• Composites Research
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• v.16 no.4
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• pp.51-58
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• 2003

Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.

• Composites Research
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• v.28 no.3
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• pp.99-103
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• 2015

This paper presents the cure kinetics studies on the cure reaction of thermosetting resin. Above all, change in degree of cure and specific heat capacity according to temperature are observed using DSC and MDSC. The results are analyzed by cure kinetics and specific heat capacity model. Glass transition temperature was also measured to apply to the specific heat capacity model. Model parameters were gained from the modeling result. As a result, behavior of specific heat capacity can be calculated mathematically.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.38 no.1 s.113
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• pp.1-8
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• 2006

To overcome troubles in strength and process of linerboard caused by raw materials, a neutral sizing which is usual in fine paper making can be considered. A new sizing agent is necessary to show good performance in a system with high conductivity and COD. In this study, fast cure type AKD was examined as a new sizing agent and compared with conventional AKD. The effects of fixing agent addition and drying condition were also investigated. Fast cure type AKD which has a higher cationicity showed better sizing degree than conventional AKD in spite of low addition level and no curing treatment. And when fixing agent of sufficient amount was added, sizing degree was improved for both AKDs. High cationicity is a crucial factor for neutral sizing of linerboard for obtaining fast and stable sizing degree. Drying with temperature over $100^{\circ}$ was desirable for developing sizing degree.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.893-894
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• 2011

• Design & Manufacturing
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• v.17 no.1
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• pp.1-5
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• 2023

In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• 연구논문집
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• s.29
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• pp.151-162
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• 1999

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics. Therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict a temperature profile inside composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning was proposed. The method was applied to epoxy resin system and was verified by comparing measurements and predictions.

• Bulletin of the Korean Chemical Society
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• v.21 no.6
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• pp.628-634
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• 2000

Crosslink is the most important chemistry in a rubber vulcanizate. Degree and type of crosslinks of the vulcanizate determine its physical properties. Change of crosslink density and deformation of a rubber vulcanizate by thermal aging were studied using natural rubber (NR) vulcanizates with various cure systems (conventional, semi-EV, and EV) and different cure times (under-, optimum-, and overture). All the NR vulcanizates were deformed by the thermal aging at 60-100 $^{\circ}C.$ The higher the aging temperature is, the more degree of the deformation is. The undercured NR vulcanizates after the thermal aging were deformed more than the optimumand overcured ones. The NR vulcanizates with the EV cure system were less deformed than those with the conventional and semi-EV cure systems. The deformation of the NR vulcanizates was found to be due to change of the crosslink density of the vulcanizates. The crosslink densities of all the vulcanizates after the extraction of organic materials were also changed by the thermal ging. The sources to change the crosslink densities of the vulcanizates by the thermal aging were found to be dissociation of the existing sulfur crosslink and the formation of new crosslinks by free sulfur, reaction products of curing agents, and pendent sulfide groups.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.2
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• pp.527-536
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• 1995

Analysis of pultrusion process for the thermosetting composites containing volatiles was performed. Degree of cure, amount of volatile evolved and pulling force were calculated for the processing variables such as die temperature and pulling speed. Cure kinetics was modeled from the data obtained by DSC(Differential Scanning Calorimeter). The volatile evolution kinetics was modeled from the data by DSC as well as TGA(Thermo Gravimetric Analyzer). The cure kinetics and volatile evolution kinetics models were incorporated into the energy equation. The resulting governing equation was solved using finite element method. Pulling force was calculated through the analysis of pressure developed inside the pultrusion die. Experiments were performed and the data were compared with the calculated results. Good agreements were observed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1220-1223
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• 2003

The UV nanoimprint technology uses the UV light as the energy source. Because the imprint process is carried out in room temperature and low pressure, this technology has its own merits compared to the thermal nanoimprint. However, in UV nanoimprint technology, a resin which has low viscosity is essential for the improvement of accuracy. In this research, a resin (named as IMS01) which has relatively low viscosity was developed. And a measurement system was developed in order to measure the degree of cure of the resin. The measurement system which is composed of FT-IR, UV light source and optical guide can measure the degree of cure in real time. From the experimental results, it was found that the IMS01 is cured more rapidly than existing resin (PAK01).