• JSTS:Journal of Semiconductor Technology and Science
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• 제9권3호
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• pp.136-147
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• 2009

In this paper we analyze the influence of source/drain (S/D) extension region design for minimizing short channel effects (SCEs) in 25 nm gate length single and double gate Silicon-on-Insulator (SOI) and Germanium-on-Insulator (GOI) MOSFETs. A design methodology, by evaluatingm the ratio of the effective channel length to the natural length for the different devices (single or double gate FETs) and technology (SOI or GOI), is proposed to minimize short channel effects (SCEs). The optimization of non-overlapped gate-source/drain i.e. underlap channel architecture is extremely useful to limit the degradation in SCEs caused by the high permittivity channel materials like Germanium as compared to that exhibited in Silicon based devices. Subthreshold slope and Drain Induced Barrier Lowering results show that steeper S/D gradients along with wider spacer regions are needed to suppress SCEs in GOI single/double gate devices as compared to Silicon based MOSFETs. A design criterion is developed to evaluate the minimum spacer width associated with underlap channel design to limit SCEs in SOI/GOI MOSFETs.

• Journal of information and communication convergence engineering
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• 제10권2호
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• pp.200-204
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• 2012

This study has presented the analysis of breakdown voltage for a double-gate metal-oxide semiconductor field-effect transistor (MOSFET) based on the doping distribution of the Gaussian function. The double-gate MOSFET is a next generation transistor that shrinks the short channel effects of the nano-scaled CMOSFET. The degradation of breakdown voltage is a highly important short channel effect with threshold voltage roll-off and an increase in subthreshold swings. The analytical potential distribution derived from Poisson's equation and the Fulop's avalanche breakdown condition have been used to calculate the breakdown voltage of a double-gate MOSFET for the shape of the Gaussian doping distribution. This analytical potential model is in good agreement with the numerical model. Using this model, the breakdown voltage has been analyzed for channel length and doping concentration with parameters such as projected range and standard projected deviation of Gaussian function. As a result, since the breakdown voltage is greatly changed for the shape of the Gaussian function, the channel doping distribution of a double-gate MOSFET has to be carefully designed.

• 대한전자공학회논문지SD
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• 제45권2호
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• pp.1-6
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• 2008

Long-channel Asymmetric Double-Ga(ADG) MOSFET의 해석적 문턱전압 모델을 제시한다. 본 모델은 채널 도핑과 채널의 양자효과까지 고려하였으며 더 나아가 문턱전압 영역에서 potential 분포의 선형특성을 이용하여 기존의 모델보다 간단하면서도 정확한 접근을 가능하게 하였다. 개발한 모델의 정확도는 다양한 실리콘 필름의 두께, 채널 도핑, 그리고 산화막 두께 변화에 대하여 numerical 시뮬레이션 결과와 비교하여 검증하였다.

• Journal of information and communication convergence engineering
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• 제5권1호
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• pp.45-49
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• 2007

The analytical transport model in subthreshold regime for double gate MOSFET has been presented to analyze the short channel effects such as subthreshold swing, threshold voltage roll-off and drain induced barrier lowering. The present approach includes the quantum tunneling of carriers through the source-drain barrier. Poisson equation is used for modeling thermionic emission current, and Wentzel-Kramers-Brillouin approximations are applied for modeling quantum tunneling current. This model has been used to investigate the subthreshold operations of double gate MOSFET having the gate length of the nanometer range with ultra thin gate oxide and channel thickness under sub-20nm. Compared with results of two dimensional numerical simulations, the results in this study show good agreements with those for subthreshold swing and threshold voltage roll-off. Note the short channel effects degrade due to quantum tunneling, especially in the gate length of below 10nm, and DGMOSFETs have to be very strictly designed in the regime of below 10nm gate length since quantum tunneling becomes the main transport mechanism in the subthreshold region.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권2호
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• pp.170-177
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• 2008

In the present work a methodology to minimize short channel effects (SCEs) by modulating the effective channel length is proposed to design 25 nm single and double gate-source/drain underlap MOSFETs. The analysis is based on the evaluation of the ratio of effective channel length to natural/ characteristic length. Our results show that for this ratio to be greater than 2, steeper source/drain doping gradients along with wider source/drain roll-off widths will be required for both devices. In order to enhance short channel immunity, the ratio of source/drain roll-off width to lateral straggle should be greater than 2 for a wide range of source/drain doping gradients.

