• Title/Summary/Keyword: Deposition parameter effects

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Charging Characteristics of Electrostatic Sprayer Applied Square Pulse (구형파 펄스를 인가한 정전분무 장치의 대전량 특성)

  • 박승록;문재덕
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.12
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    • pp.573-578
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    • 2003
  • In this study, new type of induction charging system for electrostatic spraying was manufactured and proposed to improve the electrical safety and charging efficiency. And parameters of proposed system to generate the maximum deposition current with electrical safety were selected and investigated. The selected parameters were frequency of square pulse and thickness of insulation material, outer diameter of device and thickness and positions of electrode. Charging quantity of water drop was measured by deposition current detected from sensing plate indirectly. The maximum deposition current for each parameter were 3.5[uA] at the frequency of 15[kHz] and thickness of 0.25[mm] insulating layer. And maximum deposition currents were 2.8[uA] and 3.0[uA] at 25[mm] outer diameter of charging device and 0.25[mm] thickness of electrode each. Effects of electrode position from spraying nozzle on deposition current was a little.

Effects of Deposition Parameters on Sputter Deposition of Lead Titanate Thin Films (스퍼터링 증착에 의한 $PbTiO_3$ 박막제조시 증착변수의 영향)

  • 김상섭;강영민;백성기
    • Journal of the Korean Ceramic Society
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    • v.30 no.7
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    • pp.578-588
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    • 1993
  • Highly c-axis oriented ferroelectric PbTiO3 thin films were deposited on MgO single crystal substrates by RF magnetron sputtering. We have studied the effects of substrate temperature, RF input power, gas comosition, gas pressure and deposition rate on the chemical and structural characteristics of PbTiO3 thin films. The epitaxy relationship of c-axis oriented films was found to be PbTiO3{100}//MgO(100) and their microstructures were highly mosaic. It was found that the most important parameter to achieve epitaxial PbTiO3 films was the substrate temperature. The activation energy for the epitaxy formation was about 0.92eV. Lower gas pressure and RF input power were favorable for the formation of epitaxial c-axis orientation. It was also found that the optimum oxygen content in Ar gas was 10% to obtain the stoichiometric PbTiO3 composition.

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A study of thermophoretic particle deposition in a particle laden stagnation flow including the effect of radiative heat transfer (정체점 입자유동에서 복사열전달을 고려한 열영동 입자부착 연구)

  • Jeong, Chang-Hun;Lee, Gong-Hun;Choe, Man-Su;Lee, Jun-Sik
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.20 no.5
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    • pp.1624-1638
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    • 1996
  • A study of thermophoretic particle deposition has been carried out for a particle laden stagnation flow considering the effect of radiative heat transfer. Energy, concentration and radiative transfer equations are all coupled and have been solved iteratively assuming that absorption and scattering coefficients were proportional to the local concentration of particles. Radiative heat transfer was shown to strongly affect the profiles of temperature and particle concentration. e. g., radiation increases the thickness of thermal boundary layer and wall temperature gradients significantly. As the wall temperature gradients increase, the particle concentration at the wall decreases due to thermophoretic particle transport. The deposition rate that is thermophoretic velocity times particle concentration at the wall decreases as the effects of radiation increases. The effects of optical thickness, conduction to radiation parameter and wall emissivity have been determined. The effects of anisotropic scattering are shown as insignificant.

Neural Network Modeling of Charge Concentration of Thin Films Deposited by Plasma-enhanced Chemical Vapor Deposition (플라즈마 화학기상법을 이용하여 증착된 박막 전하 농도의 신경망 모델링)

  • Kim, Woo-Serk;Kim, Byung-Whan
    • Proceedings of the KIEE Conference
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    • 2006.04a
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    • pp.108-110
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    • 2006
  • A prediction model of charge concentration of silicon nitride (SiN) thin films was constructed by using neural network and genetic algorithm. SIN films were deposited by plasma enhanced chemical vapor deposition and the deposition process was characterized by means of $2^{6-1}$ fractional factorial experiment. Effect of five training factors on the model prediction performance was optimized by using genetic algorithm. This was examined as a function of the learring rate. The root mean squared error of optimized model was 0.975, which is much smaller than statistical regression model by about 45%. The constructed model can facilitate a Qualitative analysis of parameter effects on the charge concentration.

