• Design & Manufacturing
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• v.10 no.1
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• pp.19-25
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• 2016

Connectors are very important components that transmit electric signals to different parts. It must maintain intensity of the connector to prevent defects from impact and maintain contact to transmit electric signals. Most of the external parts of the connector, which act as the main framework, are formed by injection molding. However, bend deformation occurs for injection molded products due to the residual stress left inside the product after product molding. When the bend deformation is large, it does not come into complete contact when being assembled with other parts, which leads to connector contact intensity not being properly maintained. In result, the main role of the connector, which is to transmit electric signals, cannot be performed. In order to address this problem, this study conducted bend deformation cause analysis through bend deformation analysis to predict and prevent bend deformation of housings and wafers, which are injection molded products of pressure welded connectors that are normally applied in compact mobile and display products. Bend deformation analysis was carried out by checking the charging time, pressure distribution and temperature distribution through wire to board connector wafer and housing injection molding analysis. Based on the results of the bend deformation analysis results, the cause of the bend deformation was analyzed through deformation resulting from disproportional cooling, deformation resulting from disproportional contraction, and deformation resulting from ingredient orientation. In result, it was judged that the effects for bend deformation were biggest due to disproportional contraction for both the pressure welded connector wafer and housing.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.5
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• pp.879-886
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• 2008

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. The 10% change in trace width produced change of approximately 6% and 5.6% in differential impedance for trace thickness of $17.5{\mu}m$ and $35{\mu}m$, respectively. The change in the trace space showed a little change. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.55 no.4
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• pp.161-164
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• 2006

In this thesis we designed the vision system to inspect the defect of a back light unit of plat panel display device. The vision system is divided into hardware and inspection algorithm of defect. Hardware components consist of illumination part, robot-arm controller part and image-acquisition part. Illumination part is made of acrylic panel for light diffusion and five 36W FPL's(Fluorescent Parallel Lamp) and electronic ballast with low frequency harmonics. The CCD(Charge-Coupled Device) camera of image-acquisition part is able to acquire the bright image by the light coming from lamp. The image-acquisition part is composed of CCD camera and frame grabber. The robot-arm controller part has a role to let the CCD camera move to the desired position. To take inspections of surface images of a flat panel display it can be controlled and located every nook and comer. Images obtained by robot-arm and image-acquisition board are saved on the hard-disk through windows programming and are tested whether there are defects by using the image processing algorithms.

• Journal of Korea Multimedia Society
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• v.23 no.11
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• pp.1383-1387
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• 2020

Recently, a 4-col 7-row LED Screen that provides various information of major roads and local governments has been installed and operated. However, due to deterioration due to changes in temperature and humidity, deterioration due to static electricity, and mechanical stress, partial module failure of the display may occur, which is a major cause of missing information of vitally given to citizens. However, there have been frequent cases where the 4-col and 7-row LED Screen that have failed due to reasons such as installed location where the signboards are installed on the road and outdoor, the lack of monitoring means at all times, and the lack of manpower is often neglected for a long time. Following this flow, this paper proposes a method to detect defective modules by analyzing the images collected through the camera fixed to the front part of the LED display.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2000.10a
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• pp.602-605
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• 2000

This paper describes the development and utilization of digital telesounder system. The digital telesounder system consists of two parts. The one is sea station part, which consist of power, single board computer, A/D converter, and RF modem. The two is land station part, which consist of RF modem, color display, memory system and printer. We obtained good results at the two times of sea experiments. The digital telesounder system is sufficiently good and clear to color display the information of fish school in setnet.

• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.23-28
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• 2013

Epoxy resins are widely used in microelectronics packaging such as printed circuit board and encapsulating for semiconductor manufacturing. Water can diffuse into and through the epoxy matrix systems and moisture absorption at boarding interfaces of matrix resin systems can lead to a hydrolysis at the interfaces resulting in delamination of encapsulating materials. In the study, the changes of diffusion coefficient and moisture content ratio of epoxy resin systems with nano-sized fillers according to the change of liquid type epoxy resins were investigated. RE-304S, RE-310S, RE-810NM and HP-4032D as a epoxy resin, Kayahard AA as a hardener, and 1B2MI as a catalyst were used in these epoxy resin systems. After curing, moisture content ratios were measured with time under the 85 and 85% relative humidity condition using a thermo-hydrostat. The maximum moisture absorption ratio and diffusion coefficient of EMC decrease with the filler content. It can be seen that these decreases are due to the increase of filler surface area and the decrease of moisture through channel with the content of nano-sized filler.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.1-6
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• 2010

We can see the motion blur phenomenon on theedge of the moving picture when it moves in the LCDs. To reduce this phenomenon, we suggested a new over-deriving method, implemented on the board XUP Virtex-2 Pro Development System by using Virtex-2 Pro XUP XC2VP30 and improved the Motion Blur. In this method, we did not use additional parts except for a SDRAM. Hardware implementation for IP and data interface were handled in software. In this paper, we used the moving bar and the moving video image as a design model. We also showed that the afterimage was reduced and the vivid moving images was displayed. through this method.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.37-42
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• 2011

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.

• Current Optics and Photonics
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• v.1 no.2
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• pp.90-94
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• 2017

Visible light identification (VLID) is a user identification system for a door lock application using smartphone that adopts visible light communication (VLC) technology with the objective of high security, small form factor, and cost effectiveness. The user is verified by the identification application program of a smartphone via fingerprint recognition or password entry. If the authentication succeeds, the corresponding encoded visible light signals are transmitted by a light emitting diode (LED) camera flash. Then, only a small size and low cost photodiode as an outdoor interface converts the light signal to the digital data along with a comparator, and runs the authentication process, and releases the lock. VLID can utilize powerful state-of-the-art hardware and software of smartphones. Furthermore, the door lock system is allowed to be easily upgraded with advanced technologies without its modification and replacement. It can be upgraded by just update the software of smartphone application or replacing the smartphone with the latest one. Additionally, wireless connection between a smartphone and a smart home hub is established automatically via Bluetooth for updating the password and controlling the home devices. In this paper, we demonstrate a prototype VLID door lock system that is built up with LEGO blocks, a photodiode, a comparator circuit, Bluetooth module, and FPGA board.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.