• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2001.05a
• /
• pp.219-223
• /
• 2001

The on-line cure monitoring during the cure process of composite materials is important for better quality and productivity. The dielectric sensor for cure monitoring consists of base film and electrodes. Because the characteristic of dielectric sensor for the on-line cure monitoring is dependent on the base material, width and number of electrode, etc, the dielectric sensor should be standardized. And the selection of base film material of sensor is very important. In order to prevent the measuring errors generated from the increase of environmental temperature, the base film material should have stable dielectric constant with respect to environmental temperature. In this study, the newly developed dielectric sensor for cure monitoring was designed and the dissipation factor which is function of degree of cure was measured using the sensor. The relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

• Proceedings of the KSME Conference
• /
• 2001.11a
• /
• pp.797-803
• /
• 2001

The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material was performed for the better quality and productivity during manufacturing. Since the dissipation factor measured by dielectrometry method is dependent on the degree of cure and temperature of resin, in this study, a new method to obtain the degree of cure during on-line cure monitoring for glass/polyester composites was developed by employing a combination function of the temperature and the dissipation factor. Two sensor signals from a K-type thermocouple and an interdigitated dielectric sensor were processed during curing process under various cure cycles. The DSC (Differential Scanning Calorimetry) data was also used for the reference of degree of cure.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.19 no.7
• /
• pp.1563-1572
• /
• 1995

The on-line cure monitoring during the cure process of fiber reinforced resin matrix composite material is important for the better quality and productivity. Among several cure monitoring methods, the dielectrometry that uses electrodes as its sensor is known to be the most promising method. In this study, the sensitivity of the dielectric sensor for the on-line cure monitoring was analyzed by finite element method and compared to the experimental results. Using the analytical results, the equation for the capacitance of the sensor was derived. Also, the optimal sensor design method was suggested after analyzing several different sensor shapes.

• Composites Research
• /
• v.16 no.4
• /
• pp.51-58
• /
• 2003

Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2000.11a
• /
• pp.22-28
• /
• 2000

The fiber reinforced composite materials is widely used in aircraft, space structures and robot arms because of high specific strength and high specific modulus. The on-line cure monitoring during the cure process of the composite materials has become an important research area for the better quality and productivity. In this paper, the dielectric circuit of the wheatstone bridge type for measuring the dissipation factor was designed and manufactured. Also, the dielectric sensor for the cure monitoring of the high temperature composites was developed. The residual thermal stresses of the dielectric sensor were analyzed by the finite element method and its dielectric characteristics under high temperature were evaluated. The on-line cure monitoring of the BMI resin was performed using the wheatstone bridge type circuit and developed high-temperature dielectric sensor.

• Composites Research
• /
• v.14 no.1
• /
• pp.30-38
• /
• 2001

As fiber reinforced composite materials are widely used in aircraft, space structures and robot arms, the on-line cure monitoring during the cure process of the composite materials has become an important research area for the better quality and productivity. In this paper, the dielectric circuit of the Wheatstone bridge type for measuring the dissipation factor during cure of thermsetting resin matrix composite materials was designed and manufactured. Also, the dielectric sensor for the cure monitoring of high temperature cure composites was developed and tested. The residual thermal stresses of the dielectric sensor during high temperature cure were analyzed by the finite element method and its dielectric characteristics at high temperature cure were analyzed by the finite element method and its dielectric characteristics at high temperature were evaluated. The on-line cure monitoring of the BMI(Bismaleimide) resin was performed using the developed Wheatstone bridge type circuit and the high-temperature dielectric sensor.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.19 no.9
• /
• pp.2154-2164
• /
• 1995

In this study, a dielectric cure monitoring system which consists of an electric circuit, a sensor and a personal computer was developed to on-line monitor the dielectric properties of carbon fiber epoxy composite materials. Also, the kinetic model of carbon fiber epoxy composite materials was developed by curve fitting of differential scanning calorimetry data. The start and end points of cure and the relationship between the dissipation factor and the degree of cure were obtained by comparing the dissipation factor from the dielectric properties with the degree of cure from the DSC data. The relationship between the dissipation factor and the degree of cure was tested under various temperature profiles.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2001.10a
• /
• pp.43-48
• /
• 2001

To overcome the disadvantages of conventional excavation technology, various trenchless (or excavation free, or no-dig) repair-reinforcement technologies have been developed and tried. But trenchless technologies so fat developed have some brawbacks such as high cost and inconvenience of operation. In this study, a repairing-reinforcing process for underground pipes with glass fiber fabric polymer composites using VARTM(Vacuum Assisted Resin Transfer Molding) has been developed. The developed process requires shorter operation time and lower cost with smaller and simpler operating equipments than those of the conventional trenchless technologies. For the reliable operation of the developed method, a simple method to apply pressure and vacuum to the reinforcement was devised and flexible mold technology was tried. Also, resin filling and cure status during RTM process were monitored with a commercial dielectrometry cure monitoring system, LACOMCURE. From the investigation, it has been found that the developed repairing-reinforcing technology with appropriate process variables and on-line cure monitoring has many advantages over conventional methods.

• Composites Research
• /
• v.15 no.1
• /
• pp.21-31
• /
• 2002

To overcome the disadvantages of conventional excavation technology various trenchless (or excavation free, or no-dig) repair-reinforcement technologies have been developed and tried. But trenchless technologies so far developed have some drawbacks such as high cost and inconvenience of operation. In this study, a repairing-reinforcing process for underground pipes with glass fiber fabric polymer composites using VARTM (Vacuum Assisted Resin Transfer Molding) has been developed. The developed process requires shorter operation time and lower cost with smaller and simpler operating equipments than those of the conventional trenchless technologies. For the reliable operation of the developed method, a simple method to apply pressure and vacuum to the reinforcement was devised and flexible mold technology was tried. Also, resin filling and cure status during RTM process were monitored with a commercial dielectrometry cure monitoring system, LACOMCURE. From the investigation, it has been found that the developed repairing-reinforcing technology with appropriate process variables and on-line cure monitoring has many advantages over conventional methods.