• Applied Chemistry for Engineering
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• v.30 no.1
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• pp.68-73
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• 2019

We prepared hydrophobic silica particles by a sol-gel process from tetraethyl orthosilicate (TEOS), followed by coupling the reaction with octyltrimethoxysilane (OTMS) or hexadecyltrimethoxysilane (HDTMS) under various reaction conditions. We confirmed the extent of silica surface modification with organic compounds by SEM-EDS, thermogravimetry and elemental analysis. The silica particles obtained after the hydrolysis reaction of TEOS in ethanol at $50^{\circ}C$ for 24 h and the coupling reaction with OTMS for 2 h at the same temperature displayed the optimum performance in terms of the dispersity in an organic solvent and the surface roughness of films composited with epoxy resins. The oxygen permeability of the composite film with modified-silica was 12% lower than that of using the film without modified-silica.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.6
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• pp.250-255
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• 2018

The CoCrMo as-built alloys prepared by 3D-printing process are studied on tensile strength, wear resistance, crystal structure and microstructure after complex heat-treatment including HIP. In this study, HIP treatment for removing micropores, ambient heat-treatment for formation of metal carbides, and solution heat-treatment for homogenization of the created metal carbides were tried and characterized for applying to artificial joint. The complex heat-treatment effects of the CoCrMo as-built alloys prepared by 3D-printing process were owing to the densification during HIP, formation of metal carbides and homogenization of the created metal carbides. The effects of the complex heat-treatment were confirmed by XRD, FE-SEM and EDS.

• Nuclear Engineering and Technology
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• v.53 no.1
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• pp.164-171
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• 2021

The europium sorption on Tamusu clay was investigated by batch sorption experiments and spectroscopic study under the condition of strong ionic strength. The results demonstrated that europium sorption on Tamusu clay increased rapidly with pH value, but decreased with the ionic strength of solution increased. The europium sorption also increased in the presence of humic acid, especially at low pH value. The sorption could be fitted by Freundlich isotherm model and the europium sorption on clay was spontaneous and endothermic reaction. Besides, the result indicates that ion exchange was the main process at low pH value, while inner-sphere surface complexation dominated the sorption process at high pH value. The Backscatter electron scanning/Energy Dispersive Spectrometer(BSE/EDS) and the effect of Na for europium sorption results further suggested that europium sorption on Tamusu clay mainly competed with Na at low pH value. Overall, the results in this research were of significance to understand the sorption behavior of europium on the geological media under high ionic strength.

• Journal of Convergence for Information Technology
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• v.12 no.2
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• pp.149-156
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• 2022

In this paper, it was attempted to form a titanium (Ti: Titanium) thin film using the atmospheric pressure plasma process technology for the conductor, which is the main component of the optical sensor. The atmospheric plasma equipment was remodeled. A 4-inch Ti target for sputter was etched using CF4 gas, and the by-product was coated on a glass sample. These by-products were formed up to about 2 cm, and could be divided into 15 areas according to color. Surface shape and constituent elements were analyzed using scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS), respectively. Electrical properties using 4-point probe equipment were also measured. If the process is performed by positioning the sample at about 4.5 mm to 5 mm from the target, a uniform Ti thin film will be deposited. However, it was found that the thin film contained a significant amount of fluorine, which greatly affects the electrical properties of the thin film. Therefore, additional experiments and studies should be performed to remove or minimize fluorine during deposition.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.88-89
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• 2009

In this paper, we investigated about wet cleaning effect as deep trench formation methods for Power chip devices. Deep trench structure was classified by two methods, PSU (Poly Stick Up) and Non-PSU structure. In this paper, we could remove residue defect during wet. cleaning after deep trench etch process for non-PSU structure device as to change wet cleaning process condition. V-SEM result showed void image at the trench bottom site due to residue defect and residue component was oxide by EDS analysis. In order to find the reason of happening residue defect, we experimented about various process conditions. So, defect source was that oxide film was re-deposited at trench bottom by changed to hydrophobic property at substrate during hard mask removal process. Therefore, in order to removal residue defect, we added in-situ SCI during hard mask removal process, and defect was removed perfectly. And WLR (Wafer Level Reliability) test result was no difference between normal and optimized process condition.

