• Journal of Magnetics
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• 제16권1호
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• pp.15-18
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• 2011

We have studied the $TiO_2$ doping effects on the flux pinning behavior of an $MgB_2$ superconductor synthesized by the in-situ solid-state reaction. From the field-cooled and zero-field-cooled temperature dependences of magnetization, the reversible-irreversible transition of $TiO_2$-doped $MgB_2$ was determined in the H-T diagram (the temperature dependence of upper critical magnetic field and irreversibility line). For comparison, the similar measurements are also obtained from SiC-doped $MgB_2$. The critical current density was estimated from the width of hysteresis loops in the framework of Bean's model at different temperatures. The obtained results manifest that nano-scale $TiO_2$ inclusions served as effective pinning centers and lead to the enhanced upper critical field and critical current density. It was concluded that the grain boundary pinning mechanism was realized in a $TiO_2$-doped $MgB_2$ superconductor.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권2호
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• pp.170-177
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• 2008

In the present work a methodology to minimize short channel effects (SCEs) by modulating the effective channel length is proposed to design 25 nm single and double gate-source/drain underlap MOSFETs. The analysis is based on the evaluation of the ratio of effective channel length to natural/ characteristic length. Our results show that for this ratio to be greater than 2, steeper source/drain doping gradients along with wider source/drain roll-off widths will be required for both devices. In order to enhance short channel immunity, the ratio of source/drain roll-off width to lateral straggle should be greater than 2 for a wide range of source/drain doping gradients.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 하계종합학술대회논문집
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• pp.465-468
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• 1998

For porous silicon layer to be used as active layer in various devices, it is necessary to be formed locally along with a designed pattern on the wafer. However, there is still no suitable masking layer to withstand against the high concentration of HF for a time of some minutes up to some hours during the anodic process effectively. In this work, we investigated the property of selectivity between p$^{+}$ and n layers to form localized porous silicon even without a mask by the difference of the anodic I-V characteristics on the doping level and doping type. The width of the pattern made in the sample was 2mm, and the formed porous silicon layer was observed by SEM to see the morphology on the cross section below the surface. As the results, it was found that the selectivity was reasonable for the pattern size over 100.mu.m.m.

• 한국신뢰성학회지:신뢰성응용연구
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• 제10권1호
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• pp.65-71
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• 2010

NAND-type SONOS with a separated double-gate FinFET structure (SDF-Fin SONOS) flash memory devices are proposed to reduce the unit cell size of the memory device and increase the memory density in comparison with conventional non volatile memory devices. The proposed memory device consists of a pair of control gates separated along the direction of the Fin width. There are two unique alternative technologies in this study. One is a channel doping method and the other is an oxide thickness variation method, which are used to operate the SDF-Fin SONOS memory device as two-bit. The fabrication processes and the device characteristics are simulated by using technology comuter-adided(TCAD). The simulation results indicate that the charge trap probability depends on the different channel doping concentration and the tunneling oxide thickness. The proposed SDG-Fin SONOS memory devices hold promise for potential application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1337-1339
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• 1998

The trench termination scheme is introduced for high voltage devices. The curvature of the depletion region at field limiting ring is critical factor to determine the breakdown voltage. The smooth curvature of the depletion junction alleviate the electric field crowding effect around this region. In the trench field limiting ring, the radius of the depletion region is smaller than conventional field limiting ring, but the distance between every trench is spaced small enough to punchthrough before initiation of local breakdown. The trench field limiting ring on silicon can ne formed by RIE followed by oxidation on side wall surface of the trench, and polysilicon filling. The combined termination of this trench floating field ring and field plate have been designed and analyzed. The breakdown simulation by 2-dimensional TCAD shows that the cylindrical junction breakdown voltage for substrate doping might be 99 percent of the ideal breakdwon voltage for substrate doping concentration of $3\times10^{14}cm^{-3}$ with about $100{\mu}m$ of lateral termination width.

• 전자공학회논문지 IE
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• 제44권1호
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• pp.10-14
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• 2007

InP의 전자와 정공의 이온화계수로부터 추출한 유효이온화계수를 이용하여 InP 다이오드의 항복전압을 위한 해석적 표현식을 유도하였다. 해석적 항복전압 결과를 $N_D=6\times10^{14}cm^{-3}\sim3\times10^{17}cm^{-3}$의 도핑 농도에서 수치적 결과 및 실험 결과와 비교하였다. 각 농도에 따른 해석적 항복전압은 수치 해석적 결과와 매우 잘 일치하였고, 실험 결과와는 10% 이내의 오차로 잘 일치하였다.

