• Journal of the Korean Society for Precision Engineering
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• v.11 no.5
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• pp.134-142
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• 1994

An upper bound elemental technique (UBET) is applied to predict variations of neutral plane and optimal position of the initial billet for rib-wep shaped ring forging. In the analysis, the neutral plane position and velocity fields are determined by minimizing the total power consump- tion with respect to chosen parameters. The degree of die-cavity filling by initial billet-position and the variations of neutral plane by friction condition are investigated. Experiments have been carried out with pure plasticine billets at room temperature. The theoretical predictions of the forging load and the flow pattern are in good agrement with the experimental results.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.4
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• pp.104-112
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• 2017

In the sand casting process, the flow of liquid metal affects the quality of casting products and their die life. To determine the optimal bush part design process, this study performed various analyses using commercial finite element analysis S/W. The simulation focused on the molten metal behaviors during the mold filling and solidification stages of sand casting. This study aims to develop methods to reduce the cost and increase the tool life of the continuous hot zinc plating roll.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.10
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• pp.57-68
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• 1995

An upper bound elemental technique (UBET) program has been developed to predict forging load, die-cavity filling, preform in non-axisymmetric forging. To analyze the process easily, it is suggested that the deformation is divided into two different parts. Those are axisymmetric part in corner, plane-strain part in lateral. The plane-strain and axisymmetric parts are combined by building block method. And the total energy is computed through combination of three deformation parts. A dumbbell-type preform has been obtained from height and volumetric compensations of the billet based on the backward simulation. Experimetns have been carried out with pure plasticine at room temperature. Theoretical predictions are in good agreement with expereimental results.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.111-114
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• 2008

The Injection molding is used more than 70% of total production in plastic products. The injection molding process has 4 processes such as filling, packing, cooling and ejecting. It spends most of times in the cooling process. Therefore, it is important to control the mold temperature in producing plastic products. The cooling system and time affect the product's quality and productivity. Especially, cooling time has about 60% of total injection cycle time. Therefore, we can improve a productivity by shortening cooling time. In this study, the rapid cooling system was developed and performed a efficiency test. This system could refrigerate coolant to $1^{\circ}C$ and had to need 10 minutes for normal operating. However, if response time of temperature controller and sensor will be increased, the performance of this system will increase.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.129-133
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• 2008

As a rotating machine element, plastic gears are more and more widely used in such as industrial machine element, since plastic gear is lighter, higher wear-resistance, and higher vibration absorbing ability than metal gears. When operating plastic parts, tooth breakage and fatigue life shortened due to increasing number of applying load and tooth flank temperature rising, such that accuracy of plastic gears is divided from allowable range to cause vibration and noise. On this study, a internal plastic gears are developed which improved the filling balance molding process by a new injection mold structure. The new mold structure called HR3P(hot runner type 3plate mold). As the result from this studies, we obtained a very accurate roundness internal gears by using design of experiment.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.155-158
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• 2008

Flow imbalance among the cavities was often observed in multi-cavity mold. The flow imbalance affects on the dimensions and physical properties of molded articles. First of all, the origin of flow imbalance is geometrical imbalance of delivery system. However, even the geometry of delivery system is balanced the cavity imbalance is being developed. This comes from the temperature distribution in the cross-section of runner, which is affected by the operational conditions. In this study, experimental study of flow imbalance has been conducted for various injection speeds. This study also suggests new runner design to eliminate flow imbalance in multi-cavity injection mold. Simulation and experimental results showed suggested new designed runner could eliminate or reduce flow imbalance in multi-cavity injection mold.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1994.03a
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• pp.63-70
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• 1994

An upper bound elemental technique(UBET) is applied to predict forging load and die-cavity filling for non-axisymmetric ring forging. The finial product is divided into three different deformation regions. That is axisymmetric part in corner, lateral plane-strain part and shear deformation on boundaries between them. The plane-strain and axisymmetric part are combinded by building block method. Also the total energy is computered through combination of three deformation part. Experiments have been carried out with pure plasticine billets at room temperature. The theoretical predictions of the forging load and the flow pattern are in good agreement with the experimental results.

• Korean Journal of Metals and Materials
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• v.48 no.6
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• pp.557-564
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• 2010

Formation of Sn through-silicon-via (TSV) and its interconnection processes were studied in order to form a three-dimensional interconnection structure of chip-stack packages. Different from the conventional formation of Cu TSVs, which require a complicated Cu electroplating process, Sn TSVs can be formed easily by Sn electroplating and reflow. Sn via-filling behavior did not depend on the shape of the Sn electroplated layer, allowing a much wider process window for the formation of Sn TSVs compared to the conventional Cu TSV process. Interlocking joints were processed by intercalation of Cu bumps into Sn vias to form interconnections between chips with Sn TSVs, and the mechanical integrity of the interlocking joints was evaluated with a die shear test.

• Design & Manufacturing
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• v.16 no.3
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• pp.44-49
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• 2022

In this study, the simulation of the resin transfer molding process method using MoldFlow has been investigated. This work explains the thermoset material model, fabric permeability model, the flow model and the cure model. It has been shown that the simulation result can predict filling and cure performances.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.79-84
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• 2010

Formation of TSV (Through-Si-Via) with an Au seed layer and Cu filling to the via, simplification of bumping process for three dimensional stacking of Si dice were investigated. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process using $SF_6$ and $C_4F_8$ plasmas alternately. The vias were 40 ${\mu}m$ in diameter, 80 ${\mu}m$ in depth, and were produced by etching for 1.92 ks. On the via side wall, a dielectric layer of $SiO_2$ was formed by thermal oxidation, and an adhesion layer of Ti, and a seed layer of Au were applied by sputtering. Electroplating with pulsed DC was applied to fill the via holes with Cu. The plating condition was at a forward pulse current density of 1000 mA/$dm^2$ for 5 s and a reverse pulse current density of 190 mA/$dm^2$ for 25 s. By using these parameters, sound Cu filling was obtained in the vias with a total plating time of 57.6 ks. Sn bumping was performed on the Cu plugs without lithography process. The bumps were produced on the Si die successfully by the simplified process without serious defect.