• Journal of the Ergonomics Society of Korea
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• v.35 no.5
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• pp.383-389
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• 2016

Objective: In this paper, work time for the representative fruit crops are collected and analyzed using time-diary method, and the collected data were compared with the directly observed work time using GPS device. Background: There is no consistent conclusion which measurement method for work time is accurate. Most of the research results were collected from the environment other than rural area. Therefore, there is need to review reliability of the measurement methods for the agricultural work which are carried out for a long duration. Method: Top five crops (apple, pear, grape, sweet persimmon, and peach) were selected according to the number of farms and cultivation areas. We let fruit growers fill a work diary during one cropping period. A difference between the work-time that was recorded by the farmers and the direct observed worktime using GPS device were analyzed. Results: Average direct work time for the five fruit crops found to be 7.1% of the total work time. Conclusions and Applications: Reliability was secured by recording the daily work diary at each work stage while aware that direct observation is carried on. Data which are being collected by government institutions are obtained by the memories of the respondents. Therefore, it is needed to try the method adopted by this study in order to collect more accurate data.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.88-92
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• 2020

Thermal effects in bulk and SOI FinFETs are briefly reviewed herein. Different techniques to measure these thermal effects are studied in detail. Self-heating effects show a strong dependency on geometrical parameters of the device, thereby affecting the reliability and performance of FinFETs. Mobility degradation leads to 7% higher current in bulk FinFETs than in SOI FinFETs. The lower thermal conductivity of SiO₂ and higher current densities due to a reduction in device dimensions are the potential reasons behind this degradation. A comparison of both bulk and SOI FinFETs shows that the thermal effects are more dominant in bulk FinFETs as they dissipate more heat because of their lower lattice temperature. However, these thermal effects can be minimized by integrating 2D materials along with high thermal conductive dielectrics into the FinFET device structure.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.769-772
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• 2014

The device reliability in amorphous InGaZnO under NBS(Negative Bias Stress) and hot carrier stress with different gate overlap has been characterized. Amorphous InGaZnO thin film transistor has been measured. and is channel $width=104{\mu}m$, $length=10{\mu}m$ with gate overlap $length=0,1,2,3{\mu}m$. The device reliability has been analyzed by I-V characteristics. From the experiment results, threshold voltage variation has been increased with increasing of the gate overlap length after hot carrier stress. Also, threshold voltage variation has been decreased and Hump Effect has been observed later with increasing of the gate overlap length after NBS.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.36 no.2
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• pp.49-55
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• 2013

When developing a product, ensuring the quality and reliability is essential. Reliability process is always underestimated compared to its importance, especially in the field of domestic medical devices. In this paper, reliability process developed for near-infrared solid microscope, based on a variety of existing practices and other product process. The following findings were obtained as research progressed. First, learning about the medical equipment needed to assure the quality and reliability standards. Second, reliability process established to design a product in the field of medical devices.

• Journal of Applied Reliability
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• v.18 no.1
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• pp.56-65
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• 2018

Purpose: The purpose of this study is to estimate shelf life of fuze MTSQ (Mechanical Time & Super Quick) KM577A1 from Ammunition Stockpile Reliability Program (ASRP) data. Methods: For many years, ammunition test data had been gathered from ASRP. In this study, lot selection criteria and reliability score of functioning time for fuze are proposed. Reliability score of functioning time and failure data are used to estimate shelf life. Results: The results of this study are as follows; The failure modes of fuze MTSQ KM577A1 are dud, inverse function and mechanical time functioning failure (not operating in intended time). Dud and inverse function are major failure modes. Fuze MTSQ KM577A1's shelf life ($B_5$) is estimated 18.2 years conservatively. Conclusion: Degradation of chemical components in fuze MTSQ KM577A1 is major factor for its reliability. And shelf life ($B_5$) of fuze MTSQ KM577A1 is estimated 18.2 years conservatively.

• Journal of Veterinary Clinics
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• v.35 no.5
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• pp.206-210
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• 2018

The purpose of this study was to evaluate the reliability and validity of the Force-Sensing Resistor (FSR) for measurement of static hindlimb weight distribution in beagle dogs and to compare these results to a Digital Weighing Scale (DWS). Nine healthy beagle dogs were recruited for this study. Static weight distribution was evaluated four times at intervals of 5 days with each device and two observers to calculate the intra- and interobserver reliability. The intraclass correlation coefficient (ICC) values of the FSR for intraobserver reliability were moderate to good (0.74). The results for the DWS showed poor to moderate (0.56) ICC values for intraobserver reliability. The ICC values for interobserver reliability were 0.53 and 0.61 for FSR and DWS, respectively, indicating poor to moderate agreement. Our findings suggest that the Force-Sensing Resistor can be used to measure static weight distribution in veterinary medicine. However, caution should be taken when comparing measured values of static weight distribution obtained utilizing both the FSR and DWS due to their low positive correlation (R = 0.41, p < 0.01).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.401-404
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• 1998

Recently, InGaP/GaAs HBTs have been much interested as a potential replacement for AlGaAs/GaAs HBTs because of their superior device and material properties. In this paper, DC characteristics of InGaP/GaAs HBTs and the temperature dependance as well as the reliability were investigated comparing with AlGaAs/GaAs HBTs. As a results InGaP/GaAs HBTs produced the superior performance to AlGaAs/GaAs HBTs.

• Proceedings of the KSR Conference
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• 2002.05a
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• pp.530-534
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• 2002

This paper show serial communication method in order to design how to interface between fault tolerant systems with redundancy. Problem has been in the method that fault tolerant system had switched of serial data with common switching device. This problem degrade reliability in itself and total system which is interfaced with that serial communication system. So Arbitration module of serial communication which is suggested in this paper can improve the reliability using voter algorithm which fault is detected passively.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.29-33
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• 2002

In the flip-chip process, the problem like electric defect or fatigue crack caused by the difference of CTE, between chip and substrate board had occurred. Underfill of flip chip to overcome this defects is noticed as important work developing in whole reliability of chip by protecting the chip against the external shock. In this paper, we introduce the underfill methods using mold and plunge and improvement of process and reliability, and the advantage which can be taken from embodiment of device.