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Numerical Study on the Thermophoretic Deposition Characteristics of Soot Particles for Wall Temperature of Burner and Surrounding Air Temperature in Combustion Duct (버너의 벽면온도와 연소실내 주위공기온도에 따른 매연입자의 열영동 부착 특성에 관한 수치적 연구)

  • Choi, Jae-Hyuk;Han, Won-Hui;Yoon, Doo-Ho;Yoon, Seok-Hun;Chung, Suk-Ho
    • Journal of Advanced Marine Engineering and Technology
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    • v.32 no.1
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    • pp.57-65
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    • 2008
  • The characteristics of soot deposition on the cold wall in laminar diffusion flames have been numerically analyzed with a two-dimension with the FDS (Fire Dynamics Simulator). In particular, the effects of surrounding air temperature and wall temperature have been discussed. The fuel for the flame is an ethylene ($C_2H_4$). The surrounding oxygen concentration is 35%. Surrounding air temperatures are 300K, 600K, 900K and 1200K. Wall temperatures are 300K, 600K and 1200K. The soot deposition length defined as the relative approach distance to the wall per a given axial distance is newly introduced as a parameter to evaluate the soot deposition tendency on the wall. The result shows that soot deposition length is increased with increasing the surrounding air temperatures and with decreasing the wall temperature. And the numerical results led to the conclusion that it is essential to consider the thermophoretic effect for understanding the soot deposition on the cold wall properly.

Effects of Chemical Vapor Deposition Parameters on The Hardness and the Structural Characteristics of TiN Film (TiN피막의 경도 및 구조적 특성에 미치는 화학증착 조건의 영향)

  • Shin, Jong-Hoon;Lee, Seong-Rae;Baek, Young-Hyun
    • Journal of the Korean institute of surface engineering
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    • v.20 no.3
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    • pp.106-117
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    • 1987
  • The microhardness and the structural characteristics of the chemically vapor deposited TiN film on the 430 stainless steel substrate have been investigated with various deposition parameters such as the deposition time, the total flow rate, the flow rate ratio $(H_2/N_2)$, and the deposition temperature. The most important factor to affect the microhardness of the TiN film in this study was the denseness of the structure in connection with the degree of the lattice strain. The relationship between the lattice parameter changes and the grain size variation under all deposition conditions generally followed the grain boundary relaxation model. The (111) preferred orientation prevailed in the early stage of the deposition conditions, however, the (200) preferred orientation was developed in the later stage. The surface morphology at optimum conditions displayed a dense diamond shaped structure and the microhardness of the films was high (1700-2400Hv) regardless of the type of the substrates used.

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Photovoltaic Properties of Solar Cells with Deposition Temperature of Cu(InGa)Se$_2$ Films (Cu(InGa)Se$_2$ 박막의 성장온도에 따른 태양전지의 광전특성 분석)

  • 김석기;이정철;강기환;윤경훈;박이준;송진수;한상옥
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.330-333
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    • 2002
  • The substrate temperature is an important parameter in thin film deposition process. In this paper the effects of the substrate temperature on the properties of CuIn0.75Ga0.25Se2(CIGS) thin films are reported. Structure, surface morphology and optical properties of CIGS thin films deposited at various substrate temperatures have been investigated using a number of analysis techniques. X-ray diffraction (XRD) analysis shows that CIGS films exhibit a strong <112> preferred orientation. As expected, at higher substrate temperatures the films displayed a higher degree of crystallinity. The <112> peak was also enhanced and other CIGS peaks appeared simultaneously These results were supported by experimental work using Raman spectroscopy. The Raman spectra of the as-grown CIGS thin films show only the Al mode peak. The intensity of this peak was enhanced at higher deposition temperatures. Scanning electron microscopy (SEM) results revealed very small grains in films fabricated at 48$0^{\circ}C$ substrate temperature. When the substrate temperature was increased the average grain size also increased together with a reduction in the number and size of the voids. The deposition temperature also had a significant influence on the transmission spectra.