• 한국진공학회지
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• 제22권5호
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• pp.238-244
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• 2013

태양전지 제조공정에서 열처리로 레이저를 사용하는 도핑공정은 태양전지의 성능을 결정짓는 중요한 요소이다. 그러나 퍼니스를 이용하는 공정에서는 선택적으로 고농도(Heavy) 도핑영역을 형성하기가 어렵다. 레이저를 사용한 선택적 도핑의 경우 고가의 레이저 장비가 요구되어지며, 레이저 도핑 후 고온의 에너지로 인한 웨이퍼의 구조적 손상 문제가 발생된다. 본 연구는 저가이면서 코로나 방전 구조의 대기압 플라즈마 소스를 제작하였고, 이를 통한 선택적 도핑에 관한 연구를 하였다. 대기압 플라즈마 제트는 Ar 가스를 주입하여 수십 kHz 주파수를 인가하여 플라즈마를 발생시키는 구조로 제작하였다. P-type 웨이퍼(Cz)에 인(P)이 shallow 도핑 된(120 Ohm/square) PSG (Phosphorus Silicate Glass)가 제거되지 않은 웨이퍼를 사용하였다. 대기압 플라즈마 도핑 공정 처리시간은 15 s와 30 s이며, 플라즈마 전류는 40 mA와 70 mA로 처리하였다. 웨이퍼의 도핑프로파일은 SIMS (Secondary Ion Mass Spectroscopy)측정을 통하여 분석하였으며, 도핑프로파일로 전기적 특성인 면저항(sheet resistance)을 파악하였다. 도펀트로 사용된 PSG에 대기압 플라즈마 제트로 도핑공정을 처리한 결과 전류와 플라즈마 처리시간이 증가됨에 따라 도핑깊이가 깊어지고, 면저항이 향상하였다. 대기압 플라즈마 도핑 후 웨이퍼의 표면구조 손상파악을 위한 SEM (Scanning Electron Microscopy) 측정결과 도핑 전과 후 웨이퍼의 표면구조는 차이가 없음을 확인하였으며, 대기압 플라즈마 도핑 폭도 전류와 플라즈마 처리시간이 증가됨에 따라 증가하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.19-22
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• 2003

In this paper, a new small size Lateral Trench Electrode Power MOSFET with local doping is proposed. This new structure is based on the conventional lateral power MOSFET. The entire electrodes of proposed device are placed in trench oxide. The forward blocking voltage of the proposed device is improved by 3.3 times with that of the conventional lateral power MOSFET. The forward blocking voltage of proposed device is about 500V. At the same size, a increase of the forward blocking voltage of about 3.3 times relative to the conventional lateral power MOSFET is observed by using TMA-MEDICI which is used for analyzing device characteristics. Because the electrodes of the proposed device are formed in trench oxide respectively, the electric field in the device are crowded to trench oxide. And because of the structure which has a narrow drain doping width, the punch through breakdown can be occurred in higher voltage than that of conventional lateral power MOSFET. We observed that the characteristics of the proposed device was improved by using TMA-MEDICI and that the fabrication of the proposed device is possible by using TMA-TSUPREM4.

• 한국결정성장학회지
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• 제12권3호
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• pp.138-143
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• 2002

본 연구에서는 용액합성법(solution synthesis technique)에 의해 ZnS : Cu nano 입자를 합성하였고, 결정구조 및 입자형상 등의 구조적 특성과, 광흡수/투과 특성, 에너지밴드갭, 그리고 photoluminescence(PL) 여기 및 발광 특성 등의 광학적 특성을 분석하였다. 일반적인 용액상태의 화학적 합성 방법과는 달리 합성온도를 $80^{\circ}C$로하였으며, sulfur의 precursor로 thiourea를 채택하여 Cu 도핑의 용이성을 구현하였다. 합성된 undoped ZnS 와 ZnS : Cu nano 입자는 모두 cubic 구조를 가졌으며 구형입자로 합성되었고, 광흡수단의 위치도 모두 ~305 nm에 나타나서 양자사이즈효과가 발생하였음을 알 수 있었다. PL 발광강도와 반가폭은 Cu 도핑농도가 0.03M 일 때 각각 최고치와 최저치를 나타냈는데, 이와 같이 용액합성법에 의해 합성된 ZnS : Cu 에서 Cu 의 농도변화에 따른 PL 스펙트럼의 강도와 반가폭의 변화는 본 연구에서 최초로 보고되는 것이다. 광흡수단 측정 및 PL 여기 실험결과, 본 연구의 주된 발광피크인 ~510 nm 발광밴드는 Cu에 의해 에너지밴드갭 내에 형성된 발광재결합센터를 통한 것임을 알 수 있었다.

• ETRI Journal
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• 제24권4호
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• pp.270-279
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• 2002

We present a self-consistent numerical method for calculating the conduction-band profile and subband structure of AlGaN/GaN single heterojunctions. The subband calculations take into account the piezoelectric and spontaneous polarization effect and the Hartree and exchange-correlation interaction. We calculate the dependence of electron sheet concentration and subband energies on various structural parameters, such as the width and Al mole fraction of AlGaN, the density of donor impurities in AlGaN, and the density of acceptor impurities in GaN, as well as the electron temperature. The electron sheet concentration was sensitively dependent on the Al mole fraction and width of the AlGaN layer and the doping density of donor impurities in the AlGaN. The calculated results of electron sheet concentration as a function of the Al mole fraction are in excellent agreement with some experimental data available in the literature.