Composites Research

The Korean Society for Composite Materials (한국복합재료학회)
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On-line Cure Monitoring of Adhesive Joints by Dielectrometry

유전기법을 이용한 접착 조인트의 실시간 경화 모니터링

  • 권재욱 (LG디지털 디스플레이 연구소) ;
  • 진우석 (한국과학기술원 기계공학과) ;
  • 이대길 (한국과학기술원 기계공학과)
  • Published : 2003.08.01
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Abstract

Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.

접착 조인트의 안전성은 사용되는 열경화성 접착제의 경화상태에 많은 영향을 받기 때문에, 실시간으로 접착 조인트의 경화를 모니터링 할 수 있다면 조인트의 품질을 향상시킬 수 있다. 본 연구에서는 조인트의 경화 중 접학제의 소산계수를 측정하여 이를 접착제의 경화도로 환산할 수 있는 기법을 제안하였다. 접착제의 소산계수와 경화도의 관계를 실험적으로 연구하였으며, 온도와 경화도에 따라 민감하게 변하는 소산계수로부터 온도가 미치는 영향을 제거하였다. 연구결과 접착제의 소산계수는 그 경화율과 유사한 경향을 보임을 알 수 있었다.

Keywords

References

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