• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.418-418
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• 2012

We fabricated a new type of hybrid film using molecular layer deposition (MLD). The MLD is a gas phase process analogous to atomic layer deposition (ALD) and also relies on a saturated surface reaction sequentially which results in the formation of a monolayer in each sequence. In the MLD process, polydiacetylene (PDA) layers were grown by repeated sequential surface reactions of titanium tetrachloride and 2,4-hexadiyne-1,6-diol with ultraviolet (UV) polymerization under a substrate temperature of $100^{\circ}C$. Ellipsometry analysis showed a self-limiting surface reaction process and linear growth of the hybrid films. Polymerization of the hybrid films was confirmed by infrared (IR) spectroscopy and UV-Vis spectroscopy. Composition of the films was confirmed by IR spectroscopy and X-ray photoelectron (XP) spectroscopy. The titanium oxide cross-linked polydiacetylene (TiOPDA) hybrid films exhibited good thermal and mechanical stabilities.

• Corrosion Science and Technology
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• 제10권6호
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• pp.194-198
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• 2011

This is the first release of an interim report on the development of coating technology of Zn-Mg alloy layers on steel strip by EML-PVD (electromagnetic levitation - physical vapor deposition) process in an air-to-air type continuous PVD pilot plant. It intends to introduce a basic principle of the EML-PVD process together with the high speed PVD pilot plant built in Posco. Due to the agitation effect provided by the high frequency induction coil, simultaneous evaporation of Zn and Mg from a droplet could produce alloy coating layers with Mg content of 6% to 12% depending on the composition of the droplet inside the coil. For its superior corrosion resistance, Zn-Mg alloy coated steel would be a very promising material for automotive, electrical appliances, and construction applications.

• 세라미스트
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• 제23권2호
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• pp.132-144
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• 2020

Solid oxide fuel cell (SOFC) have attracted much attention due to clean, efficient and environmental-friendly generation of electricity for next-generation energy conversion devices. Recently, many studies have been reported on improving the performance of SOFC electrodes and electrolytes by applying atomic layer deposition (ALD) process, which has advantages of excellent film quality and conformality, and precise control of film thickness by utilizing its unique self-limiting surface reaction. ALD process with these advantages has been shown to provide functional ceramic interfaces for SOFC electrodes and electrolytes. In this article, recent examples of successful functionalization and stabilization on SOFC electrodes and electrolytes by the application of ALD process for realizing high performance SOFC cells are reported.

• 한국초전도ㆍ저온공학회논문지
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• 제9권4호
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• pp.1-6
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• 2007

We describe methods for depositing high temperature superconducting films on textured metal tapes by reactive co-evaporation (RCE). We discuss how RCE can be used to deposit on moving tape in a continuous fashion in a Garching-style process. Results are presented on films deposited by RCE at Los Alamos on IBAD-MgO textured tapes. The performance achieved, attaining over 500A/cm-width in self-field at 75.5 K, is competitive with the best results obtained by other processes for coated conductors. Tape production throughput is critical for the economics of the process and high deposition rates achieved in RCE are attractive for this. We present a detailed cost analysis model for HTS deposition using an RCE Garching process. The results indicate that HTS deposition can cost $<$5/kA{\cdot}m$ in a scaled up manufacturing environment.

• 한국진공학회지
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• 제4권S1호
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• pp.130-137
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• 1995

Deopsition of thermal quality SiO2 using a high density plasma ECR CVD process has been demonstrated to give void and seam free gap fill of high aspect ratio metallization structures with a simple oxygen-silane chemistry. This is achieved by continuous sputter etching of the film during the deposition process. A two-step process is utilized to deposit a composite layer for higher manufacturing efficiency. The first step, which has a deposition rate of approximately 0.5 $\mu$m/min., is used to provide complete gap fill between the metal lines. The second step, which has a deposition rate of up to 1.5 $\mu$m/min., is used to deposit a total thickness of 2.0$\mu$m for the intermetal dielectric film. The topography of this composite film is very compatible with subsequent chemicl mechanical polishing(CMP) planarization processing.

• Journal of Welding and Joining
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• 제34권1호
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• pp.35-40
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• 2016

Recent developments of Laser metal 3D deposition with wire feeding are reviewed which provide an alternative to powder feeding method. The wire feeding direction, angle and position as well as laser power, wire feeding rate, and deposition speed are found to be key parameters to make quality deposition with high throughput. When compared with the powder feed, the wire feed shows higher material efficiency, higher deposition rate, and smoother surface. Large elongated columnar grains which have epitaxial growth across deposit layers are observed in deposit cross sections. The growth direction is parallel to the thermal gradient during the deposit process. Tensile properties are found to be dependent on the direction due to the anisotropic deposit property. A real-time feedback control is demonstrated to be effective to improve the deposition stability.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.86-86
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• 2003

Copper has attracted much attention in the deep submicron ULSI metallization process as a replacement for aluminum due to its lower resistivity and higher electromigration resistance. Electroless copper deposition method is appealing because it yields conformal, high quality copper at relatively low cost and a low processing temperature. In this work, it was investigated that effect of the microstructure of the substrate on the electroless deposition. The mechanism of the nucleation and growth of the palladium nuclei during palladium activation was proposed. Electroless copper deposition on TiN barriers using glyoxylic acid as a reducing agent was also investigated to replace toxic formaldehyde. Furthermore, electroless copper deposition on TaN$\sub$x/ barriers was examined at various nitrogen flow rate during TaN$\sub$x/ deposition. Finally, it was investigated that the effect of plasma treatment of as-deposited TaN$\sub$x/ harriers on the electroless copper deposition.

• 한국대기환경학회지
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• 제15권5호
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• pp.625-638
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• 1999

Air quality modeling for coastal urban region has been composed of a complex system including meteorological, chemical and physical processes and emission characteristics in complex terrain. In this study, we studied about an effect prediction for deposition phenomenon affecting on air quality in Pusan metopolitan metropolitan city. In air quality modeling including ship sources, a situation considered deposition process habe better result than not considered when compared with observed value. Air pollutants emitted into urban air during the daytime nearly removed through urban atmosphere polluted. Also these phenomena correlated concentration variation connent with sea/land breezes and terrain effect. Therefore we conclude that the concentration was low at daytime when deposition flux is high, and deposition effect on industrial complex and Dongrae region is considerable in particular.

• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.793-797
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• 2005

This study introduces Electro-chemical Mechanical Deposition(ECMD) lot making Cu interconnect. ECMD is a novel technique that has ability to deposit planar conductive films on non-planar substrate surfaces. Technique involves electrochemical deposition(ECD) and mechanical sweeping of the substrate surface Preferential deposition into the cavities on the substrate surface nay be achieved through two difference mechanisms. The first mechanism is more chemical and essential. It involves enhancing deposition into the cavities where mechanical sweeping does not reach. The second mechanism involves reducing deposition onto surface that is swept. In this study, we demonstrate ECMD process and characteristic. We proceeded this experiment by changing of distribution of current density on divided water area zones and use different pad types.

• 산업기술연구
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• 제16권
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• pp.157-168
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• 1996

The deposition characteristics of ultrafine $SiO_2$ particles were investigated in a tube furnace reactor theoretically and experimentally controlling tube wall temperature in deposition zone. The model equations such as mass and energy balance equations and aerosol dynamic equations inside reactor and deposition tube were solved to predict the particle growth and deposition. The particle size and deposition efficiencies of $SiO_2$ particles were calculated, changing the process conditions such as tube furnace setting temperature, total gas flow rate inlet $SiCl_4$ concentration and were compared with the experimental results.