• Journal of the Korean Society for Precision Engineering
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• v.29 no.11
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• pp.1256-1263
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• 2012

The present study covers the ultrasonic patterning process to replicate micro-patterns on a polymer substrate. The ultrasonic patterning process uses ultrasonic waves to generate frictional heat between an ultrasonic horn and the polymer substrate, from which the surface region of the polymer substrate is softened sufficiently for the replication of micro-patterns. The ultrasonic patterning process can divided into two categories according to the direction of vibration transmission: direct patterning and indirect patterning. The direct patterning uses a patterned horn, and the ultrasonic vibration is transferred directly from the patterned horn to the substrate. On the contrary, the indirect patterning process uses a plain horn, and the micro-patterns are engraved on a mold that is located below the substrate. Thus, the micro-patterns are replicated as an indirect manner. In this study, these direct and indirect patterning processes are compared in terms of the replication characteristics. Additionally, the possibility of double-side patterning is also discussed in comparison with the conventional single-side patterning process.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.116-122
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• 2012

The purpose of this study is on the development of 3-D conductive pattern fabrication system using laser. For development 3-D direct patterning system, we used the dynamic focusing, the laser power stabilizer and the auto aligning techniques. These technologies are already used commercially. However operation and control integrated system for 3-D direct patterning are not yet developed. The objective of this paper is to introduce laser direct structuring and develop the operating and integration system. Also we implemented new application of laser direct structuring.

• Macromolecular Research
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• v.12 no.3
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• pp.290-292
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• 2004

Multimode channel waveguides were fabricated using a direct UV patterning technology from thick films deposited by the one-step dip-coating of an organic/inorganic hybrid material (ORMOCER(equation omitted). The core size of the covered ridge waveguide was 43${\times}$51 $\mu\textrm{m}$$^2$; the waveguides can be readily prepared for multimode applications by direct UV patterning. The waveguides exhibited smooth surface profiles and a low optical loss of 0.07 ㏈/cm at the most important wavelength (850nm) used for optical interconnects.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.395-396
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.499-500
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• 2013

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.62.1-62.1
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• 2011

현재 상용화된 LED 또는 태양전지 등의 투명전극(TCO, transparent couducting oxide)재료로 높은 전기전도도와 광투과도를 갖는 ITO (Indium Tin Oxide)가 많이 채택되고 있다. 그러나 이에 사용되는 Indium의 단가가 높다는 문제점이 있어 이를 대체하기 위한 물질의 연구가 많이 이루어지고 있다. 특히 Aluminum을 doping한 ZnO (AZO)는 우수한 전기적, 광학적 특성 등으로 인해 ITO를 대체할 차세대 TCO 물질로 각광받고 있다. 본 연구에서는 sol-gel법을 및 direct patterning법을 이용하여 moth-eye 패턴을 포함하는 AZO 박막을 제작하였다. AZO sol을 제작하기 위하여 2-methoxyethanol, zinc acetate dihydrate 및 doping source로 aluminum nitrate nonahydrate를 사용하였다. 또한 광추출 향상 효과를 갖는 moth-eye 구조의 master stamp를 Polydimethyl siloxane(PDMS)를 이용하여 역상 moth-eye 구조의 mold를 복제하였으며, 이 복제된 mold와 제작된 AZO sol을 이용한 direct patterning법을 통해 나노급 moth-eye 구조를 갖는 AZO 투명전극층을 형성하였다. 제작된 moth-eye 구조를 갖는 AZO 투명전극층의 전기적 특성 평가를 위해, 4-point probe 측정 및 Hall measurement를 시행하였으며, 광학적 특성을 확인하기 위하여 UV-Visable spectrometer를 이용하여 투과도를 측정하였다. 본 연구를 통해 현재 상용화된 광전자 소자에 사용되고 있는 ITO 투명전극을 대체할 차세대 투명전극으로써 AZO 박막의 가능성을 확인하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.503-507
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• 2002

Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.2
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• pp.133-136
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• 2010

Laser direct patterning is one of new methods which are able to replace a conventional photolithography. In order reduce the fabrication cost and to improve the luminous efficiency of AC plasma display panels (PDPs), in this experiment, a Q-switched Nd:$YVO_4$ laser was used to fabricate T-shaped indium tin oxide (ITO) display electrodes. For the laser beam scanning speed from 100 mm/sec to 800 mm/sec, T-shaped ITO patterns were clearly obtained and investigated. The experimental results showed that the optimized T-shaped ITO electrode was obtained when the lasers scanning speed was 300 mm/s.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.5
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• pp.377-380
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• 2012

Laser direct patterning of indium tin oxide(ITO) is one of new methods of direct etching process to replace the conventional photolithography. A diode pumped Q-switched Nd:$YVO_4$ (${\lambda}$= 1,064 nm) laser was used to produce ITO electrode on various transparent oxide semiconductor films such as zinc oxide(ZnO). The laser direct etched ITO patterns on ZnO were compared with those on glass substrate and were considered in terms of the overlapping rate of laser beam. In case of the laser etching on double-layer, it was possible to obtain the higher overlapping rate of laser beam.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.3
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• pp.224-234
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• 2016

This study developed the conductivity pattern of solid surface using laser direct pattern and compound polymer material technology. For development direct patterning system of solid surface, we used the laser power stabilizer, the dynamic focusing, 3D scanner S/W and the auto aligning techniques. Also For conductivity pattern, we are developed compound polymer material with additive by electro-less plating. These technologies are already used commercially. However operation and control integrated system for direct patterning of solid surface are not yet developed. The objective of this paper is to introduce the laser direct structuring for simple process improvement instead complex PCB process, and develop the operating stability and integration system. Also we implemented new application of laser direct structuring through sample manufacture.