Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Effect of copper surface to $HNO_3$ and $KNO_3$ electrolyte

$KNO_3$와 $HNO_3$ 전해액이 Cu에 미치는 영향

  • Seo, Yong-Jin (School of Fusion Technology, Daebul Univ.) ;
  • Han, Sang-Jun (Nano Information Materials & Devices Lab., Deabul. Univ.) ;
  • Park, Sung-Woo (Nano Information Materials & Devices Lab., Deabul. Univ.) ;
  • Lee, Young-Kyun (School of Mechanical Engineering, Pusan National Univ.) ;
  • Lee, Sung-Il (Nano Information Materials & Devices Lab., Deabul. Univ.)
  • 서용진 (대불대학교 융합기술학부) ;
  • 한상준 (대불대학교 나노정보소재연구소) ;
  • 박성우 (대불대학교 나노정보소재연구소) ;
  • 이영균 (부산대학교 기계공학부) ;
  • 이성일 (대불대학교 나노정보소재연구소)
  • Published : 2009.06.18
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Abstract

In this paper, the current-voltage (I-V) curves, such as linear sweep voltammetry (LSV) and cyclic voltammetry (CV), were employed to evaluate the effect of electrolyte concentration on the electrochemical reaction trend. From the I-V curve, the electrochemical states of active, passive, transient and trans-passive could be characterized. And then, we investigated that how this chemical affect the process of voltage-induced material removal in electrochemical mechanical polishing (ECMP) of Copper. The scanning electron microscopy (SEM) and energy dispersive spectroscopy EDS) analyses were used to observe the surface profile. Finally, we monitored the oxidation and reduction process of the Cu surface by the repetition of anodic and cathodic potential from cyclic voltammetry (CV) method in acid- and alkali-based electrolyte. From these analyses, it was important to understand the electrochemical mechanisms of the ECMP technology.

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