Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2009.11a
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- Pages.24-24
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- 2009
A study of properties for phosphorous content of ENIG against Sn-3Ag-0.5Cu solders
Sn-3Ag-0.5Cu solder에 대한 무전해 Ni-P층의 P함량에 따른 특성 연구
- Shin, An-Seob (Samsung Electro-Mechanics) ;
- Ok, Dae-Yool (Samsung Electro-Mechanics) ;
- Jeong, Gi-Ho (Samsung Electro-Mechanics) ;
- Park, Chang-Sik (Samsung Electro-Mechanics) ;
- Kim, Min-Ju (Samsung Electro-Mechanics) ;
- Heo, Cheol-Ho (Samsung Electro-Mechanics) ;
- Kong, Jin-Ho (Samsung Electro-Mechanics)
- Published : 2009.11.12
Abstract
ENIG(Electroless Nickel Immersion Gold) is the surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. In this paper, we have studied the effect of P content variation during ENIG process on those phenomena related to the solder joint. The effect of P content was discussed using the results obtained from FE-SEM, EPMA, EDS and FIB. Finally, it was concluded that the more P-content in Ni layer, the thicker P-rich layer.