• Bulletin of the Korean Chemical Society
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• v.35 no.3
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• pp.731-736
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• 2014

An organic junction transistor with a vertical structure based on an active layer of poly(3-hexylthiophene) was fabricated by facile micro-contact printing combined with the Langmuir-Schaefer technique, without conventional e-beam or photo-lithography. Direct printing and subsequent annealing of Au-nanoparticles provided control over the thickness of the Au electrode and hence control of the electrical contact between the Au electrode and the active layer, ohmic or Schottky. The junction showed similar current-voltage characteristics to an NPN-type transistor. Current through the emitter was simply controllable by the base voltage and a high transconductance of ~0.2 mS was obtained. This novel fabrication method can be applied to amplifying or fast switching organic devices.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1889-1892
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• 2003

The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.8 s.197
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• pp.108-115
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• 2007

3D nano-scale manufacturing is an important aspect of advanced manufacturing technology. A key element in ability to view, fabricate, and in some cases operate micro-devices is the availability of tightly focused particle beams, particularly of photons, electrons, and ions. The use of ions is the only way to fabricate directly micro-/ nano-scale structures. It has been utilized as a direct-write method for lithography, implantation, and milling of functional devices. The simulation of ion beam induced physical and chemical phenomena based on sound mathematical models associated with simulation methods is presented for 3D micro-/nanofabrication. The results obtained from experimental investigation and characteristics of ion beam induced direct fabrication will be discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.537-537
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• 2012

We have studied a fabrication of vapor phase polymerized Poly(3,4-ethylenedioxythiophene) (PEDOT) nanowire arrays for the first time. The vapor-phase polymerization (VPP) technique is a bottom-up processing method that utilizes the organic arrangement of macromolecules to easily produce ordered aggregates, including on the nanoscale, or prepare thin films of self-assembled molecules, micropatterns, or modified microstructures of pure conducting polymers. Also, liquid-bridge-mediated nanotransfer molding (LB-nTM), which was reported as a new direct patterning method recently, is for the arrayed formation of two- or three-dimensional structures with feature sizes as small as tens of nanometers over large areas up to 4 inches across and is based on the direct transfer of various materials from a mould to a substrate through a liquid bridge between them. The PEDOT nanowires grown by VPP method and transferred on a substrate to use LB-nTM method have been fabricated to single crystal PEDOT nanowires investigated Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Selected Area Electron Diffraction (SAED), X-Ray Diffraction (XRD), X-ray Photoelectron Spectroscopy (XPS), and electrical properties.

• Electrical & Electronic Materials
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• v.8 no.2
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• pp.165-170
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• 1995

This paper describes the fabrication and characteristics of a Si Hall sensor fabricated on a SOI (Si-on-insulator) structure. The SOI structure was formed by SDB(Si-wafer direct bonding) technology and the insulator of the SOI structure was used as the dielectrical isolation layer of a Hall sensor. The Hall voltage and sensitivity of the implemented SDB SOI Hall sensors showed good linearity with respect to the applied magnetic flux density and supplied current. The product sensitivity of the SDB SOI Hall sensor was average 600V/A.T and its value has been increased up to 3 times compared to that of bulk Si with buried layer of 10.mu.m. Moreover, this sensor can be used at high-temperature, high-radiation and in corrosive environments.

• Journal of the Semiconductor & Display Technology
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• v.2 no.4
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• pp.27-30
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• 2003

The effect of fabrication method of catalytic layer on electrode performance has been investigated. Brush, spray gun and screen printer were used as fabrication tool and catalytic layers were formed by several methods in screen printing. Direct screen printing on polymer membrane, screen printing on carbon paper, and their combined method were applied. In the electrode fabricated by the screen printing method, Pt loading of Pt/C catalysts could be cut down to 50%, compared with results by the brushing and spraying methods. The best result of electrode was obtained as 0.6 V, at 1 A/$\textrm{cm}^2$ when catalytic layer was formed by the combined way.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.116-122
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• 2012

The purpose of this study is on the development of 3-D conductive pattern fabrication system using laser. For development 3-D direct patterning system, we used the dynamic focusing, the laser power stabilizer and the auto aligning techniques. These technologies are already used commercially. However operation and control integrated system for 3-D direct patterning are not yet developed. The objective of this paper is to introduce laser direct structuring and develop the operating and integration system. Also we implemented new application of laser direct structuring.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.771-775
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• 2015

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.557-560
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• 2000

Combination of SDB(Si-wafer Direct Bonding) and electrochemical etch-stop in TMAH anisotropic etchant can be used to create a variety of MEMS(Micro Electro Mechanical System). Especially, fabrication of SDB SOI structures using electrochemical etch-stop is accurate method to fabrication of 3D(three-dimensional) microstructures. This paper describes on the fabrication of SDB SOI structures with sealed cavity for MEMS applications and thickness control of active layer on the SDB SOI structure by electrochemical etch-stop. The flatness of fabricated SDB SOI structure is very uniform and can be improved by addition of TMAH to IPA and pyrazine.

• Journal of KIBIM
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• v.9 no.3
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• pp.30-40
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• 2019

Extraction of fabrication documents is very important because it provides information related to tasks of fabrication and construction. Therefore, in the case of a prefabricated member such as a steel structure, it is necessary to improve the productivity of fabrication documents through 3D BIM. However, research and evidence data on direct comparison analysis of 3D BIM-based documents extraction versus 2D CAD-based documents extraction are hard to find. Thus, this study focuses on productivity analysis of 3D BIM based fabrication documents extraction. In this study, the productivity data of fabrication documents extraction for module construction of EPC project was analyzed. For the productivity analysis, a case study on the fabrication documents of Module A (1,965 sheets) and Module B (1,216 sheets) was conducted. Fabrication documents for each module include general arrangement drawing, assembly drawing, single part drawing and single plate drawing. Comparison of 2D CAD based fabrication documents extraction and 3D BIM based fabrication documents extraction, the productivity for the entire work was improved from 17 hours to 16 hours for Module A and 12 hours to 7 hours for Module B. Especially, the productivity of the assembly drawings, which occupies a large part of the fabrication documents, was improved by about 48.75% from the total time required from 281 hours to 144 hours.