• Journal of Electrochemical Science and Technology
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• v.11 no.4
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• pp.346-351
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• 2020

The removal characteristics of copper (Cu) from electrochemical surface by voltage-activated reaction were reviewed to assess the applicability of electrochemical-mechanical polishing (ECMP) process in three types of electrolytes, such as HNO₃, KNO₃ and NaNO₃. Electrochemical surface conditions such as active, passive, transient and trans-passive states were monitored from its current-voltage (I-V) characteristic curves obtained by linear sweep voltammetry (LSV) method. In addition, the oxidation and reduction process of the Cu surface by repetitive input of positive and negative voltages were evaluated from the I-V curve obtained using the cyclic voltammetry (CV) method. Finally, the X-ray diffraction (XRD) patterns and energy dispersive spectroscopy (EDS) analyses were used to observe the structural surface states of a Cu electrode. The electrochemical analyses proposed in this study will help to accurately control the material removal rate (MRR) from the actual ECMP process because they are a good methodology for predicting optimal electrochemical process parameters such as current density, operating voltage, and operating time before performing the ECMP process.

• Journal of the Korean Society of Industry Convergence
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• v.5 no.4
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• pp.367-372
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• 2002

Experimental study was conducted for lapping process after WEDMed specimen. In order to decide the lapping depth of the specimen, the number of the grain size was increased from 400, 600 to 800 to obtain the better surface. Observation of scanning electron microscope, hardness test, surface roughness test and energy dispersive spectrum(EDS) analysis were used for this experimental study. From the comparison and analyses of the results of between the wire-cut electrical discharge machining and the lapping, the following results were obtained. The surface roughness after lapping was found to be improved as increasing the number of lapping process like 1st, 2nd, 3rd lapping and the number of grain size such as 400, 600, 800. The surface hardness after increasing the lapping depth of the specimen was slowly increased. It was found that after 3rd lapping process the hardness was reached the hardness of original base material. It was found that the small amount of coating components within 3% was remained after the 1st lapping process, compared to that approximately 16% after WEDM process.

• Journal of the Korean institute of surface engineering
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• v.55 no.3
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• pp.143-155
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• 2022

Ceramic oxide layers successfully were formed on the surface of cast Al alloys with high Si contents using plasma electrolytic oxidation (PEO) process in electrolytes containing Na₂SiO₃, NaOH, and additives. The microstructure of the oxide layers was systematically analyzed using scanning electron microscopy (SEM), cross-sectional transmission electron microscopy (TEM), X-ray diffraction patterns (XRD), and energy X-ray dispersive spectroscopy (EDS). XRD analysis indicated that the PEO untreated high-silicon Al alloys (i.e., 17.1 and 11.7 wt.% Si) consist of Al, Si and Al₂Cu phases whereas Al₂Cu phase selectively disappeared after PEO treatment. PEO process yielded an amorphous oxide layer with few second phases including γ-Al₂O₃ and Fe-rich phases. The corrosion behaviors of high-silicon Al alloys treated by PEO process were investigated using electrochemical impedance spectroscopy (EIS) and other electrochemical techniques (i.e., open circuit potential and polarization curve). Electroanalytical studies indicated that high-silicon Al alloys treated by PEO process have greater corrosion resistance than high-silicon alloys untreated by PEO process.

• Journal of Conservation Science
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• v.26 no.3
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• pp.269-276
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• 2010

This study aims to extract manufacturing techniques by analysing metallurgical characteristics of the cast-iron pot from Bubjusa, examining corrosion status and microstructure with a optical microscope, SEM-EDS, micro vickers hardness tester and XRD. The microstructure analysis has presented that ferrite and partial portion of pearlite exist within the corroded outer layer. The analysis of the inner layer revealed that there is pearlite and graphite of feather shape. The one of the middle layer, which is placed between outer and inner layer, showed that corrosion has been heavily developed. Micro vickers hardness values range from 217Hv to 698Hv in constituent layers and such values lie within the ranges of the ancient iron relics. The result of EDS analysis for each microstructure presented that the outer layer has been more decarbonized than the inner layer. XRD analysis of iron corrosion compound revealed that Goethite and Hematite had been produced from the corrosive process of iron. The study concludes that the large iron pot was made by casting technique, and microstructure of inner layer had a gray cast iron. Outer layer has been decarbonized through repetitive process of heating and cooling. This results can be used as fundamental data for comparative study to reveal manufacturing techniques of large cast-iron pot.

• Journal of Powder Materials
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• v.19 no.6
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• pp.405-411
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• 2012

Recovery of copper powder from copper chloride solution used in $MoO_3$ leaching process was carried out using a cementation method. Cementation is a simple and economical process, necessitating less energy compared with other recovery methods. Cementation utilizes significant difference in standard reduction potential between copper and iron under standard condition. In the present research, Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated using bench-scale cementation reaction system. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRF, SEM-EDS and laser diffraction and scattering methods. Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99.65% purity and average $1{\mu}m$ in size.