• Design & Manufacturing
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• v.17 no.3
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• pp.8-14
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• 2023

In this study, basic research was conducted on manufacturing technology of thick-walled light guide a component that controls the light source of automobile lamps. As a preliminary study for manufacturing the final injection molded parts, a model for analyzing the influence of micro patterns on light guides is presented. The optical characteristics of the light guide were analyzed according to the change of the curvature radius of the micro-optical pattern, and the injection molding characteristics of the light guide according to the change of injection molding conditions were analytically evaluated. It was confirmed that the luminance uniformity improves as the R value decreases for changes in the micro-pattern R value, but it was confirmed that there are technical limitations in actual injection mold core processing and high-replication injection molding. Injection molding analysis showed that cooling channel design is very important compared to general injection molding due to thick-wall characteristics and thickness variation. It was also confirmed that the cooling channel has a great influence on the cycle time and birefringence result due to residual stress. As a result of analyzing the influence of filling time, holding condition, and cooling on shrinkage, it was found that the cooling water temperature has a significant effect on the shrinkage of ultra-fine light guide parts, and the holding condition also has a significant effect.

• Journal of Dental Rehabilitation and Applied Science
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• v.40 no.2
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• pp.72-81
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• 2024

Purpose: This study aimed to assess the marginal and internal fit of 3-unit monolithic zirconia fixed partial dentures (FPDs) fabricated via computer-aided design and computer-aided manufacturing (CAD/CAM) from solid working casts and removable die system. Materials and Methods: The tooth preparation protocol for a zirconia crown was executed on the mandibular right first premolar and mandibular right first molar, with the creation of a reference cast featuring an absent mandibular right second premolar. The reference cast was duplicated using polyvinyl siloxane impression, from which 20 working casts were fabricated following typical dental laboratory procedures. For comparative analysis, 10 FPDs were produced from a removable die system (RD group) and the remaining 10 FPDs from the solid working casts (S group). The casts were digitized using a dental desktop scanner to establish virtual casts and design the FPDs using CAD. The definitive 3-unit monolithic zirconia FPDs were fabricated via a CAM milling process. The seated FPDs on the reference cast underwent digital evaluation for marginal and internal fit. The Mann-Whitney U test was applied for statistical comparison between the two groups (α = 0.05). Results: The RD group showed significantly higher discrepancies in fit for both premolars and molars compared to the S group (P < 0.05), particularly in terms of marginal and occlusal gaps. Color mapping also highlighted more significant deviations in the RD group, especially in the marginal and occlusal regions. Conclusion: The study found that the discrepancies in marginal and occlusal fits of 3-unit monolithic zirconia FPDs were primarily associated with those fabricated using the removable die system. This indicates the significant impact of the fabrication method on the accuracy of FPDs.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.9-15
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• 2009

Compared to the flip-chip process using solder bumps, Cu pillar bump technology can accomplish much finer pitch without compromising stand-off height. Flip-chip process with Cu pillar bumps can also be utilized in radio-frequency packages where large gap between a chip and a substrate as well as fine pitch interconnection is required. In this study, Cu pillars with and without Sn caps were electrodeposited and flip-chip-bonded together to form the Cu-Sn-Cu sandwiched joints. Contact resistances and die shear forces of the Cu-Sn-Cu sandwiched joints were evaluated with variation of the height of the Sn cap electrodeposited on the Cu pillar bump. The Cu-Sn-Cu sandwiched joints, formed with Cu pillar bumps of $25-{\mu}m$ diameter and $20-{\mu}m$ height, exhibited the gap distance of $44{\mu}m$ between the chip and the substrate and the average contact resistance of $14\;m{\Omega}$/bump without depending on the Sn cap height between 10 to $25\;{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.55-61
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• 2010

The device with tantalum silicide heater were bonded by Ag paste and Au SBB(Stud Bump Bonding) onto the Au coated substrate. The shear test after Au ABB and the thermal performance under current stressing were measured. The optimum condition of Au SBB was determined by fractured surface after die shear test and $350^{\circ}C$ for substrate, $250^{\circ}C$ for die during flip chip bonding with bonding load of about 300 g/bump. With applying 5W through heater on the device, the maximum temperature with Ag paste bonding was about $50^{\circ}C$. That with Au SBB on Au coated Si substrate showed $64^{\circ}C$. The difference of maximum temperatures is only $14^{\circ}C$, even though the difference of contact area between Ag paste bonding and Au SBB is by about 300 times and the simulation showed that the contact resistance might be one of the reasons.

• Journal of the Korean Ceramic Society
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• v.38 no.9
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• pp.799-805
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• 2001

Two commercial alumina powders having different particle size of $0.5{\mu}m$ and 3${\mu}$m were presintered at 1120$^{\circ}$C for 2h and then lanthanum aluminosilicate glass was infiltrated at 1100$^{\circ}$C for up to 4h to obtain the densified glass-alumina composites. The effect of alumina particle size on packing factor, microstructure, wetting, porosity and pore size, and mechanical properties of the composite was investigated. The optimum mechanical properties and compaction behavior were observed for the 3${\mu}$m alumina particle dispersed composite. The 3${\mu}$m alumina particle size and distribution for he preform were within 0.1 to 48${\mu}$m and bimodal and random orientation. The strength and the fracture toughness of the composite having 3${\mu}$m alumina particles were 519MPa and $4.5MPa{\cdot}m^{1/2}$, respectively.

