• 제목/요약/키워드: DPSS laser

검색결과 52건 처리시간 0.036초

Ag의 두께에 따른 비정질 As-Ge-Se-S의 홀로그래픽 특성연구 (Holographic Properties in Amorphous As-Ge-Se-S with Ag Thickness)

  • 김충혁
    • 한국전기전자재료학회논문지
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    • 제25권3호
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    • pp.213-217
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    • 2012
  • In this study, we have investigated the holographic grating formation on Ag-doped amorphous As-Ge-Se-S thin films. The dependence of diffraction efficiency as afunction of Ag layer thickness has been investigated in this amorphous chalcogenide films. Holographic gratings was formed using [P:P] polarized Diode Pumped Solid State laser (DPSS, 532.0 nm). The diffraction efficiency was obtained by +1st order intensity. The results were shown that the diffraction efficiency of Ag/AsGeSeS double layer thin films for the Ag thickness, the maximum grating diffraction efficiency using 60 nm Ag layer is 0.96%.

Amorphous chalcogenide 박막의 $Ag^+$ 의존적 회절효율 특성에 관한 연 구 (A Study of Diffraction Efficiency Depended on $Ag^+$ of Amorphous Chalcogenide Thin Films)

  • 정원국;남기현;정홍배
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.134-134
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    • 2010
  • We have investigated the holographic grating formation on Ag-doped amorphous chalcogenide AsGeSeS thin films with Ag thickness. Holographic gratings have been formed using Diode Pumped Solid State laser (DPSS, 532.0nm) under [P:P] polarized the intensity polarization holography. The diffraction efficiency was obtained by +1st order intensity.

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DPSS laser를 이용한 비정질 칼코게나이드 박막의 회절격자 형성

  • 남기현;정원국;정홍배
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.246-246
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    • 2010
  • In this paper, we investigated the diffraction grating efficiency on AsSeS and Ag-doped amorphous chalcogenide Ag/AsSeS thin film for used to volume hologram. The Chalcogenide film thickness was 0.5um and Ag thin film was varied from 10nm and 20nm. Diffraction efficiency was obtained from (P:P) polarized Diode Pumped Solid State laser(DPSS, 532.0nm: 200mW) beam on AsSeS and Ag/AsSeS thin films. As a results, diffraction grating was not formed at AsSeS thin film but at Ag-doped AsSeS thin film, diffraction grating was formed well compare with the former.

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Dielectric 마스크 적용 UV 레이저 프로젝션 가공을 이용한 빌드업 필름 내 선폭 10μm급 패턴 가공 연구 (DPSS UV laser projection ablation of 10μm-wide patterns in a buildup film using a dielectric mask)

  • 손현기;박종식;정수정;신동식;최지연
    • 한국레이저가공학회지
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    • 제16권3호
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    • pp.27-31
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    • 2013
  • To engrave high-density circuit-line patterns in IC substrates, we applied a projection ablation technique in which a dielectric ($ZrO_2/SiO_2$) mask, a DPSS UV laser instead of an excimer laser, a refractive beam shaping optics and a galvo scanner are used. The line/space dimension of line patterns of the dielectric mask is $10{\mu}m/10{\mu}m$. Using a ${\pi}$ -shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam; and a telecentric f-${\theta}$ lens focuses it to a $115{\mu}m{\times}105{\mu}m$ flat-top beam on the mask. The galvo scanner before the f-${\theta}$ lens moves the beam across the scan area of $40mm{\times}40mm$. An 1:1 projection lens was used. Experiments showed that the widths of the engraved patterns in a buildup film ranges from $8.1{\mu}m$ to $10.2{\mu}m$ and the depths from $8.8{\mu}m$ to $11.7{\mu}m$. Results indicates that it is required to increase the projection ratio to enhance profiles of the engraved patterns.

