• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.68-72
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• 2020

A new method for array testing of TFT-CD panel with the integrated gate driver circuits is presented. As larger size/high resolution TFT-LCD with the peripheral driver circuits has emerged, one of the important problems for manufacturing is array testing on the panel. This paper describes the technology of detecting defective arrays and optimizing the array testing process. For the effective characterization of pixel array, the pixel storage capability is simulated and measured with voltage imaging system. This technology permits full functional testing during the manufacturing process, enabling fabrication of large TFT-LCD panels with the integrated driver circuits.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.6
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• pp.145-151
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• 2014

The glass used for mobile display windows is required to have high strength. Chemical strengthening by means of ion exchange is widely used glass. The depth of the layer and the compressed stress are affected by tempering temperature and time. The purpose of this study is to investigate the range of DOL and CS, which to less breakage during reliability tests such as the ball drop test, hole drop test, 3-point bending test, drop test, and tumble test with Soda-lime Glass.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.62-66
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• 2022

Semiconductor is one of the most internationally competitive areas among domestic industries, the major concern of which is the stability of the wafer manufacturing processes. The packaging process is the final step in wafer manufacturing. Problems in the wafer packaging process cause large losses. The vibrations are supposed to be the most important factors for the packaging quality. In this study, the structure of a packaging box was analyzed through experiments and computer simulations, and further the effects of design alterations to suppress the vibrations have been investigated. The final result shows that the vibrations can be reduced substantially to improve the stability of the structure.

• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.56-63
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• 2023

This paper presents a method using finite element analysis and topology optimization to address the issue of overdesign in pressure-explosion proof enclosure doors for semiconductor manufacturing processes. The design conducted in this paper focuses on the pattern design of the enclosure door and its fixation components. The process consists of a solid-filled model, a topology optimization model, and a post-processing model. By applying environmental conditions to each model and comparing the maximum displacement, maximum equivalent stress, and weight values, it was confirmed that a reduction of about 13% in weight is achievable.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.74-84
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• 2022

As the semiconductor industry develops, the difficulty of newly required process technology becomes difficult, and the importance of production yield and product reliability increases. As an effort to minimize yield loss in the manufacturing process, interests in the process defect process for facility diagnosis and defect identification are continuously increasing. This research observed the plasma condition changes in the multi oxide/nitride layer deposition (MOLD) process, which is one of the 3D-NAND manufacturing processes through optical emission spectroscopy (OES) and monitored the result of whether the change in plasma characteristics generated in repeated deposition of oxide film and nitride film could directly affect the film. Based on these results, it was confirmed that if a change over a certain period occurs, a change in the plasma characteristics was detected. The change may affect the quality of oxide film, such as the film thickness as well as the interfacial surface roughness when the oxide and nitride thin film deposited by plasma enhenced chemical vapor deposition (PECVD) method.

• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.1-5
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• 2011

In recent years, worldwide production of solar wafers increased rapidly. Therefore, the solar wafer technology in the developed countries already has become an industry, and related industries such as solar wafer manufacturing equipment have developed rapidly. In this paper we propose the color classification method of the polycrystalline solar wafer that needed in manufacturing equipment. The solar wafer produced in the manufacturing process does not have a uniform color. Therefore, the solar wafer panels made with insensitive color uniformity will fall off the aesthetics. Gaussian mixture models (GMM) are among the most statistically mature methods for clustering and we use the Gaussian mixture models for the classification of the polycrystalline solar wafers. In addition, we compare the performance of the color feature vector from various color space for color classification. Experimental results show that the feature vector from YCbCr color space has the most efficient performance and the correct classification rate is 97.4%.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.975-977
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• 2004

According to thin and light form-factor and additional function of today's electronic devices, it is required to decrease the pattern pitch of FPC. The high density demand is more and more important trend especially, for small size LCD module. Based on this requirement, the manufacturing process is advancing from subtractive method to super subtractive method.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.177-182
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• 2009

A work of thin-walled outsell injection molding technology for a plastic part of moldframe applicable in a display product was performed in the present study. The thin-walled plastic part is one of the core parts in the display product, which supports and protects a light guide plate and back light unit from external environmental conditions. It globally has the shape of rectangular and surrounds the light guide plate and back light unit for each class of inch, however, the cross section of the part is not clear to define the thickness. This causes the difficult problem of injection molding itself for the part. Moreover, a metal outsell part makes a difficult problem in injection molding over it. Because the mold temperature control of the parts are not uniform in thickness direction due to the metal part. A careful injection melding analysis and injection mold design from the analysis results have to be proceeded to obtain a production of precision moldframe. Therefore, optimization for injection molding process and analysis of warpage characteristics were studied. Consequently, it was possible from the presented virtual manufacturing process that the manufacturing of precision thin-walled outsell moldframe.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.3
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• pp.85-91
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• 2007

This study was carried out to minimize the lifting force of a two hinge type stand mechanism. This unit is designed for the display devices in order to enhance the ergonomics for effective height adjustment and maintenance at any preferred position. The unit will be very useful for the mechanism fabricated with a coil spring and disc springs as a torque generator. The maximum and the minimum torque value should be calculated initially for the smooth lift. And the reasonable torque distribution is necessary to prevent any auto lift and auto dropping at any position because the torque generated by coil spring is more sensitive than disc spring in tilting the position. Therefore, the analysis of the coil spring is requisite to issue the specific torque value depending on the distorted angle with securing reliability of a long time storage condition. After the theoretical torque value was calculated, the evaluation was carried out by making a proto-type sample, then distorted angle was updated by experiment. The result of this study can readily be applied to various units for the optimization of the smooth lift.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.72-75
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• 2023

Carbon neutrality has been emerged as important mission for all the manufacturing industry to reduce energy usage and carbon emission equivalent. Korean semiconductor and display manufacturing industries are also in huge interest by minimize the energy usage as well as to find a less global warming product gases in both etch and cleaning. In addition, Korean government is also investing long term research and development plan for the safe environment in various ways. In this paper, we revisit previous research activities on carbon emission equivalent and current research activities performed in semiconductor process diagnosis research center at Myongji University with respect to the reduction of NF3 usage for the PECVD chamber cleaning, and we present the analytical result of the exhaust gas with residual gas analysis in both 6 inches and 12 inches PECVD equipment. The presented result can be a reference study of the development of new substitution gas in near future to compare the cleaning rate of the silicon oxide deposition chamber.