• Title/Summary/Keyword: Deposit thickness

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Organic-Inorganic Hybrid Thin Film Fabrication as Encapsulation using TMA and Adipoyl Chloride

  • Kim, Se-Jun;Han, Gyu-Seok;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.395-395
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    • 2012
  • We fabricate organic-inorganic hybrid thin film for the purpose of encapsulation by molecular layer deposition (MLD) using Trimethylaluminium (TMA) and Adipoyl Chloride (AC). Ellipsometry was employed to verify self limiting reaction of ALD. Linear relationship between number of cycle and thickness was obtained. We found that desirable organic thin film fabrication is possible by MLD surface reaction in nanoscale. Purging was carried out after dosing of each precursor to form monolayer in each sequence. We also confirmed roughness of the organic thin film by atomic force microscopy. We deposit TMA and AC at $70^{\circ}C$ and that 1.78A root mean square was obtained which indicates that uniform organic thin film was formed. We confirmed precursor's functional group by IR spectrum. We calculated WVTR of organic-inorganic hybrid super-lattice epitaxial layer using Ca test. WVTR indicates superlattice film can be possibly use as encapsulation in flexible devices.

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Epitaxial growth of Tin Oxide thin films deposited by powder sputtering method

  • Baek, Eun-Ha;Kim, So-Jin;Gang, Hyeon-Cheol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.185.2-185.2
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    • 2015
  • Tin Oxide (SnO2) has been widely investigated as a transparent conducting oxide (TCO) and can be used in optoelectronic devices such as solar cell and flat-panel displays. In addition, it would be applicable to fabricating the wide bandgap semiconductor because of its bandgap of 3.6 eV. There have been concentrated on the improvement of optical properties, such as conductivity and transparency, by doping Indium Oxide and Gallium Oxide. Recently, with development of fabrication techniques, high-qulaity SnO2 epitaxial thin films have been studied and received much attention to produce the electronic devices such as sensor and light-emitting diode. In this study, powder sputtering method was employed to deposit epitaxial thin films on sapphire (0001) substrates. A commercial SnO2 powder was sputtered. The samples were prepared with varying the growth parameters such as gas environment and film thickness. Then, the samples were characterized by using XRD, SEM, AFM, and Raman spectroscopy measurements. The details of physical properties of epitaxial SnO2 thin films will be presented.

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Preparation of Al Cathode for OLED by Sputtering Method (스퍼터링법을 이용한 OLED용 Al 음전극 제작)

  • Keum, Min-Jong;Kim, Kyung-Hwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.8
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    • pp.729-733
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    • 2005
  • Al electrode for OLED was deposited by FTS (Facing Targets Sputtering) system which can deposit thin films with low substrate damage. The Al thin films were deposited on the cell (LiF/EML/HTL/Bottom electrode) as a function of working gas such as Ar or Ar+kr mixed gas. Also Al thin films were prepared with working gas pressure (1, 6 mTorr). The film thickness and I-V curve of Al/cell were measured and evaluated. In the results, when Al thin films were deposited using pure Ar gas, the turn-on voltage of Al/cell was about 11 V. And using the Ar:Kr($75\%:25\%$) mixed gas, the turn-on voltage of Al/cell decreased to about 7 V.

An Analysis of Tribological Properties of Metal Interlayered DLC Films Prepared by PECVD Method (PECVD로 증착된 금속층을 포함하는 DLC 박막의 기계적 특성 분석)

  • Jeon, Young-Sook;Choi, Won-Seok;Hong, Byung-You
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.7
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    • pp.631-635
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    • 2006
  • The properties of metal interlayered DLC films between the Si substrate and the DLC films were studied. DC magnetron sputtering method has been used to deposit intermediate layers of metals. And RF-PECVD method has been employed to synthesize DLC onto substrates of the silicon and metal layers. After we used metal Inter-layers, such as chromium, nickel, titanium and we studied tribological properties of the DLC films. The thickness of films were observed by field emission scanning electron microscope (FE-SEM). Also the surface morphology of the films were observed by an atomic force microscope (AFM). The crystallographic properties of the films were analyzed with X-ray diffraction (XRD), the friction coefficients were investigated by AFM in friction force microscope (FFM) mode. Tribological performances of the films were estimated by nano-indenter, stress tester measurement.

Interface Characterization of Supeconducting Thin Film on Sapphire Grown by an Excimer Laser (액시머 레이저로 증착된 초전도박막과 사파이어 기판간 계면 특성 분석)

  • 이상렬;박형호;강광용
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1995.11a
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    • pp.148-151
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    • 1995
  • Excimer laser has been used to fabricate superconducting YBa$_2$Cu$_3$O$\sub$7-x/(YBCO) thin films on various substrates. An XeCl excimer laser with an wavelength of 308 nm was used to deposit both buffer layer and superconducting thin film on sapphire substrate. The characterizations of the interface between thin film and substrate were performed. The interfacial properties of thin films on buffered sapphire and on bare sapphire were compared. With a 20 nm PrBa$_2$Cu$_3$O$\sub$7-x/(PBCO) buffer layer, no diffusion layer was observed between film and substrate while the diffusion layer with about 30 nm thickness was observed between film and sapphire without buffer layer.