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Effects on the Al2O3 Thin Film by the Ar Pulse Time in the Atomic Layer Deposition (원자층 증착에 있어서 아르곤 펄스 시간이 Al2O3 박막에 미치는 효과)

  • Kim, Ki Rak;Cho, Eou Sik;Kwon, Sang Jik
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.4
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    • pp.157-160
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    • 2021
  • As an insulator for a thin film transistor(TFT) and an encapsulation material of organic light emitting diode(OLED), aluminum oxide (Al2O3) has been widely studied using several technologies. Especially, in spite of low deposition rate, atomic layer deposition (ALD) has been used as a process method of Al2O3 because of its low process temperature and self-limiting reaction. In the Al2O3 deposition by ALD method, Ar Purge had some crucial effects on the film properties. After reaction gas is injected as a formation of pulse, an inert argon(Ar) purge gas is injected for gas desorption. Therefore, the process parameter of Ar purge gas has an influence on the ALD deposited film quality. In this study, Al2O3 was deposited on glass substrate at a different Ar purge time and its structural characteristics were investigated and analyzed. From the results, the growth rate of Al2O3 was decreased as the Ar purge time increases. The surface roughness was also reduced with increasing Ar purge time. In order to obtain the high quality Al2O3 film, it was known that Ar purge times longer than 15 sec was necessary resulting in the self-limiting reaction.

Temperature and the Interfacial Buffer Layer Effects on the Nanostructure in the Copper (II) Phthalocyanine: Fullerene Bulk Heterojunction

  • Kim, Hyo Jung;Kim, Jang-Joo;Jeon, Taeyeol;Kong, Ki Won;Lee, Hyun Hwi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.275.1-275.1
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    • 2014
  • The effects of the interfacial buffer layer and temperature on the organic bulk heterojunction (BHJ) nanostructures of copper phthalocyanine (CuPc) and fullerene (C60) systems were investigated using real time in-situ x-ray scattering. In the CuPc:C60 BHJ structures, standing-on configured ${\gamma}$-CuPc phase was formed by co-deposition of CuPc and C60. Once formed ${\gamma}$-phase was thermally stable during the annealing upon $180^{\circ}C$. Meanwhile, the insertion of CuI buffer layer prior to deposition of the CuPc:C60 BHJ layer induced lying-down configured CuPc crystals in the BHJ layer. The lying CuPc peak intensity and the lattice parameter were increased by the thermal annealing. This increment of the intensity seemed to be related to the strain at the interface between CuPc:C60 and CuI, which was proportional to the enhancement of the power conversion efficiency of the device.

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Optimization of tetrahedral amorphous carbon (ta-C) film deposited with filtered cathodic vacuum arc through Taguchi robust design (다구찌 강건 설계를 통한 자장 여과 아크 소스로 증착된 사면체 비정질 탄소막의 최적화)

  • Kwak, Seung-Yun;Jang, Young-Jun;Ryu, Hojun;Kim, Jisoo;Kim, Jongkuk
    • Journal of the Korean institute of surface engineering
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    • v.54 no.2
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    • pp.53-61
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    • 2021
  • The properties of tetrahedral amorphous Carbon (ta-C) film can be determined by multiple parameters and comprehensive effects of those parameters during a deposition process with filtered cathodic vacuum arc (FCVA). In this study, Taguchi method was adopted to design the optimized FCVA deposition process of ta-C for improving deposition efficiency and mechanical properties of the deposited ta-C thin film. The influence and contribution of variables, such as arc current, substrate bias voltage, frequency, and duty cycle, on the properties of ta-C were investigated in terms of deposition efficiency and mechanical properties. It was revealed that the deposition rate was linearly increased following the increasing arc current (around 10 nm/min @ 60 A and 17 nm/min @ 100A). The hardness and ID/IG showed a correlation with substrate bias voltage (over 30 GPa @ 50 V and under 30 GPa @ 250 V). The scratch tests were conducted to specify the effect of each parameter on the resistance to plastic deformation of films. The analysis on variances showed that the arc current and substrate bias voltage were the most effective controlling parameters influencing properties of ta-C films. The optimized parameters were extracted for the target applications in various industrial fields.