• 한국기계가공학회지
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• 제18권3호
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• pp.109-115
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• 2019

The purpose of this study was to analyze and test the flow rate of a 1-inch ball valve used in a thermal power plant. To identify the flow-rate characteristics, numerical analysis was conducted and an experimental apparatus of the valve flow rate coefficient was used to compare the flow coefficient Cv values. To determine the internal pressure distribution, the sites of opening ball valves and flow fields were investigated. In particular, a smaller the valve opening resulted in a more complicated the flow field of the ball. The valve flow characteristic test showed that the Cv value and flow rate increased with increasing valve-opening rate and the secondary function was performed. The pressure drop increased as the valve opening rate decreased. In addition, the experimental results for the flow analysis are similar to the numerical analysis results.

• 한국입자에어로졸학회지
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• 제15권4호
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• pp.173-182
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• 2019

Since airborne viruses have been known to aggravate indoor air quality, studies on the development of anti-viral air filter increase recently. In this study, the pressure drop and anti-viral efficiency of TiO₂ coated ceramic ball filter were evaluated. After the filter being inserted into a commercial room air cleaner, chamber test with aerosolized bacteriophage MS2 was performed. The porosity of TiO₂ coated ceramic ball filter was 0.85, and pressure drop was about 13 Pa for 1 m/s of air velocity. The anti-viral efficiency was about 93% when the reaction time was 25 minutes in a 1 ㎥ chamber.

• 한국안광학회지
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• 제16권3호
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• pp.229-235
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• 2011

목적: 본 연구에서는 안경 착용자들이 안경렌즈의 파손으로 인한 안전사고에 노출될 수 있다는 점에 착안하여 국내에 유통되고 있는 안경렌즈의 내충격성을 평가하고자 하였다. 방법: 국내에 유통되고 있는 4개 회사의 제품으로 NK55(${n_{d}}$ = 1.56)소재의 굴절력 -3D, -6D, +3D, +6D를 가지는 안경렌즈 중 코팅을 통한 강화처리를 하지 않은 160개의 안경렌즈를 대상으로 하여 강철구 낙하 시험(Drop Ball Test)을 실시하였다. 즉, 미국 FDA의 기준에 따라 이들 안경렌즈에 약 16 g의 강철구를 높이 127 cm에서 자유낙하 시킨 후 렌즈의 표면형태를 관찰하였다. 결과: 본 연구에서 사용한 다른 4곳 회사에서 제조되는 안경렌즈의 중심두께는 같은 굴절률과 굴절력을 가짐에도 불구하고 그 수치가 동일하지는 않은 것으로 조사되었다. 강철구 낙하시험에서 렌즈 표면에 균열이나 깨짐이 없는 것을 적합한 안전성을 가진 렌즈로 규정하였을 때 +3D, +6D의 볼록렌즈는 모두 안전한 렌즈로 판단되었다. 그러나 상대적으로 중심두께가 얇은 오목 렌즈의 경우 강철구 낙하 시험을 수행하였을 때 렌즈의 깨짐 현상이 두드러지게 나타남을 확인할 수 있었다. 특히 -3D, -6D 오목렌즈의 경우 전체 80개 중 73.8%에 해당하는 59개가 미국 FDA 기준에 부적합한 렌즈로 나타났다. 결론: 본 결과로 미루어 볼 때 안경 구매시 시력교정과 더불어 미적인 면과 가격적인 면도 중요하지만 안경 렌즈의 파손에 의한 사고 또한 무시할 수 없는 사항이라 여겨졌다. 따라서 국내에서도 안경렌즈로 인한 안전사고의 방지를 위하여 강철구 낙하 시험의 의무적인 시행과 더불어 이의 철저한 확인이 시급하다고 판단할 수 있었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.65-69
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• 2010

In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

• Tribology and Lubricants
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• 제27권3호
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• pp.140-146
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• 2011

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

• 마이크로전자및패키징학회지
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• 제15권4호
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• pp.77-86
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• 2008

본 연구에서는 유연솔더인 63Sn37Pb와 무연 솔더인 95.5Sn4.0Ag0.5Cu와 97Sn2.5Ag0.5Cu BGA(Ball Grid Array) 패키지를 인쇄회로기판(Printed Circuit Board, PCB)에 위치에 따라 장착하고 보드레벨의 낙하시험(Board Level Drop Test)을 실시하여 충격에 대한 유 무연 솔더의 특성을 분석하였고 4점굽힘시험(board Level 4-point Bending Test)을 실시하여 굽힘에 대한 솔더볼의 기계적 저항특성을 분석하였다. 또한 유한요소법(Finite Element Modeling, FEM)을 이용해 낙하시험과 4점굽힘시험에서 솔더 조인트에 미치는 응력과 변형률을 해석하였으며, 시험 설계 시에 솔더 조인트의 응력변화에 영향을 미칠 수 있는 변수를 고려하여 해석하고 결과를 비교 분석하였다. 낙하시험과 4점굽힘시험에서 모두 무연솔더는 유연솔더보다 2배 이상 높은 신뢰성을 보였으며, PCB의 중앙에 위치한 패키지는 외각에 위치한 패키지 보다 매우 낮은 신뢰성을 보였다. 유한요소법을 통해 해석한 결과 최외각 솔더에서 가장 큰 응력이 발생하였고, 솔더의 조성과, 시험설계변수에 의해 응력의 발생 정도가 다름을 나타내었다.

• Journal of Welding and Joining
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• 제5권1호
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• pp.57-63
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• 1987

A method which can be used for evaluating slag detachability is proposed in this study. The proposed method was intended to get an absolute value for slag detachability, to give consistent value for a given welded joint, and finally to be simple to test. With a test fig made in this study, an impact by dropping a steel ball (13Kg in weight) is applied on the back side of an as-welded plate having a slag layer on the weld bead. Such impact applied forces the slag to drop off from the bead surface. In order to make a quantitative evaluation the amount of slag removed was measured with increasing the number of drops. Using this method six kinds of fluxes were evaluated in terms of the effects of flux type, basicity and weding variables on the slag detachability. As an initial result of this test, it was found that welding heat input affects the detachability significantly. Most importantly the evaluation made using the presently proposed method gives the same order of ranking as that of the actual practice done by a welder.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1552-1557
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• 2004

Characteristics diffusion time of viscoelastic fluids are determined experimental results of terminal velocity by using the falling ball viscometer. The characteristics diffusion time of viscoelastic fluids are determined with help of the sphere device which is installed to return the dropped sphere from the bottom of the test cylinder without disturbing the working fluids. Terminal velocity of th sphere the reason why experimental of characteristics diffusion time that it is have an effect on the time interval of the measuring. Viscous of the fluid the temperature changed in order to have an effect on temperature and terminal velocity of the ball it becomes larger the possibility of knowing. A result of visualization for flow phenomena of around the sphere uses the PIV and the density of the polymer solution which it appears 2000wppm is to a case which is the right and left becomes symmetry to be it will be able to confirm and according to the time interval, to observed velocity vector of same at first drop the sphere.