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The Crystallographic Properties of TiC Deposited on Different Substrate Steel by Chemical VaporDeposition (화학증착법에 의한 여러 가지 강들위에 증착된 TiC의 결정학적 특성)

  • 윤순길;김호기
    • Journal of the Korean Ceramic Society
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    • v.24 no.6
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    • pp.519-526
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    • 1987
  • TiC was deposited onto several substrate steels by the Chemical Vapor Deposition technique from TiCl4-CH4-H2 gas mixtures in the horizontal resistance furnace. Deposition rates and morphologies of the coatings were investigated with the carbon contents. Deposition thickness increased linearly with the deposition time in the Presence of CH4 gas. The various interlayers of coating by EDS and X-ray Diffraction were proved as Cr7C3 and Fe3C. Chromium contents did not affect the preferred orientation of TiC deposit. The deposition was controlled by a mass transport and a surface reaction in case of 1 wt% C-5.25 wt% Cr steel irrespective of deposition temperature.

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Electrical Characteristics of n-GaN Schottky Diode fabricated by using Electrochemical Metallization (Electrochemical Metallization방법을 이용한 GaN Schottky Diode의 제작과 전기적 특성 향상 및 분석)

  • ;Daejun Fu
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.205-208
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    • 2001
  • Schottky barrier diodes are fabricated on a intrinsic GaN(4${\mu}{\textrm}{m}$) epitaxial structure grown by rf plasma molecular beam epitaxy (MBE) on sapphire substrates. First, We make Ohmic electrodes (Ti/Al/Ti/Au) by evaporator. Next, we contact RuO$_2$ by dipping in the solution (RuCl$_3$.HClO$_4$), and then we deposit Ni/Au on the surface of RuO$_2$ by evaporator. We study the electrical characteristics of GaN Schottky barrier diodes made by these methods. Measurements are C-V, I-V, SEM, EDX, and XRD for the characteristics of devices. Thickness of RuO$_2$ layer depends on supplied voltage and dipping time. Device of thinner RuO$_2$ layer have a good Schottky characteristics compare with device of thicker RuO$_2$ layer

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Micro patterning of conductor line by laser induced forward transfer(LIFT) (LIFT 방법에 의한 전도성 미세 패터닝 공정 연구)

  • 이제훈;한유희
    • Laser Solutions
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    • v.2 no.3
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    • pp.52-61
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    • 1999
  • The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

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Solution-processed Organic Trilayer Solar Cells Incorporating Conjugated Polyelectrolytes

  • Cha, Myoung Joo;Walker, Bright;Seo, Jung Hwa
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.192.1-192.1
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    • 2014
  • We report solution-processed organic trilayer solar cells consisting of poly (3-hexylthiophene) (P3HT), a conjugated polyelectrolyte (CPE) and [6,6]-phenyl-C61-butyric acid methyl ester (PCBM), wherein the effect CPE layer thickness on device properties was investigated. The current-voltage characteristics under illumination and dark as well as photoluminescence were characterized using various concentrations (0.02, 0.1, and 0.3wt%) of to deposit the CPE interlayer between the donor and acceptor layers. We also investigated the influence of molecular dipole moments in the trilayer solar cells by external stimuli. These results provide an experimental approach for investigating the influence of interfacial dipoles on solar cell parameters when placed between the donor and acceptor and allow us to obtaining fundamental information about the donor/acceptor interface in organic solar cells.

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Ni-Co Alloy Electroforming for Micro Mold Fabrication (마이크로 금형 제작을 위한 니켈-코발트 합금 전주기술개발)

  • Shin S. H.;Jeong M. K.;Kim Y. S.;Han S. H.;Hur Y. M.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.10a
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    • pp.276-279
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    • 2004
  • The factors affecting Ni-Co alloy electroforming were investigated to determine the optimum bath composition and electroplating parameters, like pH, temperature, and current density, suitable for high speed fabrication of a micro mold with longer lifetime. To obtain alloy deposits having uniform thickness and composition, electroplating parameters were finely tuned with home-made electroforming apparatus. Ni-Co alloy deposits had linearly increased Co with $Co^{2+}$ ion concentration in electroplating bath, and showing $412H_v$ of Victors hardness at $23wt\%$ of Co content. For Ni-Co alloy, sulfonate and diol related organic additives were very effective to alleviate its residual stress and surface roughness. The maximum deposition rate was $106{\mu}m/hr$ at 10ASD and the tensile strength of alloy deposit was 2 times larger than that of Ni only case.

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