• Design & Manufacturing
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• v.14 no.3
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• pp.8-16
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• 2020

In this study, the vibration signal of the mold was measured and analyzed to monitoring the process time and characteristics during injection molding. A 5 inch light guide plate mold was used to injection molding and the vibration signal was measured by MPU6050 acceleration sensor module attached the surface of fixed mold base. Conditions except for injection speed and packing pressure were set to the same value and the change of the vibration signal of the mold according to injection speed and packing pressure was analyzed. As a result, the vibration signal had a large change at three points: "Injection start", "V/P switchover", and "Packing end". The time difference between "injection start" and "V/P switchover" means the injection time in the injection molding process, and the time difference between "V/P switchover" and "Packing end" means the packing time. When the injection time and packing time obtained from the vibration signal of the mold are compared with the time recorded in the injection molding machine, the error of the injection time was 2.19±0.69% and the error of the packing time was 1.39±0.83%, which was the same level as the actual value. Additionally, the amplitude at the time of "injection start" increased as the injection speed increased. In "V/P switchover", the amplitude tended to be proportional to the pressure difference between the maximum injection pressure and the packing pressure and the amplitude at the "packing end" tended to the pressure difference between the packing pressure and the back pressure. Therefore, based on the result of this study, the injection time and packing time of each cycle can be monitored by measuring the vibration signal of the mold. Also, it was confirmed that the level and trend of process variables such as the injection speed, maximum injection pressure, and packing pressure can be evaluated as the change of the mold vibration during injection molding.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• The Journal of Korean Academy of Prosthodontics
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• v.34 no.2
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• pp.373-383
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• 1996

In order to compare the accuracy of impression method using addition silicone putty impression material, metal master die was fabricated with 4 cylindrical abutments that were similar in shape to mandibular arch. Among the 4 abutments, two(A, D) with 8mm width and 7mm height were formed in the 2nd molar regions and the other two(B, C) with 6mm width and 7mm height were on the canine regions. Impressions were taken using one-step putty wash impression technique and two-step putty wash impression technique by three different types of impression materials(Perfect, Express, Exaflex). Upon measuring the distance between the abutments on the model by three dimensional measuring machine, the percent of devitaion of the materials were obtained, rendering the following results. The results obtained are as follows : 1. There was no significant difference in accuracy in regard with the impression method between one-step putty wash impression technique and two-step putty wash impression technique using addition silicone putty impression material. 2. There were no difference in accuracy among with three different addition silicone putty impression materials. 3. All the distances between abutments on improved stone models increased in comparison with those on the metal master model.

• The Journal of Advanced Prosthodontics
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• v.7 no.3
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• pp.199-206
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• 2015

PURPOSE. The present study investigated the influences of various gypsum materials on the precision of fit of CAD/CAM-fabricated prostheses and analyzed their correlation with surface roughness. MATERIALS AND METHODS. The master model of the mandibular right first molar was replicated, and four experimental groups based on two types of Type IV stone (GC Fujirock EP, Die keen) and two types of scannable stone (Aesthetic-Basegold, Everest Rock) were created to include a total of 40 specimens, 10 in each group. The surface roughness of the working models for the respective experimental groups was measured. Once the zirconia cores had been fabricated, the marginal and internal fits were measured with a digital microscope using the silicone replica technique. The mean and standard deviation of the respective points of measurement were computed and analyzed through the one-way ANOVA and Tukey's HSD test. The correlation between surface roughness and the precision of fit of the zirconia core was analyzed using the Pearson correlation analysis (${\alpha}$=.05). RESULTS. The zirconia cores fabricated from the scannable stone working models exhibited a superior precision of fit as compared to those fabricated from the Type IV stone working models. The correlation analysis results showed a clear positive correlation between surface roughness and the precision of fit of zirconia cores in all of the experimental groups (P<.05). CONCLUSION. The results confirmed that the surface roughness of dental working models has a decisive influence on the precision of fit of zirconia cores.

• Korean Journal of Materials Research
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• v.20 no.4
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• pp.223-227
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• 2010

Recently, one-dimensional semiconducting nanomaterials have attracted considerable interest for their potential as building blocks for fabricating various nanodevices. Among these semiconducting nanomaterials,, $SnO_2$ nanostructures including nanowires, nanorods, nanobelts, and nanotubes were successfully synthesized and their electrochemical properties were evaluated. Although $SnO_2$ nanowires and nanobelts exhibit fascinating gas sensing characteristics, there are still significant difficulties in using them for device applications. The crucial problem is the alignment of the nanowires. Each nanowire should be attached on each die using arduous e-beam or photolithography, which is quite an undesirable process in terms of mass production in the current semiconductor industry. In this study, a simple process for making sensitive $SnO_2$ nanowire-based gas sensors by using a standard semiconducting fabrication process was studied. The nanowires were aligned in-situ during nanowire synthesis by thermal CVD process and a nanowire network structure between the electrodes was obtained. The $SnO_2$ nanowire network was floated upon the Si substrate by separating an Au catalyst between the electrodes. As the electric current is transported along the networks of the nanowires, not along the surface layer on the substrate, the gas sensitivities could be maximized in this networked and floated structure. By varying the nanowire density and the distance between the electrodes, several types of nanowire network were fabricated. The $NO_2$ gas sensitivity was 30~200 when the $NO_2$ concentration was 5~20ppm. The response time was ca. 30~110 sec.