• Structural Engineering and Mechanics
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• 제74권3호
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• pp.445-455
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• 2020

Shear lag phenomenon has long been taken into consideration in various structural codes; however, the AISC provisions have not proposed any specific equation to calculate the shear lag ratio in some cases such as fillet-welded connections of front-to-front double channel sections. Moreover, those equations and formulas proposed by structural codes are based on the studies that were conducted on riveted and bolted connections, and can be applied to single channel sections whilst using them for fillet-welded double channels would be extremely conservative due to the symmetrical shape and the fact that bending moments will not develop in the gusset plate, resulting in less stress concentration. Numerical models are used in the present study to focus on parametric investigation of the shear lag effect on fillet-welded tension connection of double channel section to a gusset plate. The connection length, the eccentricity of axial load, the free length and the thickness of gusset plate are considered as the key factors in this study. The results are then compared to the estimates driven from the AISC-LRFD provisions and alternative equations are proposed.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.691-694
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• 2003

Density gradient method is used to analyze the quantum effect in MOSFET, Quantization effect in the poly gate leads to a negative threshold voltage shift, which is opposed to the positive shift caused by quantization effect in the channel. Quantization effects in the poly gate are investigated using the density gradient method, and the impact on the short channel effect of double gate device is more significant.

• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2008년도 정보통신설비 학술대회
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• pp.429-432
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• 2008

In this paper, performance of a double binary turbo coded ultra wide band (UWB) system is analyzed and simulated in an indoor wireless channel. Binary pulse position modulation-time hopping (BPPM-TH) signals are considered. The indoor wireless channel is modeled as a modified Saleh and Valenzuela (SV) channel. The performance is evaluated in terms of bit error probability (BER). From the simulation results, it is seen that double binary turbo coding offers considerable coding gain with reasonable encoding complexity. It is also demonstrated that the performance of the UWB system can be substantially improved by increasing the number of iterations.

• 한국정보통신학회논문지
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• 제19권3호
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• pp.581-586
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• 2015

본 연구에서는 비대칭 이중게이트 MOSFET의 채널길이와 채널두께의 비에 따른 문턱전압이하 스윙의 변화를 분석하고자한다. 비대칭 이중게이트 MOSFET는 상하단 게이트 구조를 달리 제작할 수 있어 단채널효과를 제어할 수 있는 요소가 증가한다는 장점이 있다. 특히 채널길이를 감소하였을 경우 문턱전압이하 스윙의 급격한 증가로 인한 특성저하 현상을 감소시킬 수 있다. 그러나 스켈링 이론에 따라 채널길이 감소에 따라 채널두께도 변화되어야하며 이에 문턱전압이하 스윙이 변화하게 된다. 그러므로 채널길이와 채널두께의 비가 문턱전압이하 스윙을 결정하는 중요 요소가 된다. 해석학적으로 문턱전압이하 스윙을 분석하기 위하여 해석학적 전위분포를 포아송방정식을 통하여 유도하였으며 다양한 채널길이 및 채널두께에 대하여 전도중심과 문턱전압이하 스윙을 계산한 결과 채널길이와 채널두께의 비에 따라 전도중심과 문턱전압이하 스윙이 변화한다는 것을 알 수 있었다.

• 한국정보통신학회논문지
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• 제19권1호
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• pp.163-168
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• 2015

본 연구에서는 10 nm이하 채널길이를 갖는 비대칭 이중게이트 MOSFET의 하단 게이트 전압에 대한 터널링 전류(tunneling current)의 변화에 대하여 분석하고자한다. 단채널 효과를 감소시키기 위하여 개발된 다중게이트 MOSFET중에 비대칭 이중게이트 MOSFET는 채널전류를 제어할 수 있는 요소가 대칭형의 경우보다 증가하는 장점을 지니고 있다. 그러나 10nm 이하 채널길이를 갖는 비대칭 이중게이트 MOSFET의 경우, 터널링 전류에 의한 차단전류의 증가는 필연적이다. 본 연구에서는 차단전류 중에 터널링 전류의 비율을 계산함으로써 단채널에서 발생하는 터널링 전류의 영향을 관찰하고자 한다. 포아송방정식을 이용하여 구한 해석학적 전위분포와 WKB(Wentzel-Kramers-Brillouin) 근사를 이용하여 터널링 전류를 구하였다. 결과적으로 10 nm이하의 채널길이를 갖는 비대칭 이중게이트 MOSFET에서는 하단 게이트 전압에 의하여 터널링 전류가 크게 변화하는 것을 알 수 있었다. 특히 채널길이, 상하단 산화막 두께 그리고 채널두께 등에 따라 매우 큰 변화를 보이고 있었다.