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비정질 As2Se3 박막의 Ag 의존적 홀로그래픽 격자 형성 특성 분석

  • 남기현;김장한;정홍배
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.275-276
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    • 2011
  • We have investigated the holographic grating formation on Ag-doped amorphous chalcogenide As2Se3 thin films with Ag layer. The basic optical parameter which is a refractive index and extinction coefficent was taken by n&k analyzer. The source of laser was selected based on these parameter. Holographic gratings have been formed using He-Ne laser (wavelength: 632.8 nm) Diode Pumped Solid State laser (DPSS, wavelength: 532.0 nm) under [P:P] polarized the intensity polarization holography. The diffraction efficiency was obtained by +1st order intensity.

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355nm UV 레이저를 이용한 구리 박판 가공 시 어블레이션에 관한 연구 (A Study on Laser Ablation of Copper Thin Foil by 355nm UV Laser Processing)

  • 오재용;신보성
    • 한국정밀공학회지
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    • 제24권2호
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    • pp.134-139
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    • 2007
  • Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

Laser Thermal Processing System for Creation of Low Temperature Polycrystalline Silicon using High Power DPSS Laser and Excimer Laser

  • Kim, Doh-Hoon;Kim, Dae-Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.647-650
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    • 2006
  • Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

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355nm 펄스 레이저를 이용한 구리 박막의 레이저 어블레이션에 대한 연구 (A study on the laser ablation of the copper metal foil by 355nm pulse laser)

  • 오재용;신보성
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.667-668
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    • 2006
  • Usually nanosecond pulsing laser ablation of metal is under thermal effect. Many studies of the theoretical analysis and modeling to predict a result of laser ablation of metal are suggested on the basis of the photothermal mechanism. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper films. We proposed the simplified SSB Model(Srinivasan-Smrtic-Babudp model) to study the photothermal effect of nanosecond pulsing laser ablation of copper thin metal. The experimental results were obtained by using the 355nm DPSS $Nd:YVO_4$ laser.

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New Process Development for Hybrid Silicon Thin Film Transistor

  • Cho, Sung-Haeng;Choi, Yong-Mo;Jeong, Yu-Gwang;Kim, Hyung-Jun;Yang, Sung-Hoon;Song, Jun-Ho;Jeong, Chang-Oh;Kim, Shi-Yul
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.205-207
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    • 2008
  • The new process for hybrid silicon thin film transistor (TFT) using DPSS laser has been developed for realizing both low-temperature poly-Si (LTPS) TFT and a-Si:H TFT on the same substrate as a backplane of active matrix liquid crystal display. LTPS TFTs are integrated on the peripheral area of the panel for gate driver integrated circuit and a-Si:H TFTs are used as a switching device for pixel in the active area. The technology has been developed based on the current a-Si:H TFT fabrication process without introducing ion-doping and activation process and the field effect mobility of $4{\sim}5\;cm^2/V{\cdot}s$ and $0.5\;cm^2/V{\cdot}s$ for each TFT was obtained. The low power consumption, high reliability, and low photosensitivity are realized compared with amorphous silicon gate driver circuit and are demonstrated on the 14.1 inch WXGA+ ($1440{\times}900$) LCD Panel.

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광열반응을 이용한 폴리머의 미세가공기술 (Micro machining of Polymers Using Photothermal Process)

  • 장원석;신보성;김재구;황경현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.616-619
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    • 2003
  • Photochemical and photothermal effects have correlation with each other and depend on laser wavelength. Multi-scanning laser ablation process of polymer with DPSS(Diode Pumped Solid State) 3rd harmonic Nd:YVO$_4$ laser with wavelength of 355nm is applied to fabricate three-dimensional micro shape. The DPSSL photomachining system can rapidly and cheaply fabricate 2D pattern or 3D shape with high efficiency because we only use CAD/CAM software and precision stages instead of complex projection mask. Photomachinability of polymer is highly influenced by laser wavelength and its own chemical structure. So the optical characteristics of polymers for 355nm laser source is investigated by experimentally and theoretically.

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