• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Journal of information and communication convergence engineering
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• v.5 no.3
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• pp.215-218
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• 2007

In this paper, amorphous semiconductor and insulator thin film are etched using reactive ion etcher. At that time, we experiment in various RIE conditions (chamber pressure, gas flow rate, rf power, temperature) that have effects on quality of thin film. The using gases are $CF_4,\;CF_4+O_2,\;CCl_2F_2,\;CHF_3$ gases. The etching of a-Si:H thin film use $CF_4,\;CF_4+O_2$ gases and the etching of $a-SiO_2,\;a-SiN_x$ thin film use $CCl_2F_2,\;CHF_3$ gases. The $CCl_2F_2$ gas is particularly excellent because the selectivity of between a-Si:H thin film and $a-SiN_x$ thin film is 6:1. We made precise condition on dry etching with uniformity of 5%. If this dry etching condition is used, that process can acquire high yield and can cut down process cost.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.505-511
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• 2014

In this paper, silver pastes were printed on polyethylene terephthalate (PET) film using screen printing and evaluated the drying characteristics by using dry oven and NIR drying system. The printed Ag films were dried at $140^{\circ}C$ and the drying time was changed from 10 to 90 seconds. To evaluate the electrical properties of printed Ag film, sheet resistance was compared. The sheet resistance of the dried thin silver film by using NIR drying system more rapidly decreased. To clarify this phenomena, the morphology and component of the dried surfaces were measured by using the scanning electron microscope (SEM) and the energy dispersive X-ray Spectroscopy (EDX), respectively. In the EDX measurement results, the oxidation of the surface was observed in the dried thin film by using the dry oven. The NIR drying system is more applicable than conventional hot air drying to apply continuous printing system.

• Imaging Science in Dentistry
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• v.42 no.4
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• pp.243-247
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• 2012

Purpose: This study was performed to compare the inverted digital images and film-based images of dry pig mandibles to measure the periodontal bone defect depth. Materials and Methods: Forty 2-wall bone defects were made in the proximal region of the premolar in the dry pig mandibles. The digital and conventional radiographs were taken using a Schick sensor and Kodak F-speed intraoral film. Image manipulation (inversion) was performed using Adobe Photoshop 7.0 software. Four trained examiners made all of the radiographic measurements in millimeters a total of three times from the cementoenamel junction to the most apical extension of the bone loss with both types of images: inverted digital and film. The measurements were also made in dry mandibles using a periodontal probe and digital caliper. The Student's t-test was used to compare the depth measurements obtained from the two types of images and direct visual measurement in the dry mandibles. A significance level of 0.05 for a 95% confidence interval was used for each comparison. Results: There was a significant difference between depth measurements in the inverted digital images and direct visual measurements (p>|t|=0.0039), with means of 6.29 mm ($IC_{95%}$:6.04-6.54) and 6.79 mm ($IC_{95%}$:6.45-7.11), respectively. There was a non-significant difference between the film-based radiographs and direct visual measurements (p>|t|=0.4950), with means of 6.64mm($IC_{95%}$:6.40-6.89) and 6.79mm($IC_{95%}$:6.45-7.11), respectively. Conclusion: The periodontal bone defect measurements in the inverted digital images were inferior to film-based radiographs, underestimating the amount of bone loss.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.379-380
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• 2008

This paper presents a wafer-level package using a Dry Film Resist(DFR) for RF MEMS devices. Vertical interconnection is made through the hole formed on the glass cap. Bonding using the DFR has not only less effects on the surface roughness but also low process temperature. We used DFR as adhesive polymer and made the vertical interconnection through Au electroplating. Therefore, we developed a wafer-level package that is able to be used in RF MEMS devices and vertical interconnection.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• 대한방사선치료학회:학술대회논문집
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• 2001.06a
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• pp.17-17
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• 2001

• Journal of Korean Ophthalmic Optics Society
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• v.13 no.1
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• pp.15-20
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• 2008

Purpose: To study on the confidence of dry eye diagnosis methods which need to prescribe contact lens. Methods: Non-invasive tear film break-up time (NIBUT) and tear film break-up time (TBUT) were measured in forty healthy subjects in their 20s, and then the subjects were classified into normal eye and dry eye. The results of McMonnies questionnaire, tear prism height measurement, Hardtack test, blink rate measurement and Schirmer test were compared with the results of NIBUT and TBUT. Results: The results of NIBUT and TBUT were as follows; 20 subjects had normal eyes, 10 subjects had dry eyes in both NIBUT and TBUT, and 10 subjects showed different results. In McMonnies questionnaire, the score of normal eye group averaged 8.2 and that of dry eye group averaged 18.5, which showed statistically significant difference. Furthermore, 100% of normal eye group classified by the results of NIBUT and TBUT corresponded with the result of McMonnies questionnaire and 90% of dry eye group showed the correspondence. Tear prism height of normal eye group averaged 0.32 mm and that of dry eye group averaged 0.23 mm, which were significantly different. Hardtack test, blink rate measurement and Schirmer test without local anesthesia showed no statistically significant difference between normal eye group and dry eye group. Conclusions: On dry eye diagnosis methods, the results of McMonnies questionnaire and tear prism height measurement had close correlation with the results of NIBUT and TBUT.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.38 no.2
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• pp.133-138
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• 2012

The purpose of this study was to examine the correlation between physical properties of dried coacervate films and dry feel for shampoo composition. Simple shampoo compositions were made of two different cationic charge density polymers in the same surfactant compositions. The simple shampoo compositions were diluted with distilled water to make coacervate. Formed coacervate was collected by centrifuge (3,000 rpm, 30 min). Coacervate was coated on the glass plates and dried in drying oven (for 1 h, $50^{\circ}C$) to make the thin film. We carried out an experiment on measurement of contact angle, moisture loss ratio and SEM image analysis of the dried coacervate film. Dry feelings of the shampoos were evaluated by panel using hair tresses. Results show that the properties of dried coacervate films affect the dry feel of the after shampooing.

• Applied Chemistry for Engineering
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• v.24 no.6
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• pp.593-598
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• 2013

In this study, we have evaluated the water absorption phenomenon of photoresist dry film, which is commonly used to build circuits on PCB (Printed Circuit Board) by photolithography, by using ATR-FTIR (Attenuated Total Reflectance-Fourier Transform Infrared). We have firstly observed significant change in fracture mode of dry film with respect to temperature and humidity, which we assumed the material transition from ductile to brittle. Secondly, we have established the process of absorption test for determining the diffusion coefficients of water into the dry film both with gravimeter and ATR-FTIR. We have successfully calculated the diffusion coefficients for each environmental conditions from the results which we achieved by gravimeter and ATR-FTIR. Compared to the gravimeter which is a conventional method for absorption test, the ATR-FTIR method in this study has been found to be very easy to use and have the same accuracy as gravimeter. Moreover, we are expecting to use the ATR-FTIR as an appropriate method to study the absorption phenomena related to any kinds of solvent and polymer system.