Design & Manufacturing

Korean Society of Die & Mold Engineering (한국금형공학회)
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Flow and Cure Simulation of resin transfer molding process for composites using MoldFlow

복합재료 수지 전달 공정의 몰드플로우를 이용한 유동과 경화 시뮬레이션

  • Jung, Jae-Sung (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) ;
  • Hong, Ji-Seon (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) ;
  • Kim, Sun-Kyoung (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
  • 정재성 (서울과학기술대학교 기계시스템디자인공학과) ;
  • 홍지선 (서울과학기술대학교 기계시스템디자인공학과) ;
  • 김선경 (서울과학기술대학교 기계시스템디자인공학과)
  • Received : 2021.06.21
  • Published : 2022.09.30
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Abstract

In this study, the simulation of the resin transfer molding process method using MoldFlow has been investigated. This work explains the thermoset material model, fabric permeability model, the flow model and the cure model. It has been shown that the simulation result can predict filling and cure performances.

Keywords

Acknowledgement

이 연구는 과학기술정보통신부의 재원으로 한국연구재단의 지원을 받아 수행된 연구임 (NRF-2018R1A5A1024127, 2020R1I1A2065650).

References

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