antennas in order to estimate the accurate reading range of a smart key. The LF antenna consists of a ferrite core and a conducting wire which is coated with polyethylene for insulation, and it is mounted at the rear bumper frame of a commercial vehicle. The reading range of a smart key is measured at nine azimuthal directions distributed around the rear bumper, and then, the received power at each maximum reading range is measured by using a spectrum analyzer. The measurement shows that the maximum reading range exists between 1.38 m and 1.53 m, and the radiated power is between -83.6 dBmW and -75.0 dBmW. We further conducted EM simulation to estimate the reading range and the received power under the same condition that we applied for the measurement. The results demonstrate that an accurate reading range and received power can be achieved by simulation.

• Journal of the Korean Society of Hazard Mitigation
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• v.5 no.2 s.17
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• pp.1-8
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• 2005

Microwave tomographic imaging technology using a bi-focusing operator has been developed in order to detect the internal voids/objects inside concrete structures. The imaging system consists of several cylindrical or planar array antennas for transmitting and receiving signals, and a numerical focusing operator is applied to the external signals both in transmitting and in receiving fields. In this study, the authors developed 3-dimensional (3D) electromagnetic (EM) imaging technology to detect such damage and to identify exact location of steel rebars or dowel. The authors have developed sub-surface two-dimensional (2D) imaging technique using tomographic antenna array in previous works. In this study, extending the earlier analytical and experimental works on 2D image reconstruction, a 3D microwave imaging system using tomographic antenna way was developed, and multi-frequency technique was applied to improve quality of the reconstructed image and to reduce background noises. Numerical simulation demonstrated that a sub-surface image can be successfully reconstructed by using the proposed tomographic imaging technology. For the experimental verification, a prototype antenna array was fabricated and tested on a concrete specimen.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.10
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• pp.2359-2366
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• 2014

In this paper, the characteristics of a inset fed rectangular microstrip patch antenna for S-band applications is studied. The variations of return loss along inset length and inset width are investigated on the inset fed rectangular microstrip patch antenna. From the investigated results, the optimized inset fed antenna is designed. At the resonant frequency 2.3 GHz, the optimized dimension of the patch is $45.0mm{\times}40.9mm$. The inset length and width are 14 mm and 1 mm, respectively. The designed antenna is fabricated on the substrate which has a dielectric constant and thickness with 2.5 and 0.787 mm. Simulation results are obtained by a 3D EM(Electromagnetic) solver. The resonant frequency and return loss are measured 2.3025 GHz and -21.11 dB, respectively. The measured and simulated results of the fabricated antenna are in good agreement.