• Title/Summary/Keyword: Display manufacturing process

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Method of Reducing Residual Vibration at the LCD Transfer Robot (디스플레이 반송로봇 잔류진동 저감방안)

  • Moon, Sung Bae;Rim, Kyung-Hwa
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.2
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    • pp.98-105
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    • 2017
  • In the display industry, the residual vibration of the transfer robot can increase the process time and cause the breakage of the glass substrate, which is critical to productivity of display manufacturing. In this paper, the natural frequencies of transfer robot are analyzed by finite element method. On the basis of the analyzed data, we investigated the response characteristics of input shaping control with or without the glass presence on the hand of the transfer robot using MATLAB program, and compared with the current response characteristics of input shaping control applied to the industry. Based on this, we suggest an optimal residual vibration control method for the practical application in display industry.

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Status Change Monitoring of Semiconductor Plasma Process Equipment (주파수 도메인 반사파 측정법을 이용한 플라즈마 공정장비 상태변화 연구)

  • Yunsang Lee;Sang Jeen Hong
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.1
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    • pp.52-55
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    • 2024
  • In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

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A Study on Improving Classification Performance for Manufacturing Process Data with Multicollinearity and Imbalanced Distribution (다중공선성과 불균형분포를 가지는 공정데이터의 분류 성능 향상에 관한 연구)

  • Lee, Chae Jin;Park, Cheong-Sool;Kim, Jun Seok;Baek, Jun-Geol
    • Journal of Korean Institute of Industrial Engineers
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    • v.41 no.1
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    • pp.25-33
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    • 2015
  • From the viewpoint of applications to manufacturing, data mining is a useful method to find the meaningful knowledge or information about states of processes. But the data from manufacturing processes usually have two characteristics which are multicollinearity and imbalance distribution of data. Two characteristics are main causes which make bias to classification rules and select wrong variables as important variables. In the paper, we propose a new data mining procedure to solve the problem. First, to determine candidate variables, we propose the multiple hypothesis test. Second, to make unbiased classification rules, we propose the decision tree learning method with different weights for each category of quality variable. The experimental result with a real PDP (Plasma display panel) manufacturing data shows that the proposed procedure can make better information than other data mining procedures.

Challenges for large area processing equipment for TFT-LCD manufacturing

  • Tanaka, Tak
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.85-86
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    • 2007
  • As the manufacturing capacity needs for large size LCD TV shifts very fast into next generation, equipment manufactures face more challenges in development of the systems which can accommodate productivity, reliability and high process quality requirements from the panel makers. AKT committed to continue its contribution to the growth of the LCD market by providing excellent PECVD products. The cost containment and performance improvement are key challenges for large size processing equipment development and this presentation discusses various challenges and AKT's solutions in developing large size PECVD equipment beyond Gen. 8.

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Software Development for Glass-Bulb Automatic Design Integrated System Using Design Axiom (설계공리를 이용한 유리벌브 제품설계 자동화 시스템 구축)

  • Do, Sung-Hee;Park, Gyung-Jin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.4
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    • pp.1333-1346
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    • 1996
  • As the automation system in manufacturing field works more efficientely, the automation scheme is applied to many areas. In order to reduce the entire manufacturing, cost the design process must be automated. However, design process is so complicated, it is very difficult to construct the design automation system. The axiomatic approach to design provides a general theoretical framework for all design fields, including mechanical design. The key concepts of axiomatic design are : the existence of domains, the characteristic vectors within the domains that can be decomposed into hierarchies through zigzagging between the domains, and the design axioms. Using this approach, the glass bulb design process was analyzed and the design automation software was developed. Through menu display, a user can select or furnish the design input and generate the drawing with ease.

Electrolyzed Water Cleaning for Semiconductor Manufacturing (전리수를 이용한 반도체 세정 공정)

  • 류근걸;김우혁;이윤배;이종권
    • Journal of the Semiconductor & Display Technology
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    • v.2 no.3
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    • pp.1-6
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    • 2003
  • In the rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increase. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to environmental issue. To resolve this matter, candidates of advanced cleaning processes have been studied. One of them is to apply the electrolyzed water. In this work, electrolyzed water cleaning was compared with various chemical cleaning, using Si wafer surfaces by changing cleaning temperature and cleaning time, and especially, concentrating upon the contact angle. It was observed that contact angle on surface treated with Electrolyzed water cleaning was $4.4^{\circ}$ without RCA cleaning. Amine series additive of high pKa (negative logarithm of the acidity constant) was used to observe the property changes of cathode water.

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A Roll-to-Roll Process for Manufacturing Flexible Active-Matrix Backplanes Using Self-Aligned Imprint Lithography and Plasma Processing

  • Taussig, Carl;Jeffrey, Frank
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.808-810
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    • 2005
  • Inexpensive large area arrays of thin film transistors (TFTs) on flexible substrates will enable many new display products that cannot be cost effectively manufactured by conventional means. This paper presents a new approach for low cost manufacturing of electronic devices using roll-to-roll (R2R) processes exclusively. It was developed in partnership by Hewlett Packard Laboratories and Iowa Thin Film Technologies (ITFT), a solar cell manufacturer. The approach combines ITFT's unique processes for vacuum deposition and etching of semiconductors, dielectrics and metals on continuous plastic webs with a method HP has invented for the patterning and aligning the multiple layers of a TFT with sub-micron accuracy and feature size.

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A Dynamic Structural Design of PC type Sub-Structure for Next-Generation FAB based on Dynamic Test and Simulation (차세대 반도체 FAB의 동적 구조 설계를 위한 PC형 격자보 구조물의 동적 특성 평가)

  • 전종균;김강부;손성완;이홍기
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.4
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    • pp.51-55
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    • 2004
  • In the design stage of high precision manufacturing/inspection FAB facilities, it is necessary to investigate the allowable vibration limits of high precision equipments and to study structural dynamic characteristics of C/R and Sub-structure in order to provide structural vibration criteria to satisfy these allowable limits. The goal of this study is to investigate the dynamic characteristics of PC-Type mock-up structures designed for next generation TFT-LCD FAB through experiments and analysis procedures. Therefore, in order to provide a proper dynamic structural design for high precision manufacturing/inspection work process, these allowable limits must be satisfied.

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Extraction of the OLED Device Parameter based on Randomly Generated Monte Carlo Simulation with Deep Learning (무작위 생성 심층신경망 기반 유기발광다이오드 흑점 성장가속 전산모사를 통한 소자 변수 추출)

  • You, Seung Yeol;Park, Il-Hoo;Kim, Gyu-Tae
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.3
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    • pp.131-135
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    • 2021
  • Numbers of studies related to optimization of design of organic light emitting diodes(OLED) through machine learning are increasing. We propose the generative method of the image to assess the performance of the device combining with machine learning technique. Principle parameter regarding dark spot growth mechanism of the OLED can be the key factor to determine the long-time performance. Captured images from actual device and randomly generated images at specific time and initial pinhole state are fed into the deep neural network system. The simulation reinforced by the machine learning technique can predict the device parameters accurately and faster. Similarly, the inverse design using multiple layer perceptron(MLP) system can infer the initial degradation factors at manufacturing with given device parameter to feedback the design of manufacturing process.

Advanced Color Filter for TFT-LCD

  • Kwon, Jang-Hyuk
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.159-160
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    • 2000
  • A new manufacturing method using laser transfer technology was developed for a color filter of TFT-LCD. This method can make red, green and blue color layer at the same time without several baking processes. Simple process, no residue, good edge profile, and so on are merits of this process. The same performances (such as color characteristics, reliability, hardness and so on) of current color filter were achieved with this process.

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