• Bulletin of the Korean Chemical Society
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• v.34 no.8
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• pp.2348-2352
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• 2013

We report a simple electrochemical approach in fabricating multiple colored molybdenum (Mo) oxide bronzes on the surface of a Mo-quartz electrode. A three step electrochemical batch process consisting of linear sweep voltammetry and anodic oxidation followed by cathodic reduction in neutral $K_2SO_4$ electrolyte at different end potentials, viz. -0.62, -0.80 and -1.60 V (vs. $Hg/HgSO_4$) yielded red, blue and yellow colored bronzes. The samples produced were analyzed by XRD, EDS, and SIMS. The color variation was suggested to be associated with the cations intercalation into the oxide formed and the simultaneous structural changes that occurred during the cathodic reduction in neutral aqueous medium.

• Journal of Hydrogen and New Energy
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• v.27 no.3
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• pp.264-269
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• 2016

A simple dry chemical approach was developed in order to load palladium (Pd) as a promoter on Pt/gas diffusion electrode (GDE) for polymer electrolyte membrane fuel cell (PEMFC). Palladium(II) bis (acetylacetonate), $Pd(acac)_2$ was sublimed, penetrated into Pt/GDE and then reduced to Pd nanoparticles simultaneously without any reducing agent and any solvent in a glass reactor of $N_2$ atmosphere at $180^{\circ}C$ for 3, 5 and 15 min. Pd distribution was analyzed by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS), and I-V curve was estimated by using a unit cell with $5{\times}5cm^2$ active area.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.68-68
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• 2008

There are several methods for oxide coating on metals, such as aluminum or carbon nanotubes(CNTs). Usually CVD method is introduced for various oxide coating on CNTs. Another method is electrochemical method which use potential-pH diagram for oxide coating on metal or CNTs. In this experiment, electrochemical coating parameter for oxide coating on aluminum template modified by acids and hydrogen peroxide ($H_2O_2$) were examined. SEM micrographs displayed clearly $Ni(OH)_2$ coating on template. For confirmation of electrochemical method application to EDLC electrode material fabrication, EDS spectrum was analyzed.

• Journal of Surface Science and Engineering
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• v.33 no.4
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• pp.241-250
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• 2000

Popcorn cracking phenomena frequently occur in thin plastic packages during the solder reflow process, which are definitely affected by poor adhesion of Cu-based leadframe to epoxy molding compounds (EMCs). In the present work, in order to enhance the adhesion strength, a brown-oxide treatment on the Cu-based leadframe was carried out and the adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using sandwiched double-cantilever beam (SDCB) specimens. After the adhesion tests, fracture surfaces were analyzed by SEM, AES, EDS and AFM to make the failure path clear. Results showed that failure path was closely related to the oxidation time and the interfacial fracture toughness.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.03a
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• pp.427-430
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• 2008

Electroforming is one of the key technologies for the regenerative thrust chamber of the rocket engine. To use nickel electroforming method for the thrust chamber, direct electroforming of nickel on cupper and the welding method between different materials are needed. Minimizing the internal stress is one of the important factor for making thick electroforming,. Also minimizing contamination(ex. Sulfur containing compound) is another important factor for the stability of quality. This paper includes advanced methods for thick nickel electroforming, those of strength test results and EDS/EPMA inspection results. Advanced for electroforming process makes the achievement of Electro-beam welding between Inconel718(Manifold) and Nickel Electroforming. This paper also includes the influence of the electroforming precipitation angle on strength. Thus advanced electroforming improvement processes and the test results make achievement for manufacturing of the regenerative thrust chamber with direct nickel thick electroforming on cupper materials.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2012.10a
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• pp.131-132
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• 2012

The vacuum plasma coating was performed to analysis the characteristic and find the optimum process conditions for the vacuum plasma spray coating. It was observed that the square shape of powder in case of carbide ceramics does not fluidize well compared to the round shape of powder in case of oxide ceramics so that the plasma spraying is not uniform. The analysis through SEM and EDS mapping shows that the coatings represent excellent structural features with strong resistance against oxidation and satisfied result with vacuum plasma coating.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.152-154
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• 2005

Austenitic stainless steel has good weldability but is sensitive to hot cracking such as solidification crack and liquation crack. In this study, the specimens of dissimilar metals made between austenitic stainless steel and Al-brass were welded by GTAW process using four different filler metals. Cracks were detected in the heat-affected zone of the stainless steel when welded with CuAl, CuSn and NiCu filler metals, but no cracks were detected a Ni filler metal was used. The cracks propagated along the grain boundary in the heat affected zone near the fusion line to base metal of 316L stainless steel. The cracks were located inside the weld bead with very fine hairline crack. All cracks initiated at the fusion line and moved forward in the base metal. From energy dispersion spectroscopy (EDS), Cu peak was detected only in the crack-opening area.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.24-24
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• 2009

ENIG(Electroless Nickel Immersion Gold) is the surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. In this paper, we have studied the effect of P content variation during ENIG process on those phenomena related to the solder joint. The effect of P content was discussed using the results obtained from FE-SEM, EPMA, EDS and FIB. Finally, it was concluded that the more P-content in Ni layer, the thicker P-rich layer.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.8 no.6
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• pp.35-40
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• 2008

High performance light emitting diodes(LEDs) have been developed using GaN-based materials grown on sapphire substrates in recent years. Although these LEDs are already commercially available, we have to consider electrostatic discharge(ESD) damage related to both basic materials of diode and miniaturization of LEDs. ESD damage is one of the important parameters influencing reliability of the light emitting devices. We investigated mass production of GaN-based LEDs suffered from ESD during production process and present the solutions in order to improve the ESD problem. Most of EDS problems were controlled by using instruments properly and improvement of the process circumstances as well.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.486-486
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• 2009

In this paper, the current-voltage (I-V) curves, such as linear sweep voltammetry (LSV) and cyclic voltammetry (CV), were employed to evaluate the effect of electrolyte concentration on the electrochemical reaction trend. From the I-V curve, the electrochemical states of active, passive, transient and trans-passive could be characterized. And then, we investigated that how this chemical affect the process of voltage-induced material removal in electrochemical mechanical polishing (ECMP) of Copper. The scanning electron microscopy (SEM) and energy dispersive spectroscopy EDS) analyses were used to observe the surface profile. Finally, we monitored the oxidation and reduction process of the Cu surface by the repetition of anodic and cathodic potential from cyclic voltammetry (CV) method in acid- and alkali-based electrolyte. From these analyses, it was important to understand the electrochemical mechanisms of the ECMP technology.