• Culinary science and hospitality research
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• v.11 no.4 s.27
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• pp.1-13
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• 2005

This study analyzed the levels of N-nitrosamine(NA) and its precursors such as nitrite, nitrate, dimethylamine and trimethylamine in 10 samples of mollusk fish, 4 samples of crustacea fish and 11 samples of shellfish from fish distributed in a local markets. Mollusk fishes had nitrite concentrations ranging from non-detectable(ND) to 9.4 mg/kg, crustacea fishes ND to 8.8 mg/kg, and shellfishes ND to 4.3 mg/kg. Nitrates in mollusk fishes ranged from ND to 19.3 mg/kg, crustacea fishes 4.1 to 79.9 mg/kg, and shellfishes 1.5 to 61.9 mg/kg. DMK concentrations were 11.2 to 551.4 mg/100g in mollusk fishes, 44.4 to 79.9 mg/100g in crustacea fishes, and 1.3 to 5.9 mg/100g in shellfishes. TMA concentrations in mollusk fishes, crustacea fishes, and shellfishes were 10.3${\sim}$292.4 mg/100g, 35.5${\sim}$90.3 mg/100g, and 2.3${\sim}$17.1 mg/100g respectively. Only N-nitrosodimethylamine (NDMA) was detected for NA in fish distributed in local markets. NDMA contentrations ranged from ND to 41.4 ${\mu}g/kg$ in mollusk fishes, 3.0 to 47.3 ${\mu}g/kg$ in crustacea fishes, and 1.7 to 12.1 ${\mu}g/kg$ in shellfishes.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.10a
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• pp.105-110
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• 2001

Autoclave curing using the vacuum bagging method is widely used for the manufacture of advanced composite prepreg airframe structures. Due to increasing use of advanced composites, specific techniques have been developed to repair damaged composite structures. In order to repair the damaged part, it is required that the damaged areas be removed, such as skin and/or honeycomb core, by utilizing the proper method and then repairing the area by laying up prepreg (and core) then curing under vacuum using the vacuum bagging materials. It shall be cured either in an oven or autoclave per the original specification requirements. Delamination can be observed in the sound areas during and/or after a couple times exposure to the elevated curing temperature due to the repeated repair condition. This study was conducted for checking the degree of degradation of properties of the cured parts and delamination between skin prepreg and honeycomb core. Specimens with glass honeycomb sandwich construction and glass/epoxy prepreg were prepared. The specimens were cured 1 to 5 times at $260^{circ}F$ in an autoclave and each additionally exposed 50, 100 and 150 hours in the $260^{circ}F$ oven. Each specimen was tested for tensile strength, compressive strength, flatwise tensile strength and interlaminar shear strength. To monitor the characteristics of the resin itself, the cured resin was tested using DMA and DSC. As a results, the decrease of Tg value were observed in the specific specimen which is exposed over 50 hrs at $260^{circ}F$. This means the change or degradative of resin properties is also related to the decrease of flatwise tensile properties. Accordingly, minimal exposure on the curing temperature is recommended for parts in order to prevent the delation and maintain the better condition.

• Textile Coloration and Finishing
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• v.29 no.1
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• pp.37-44
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• 2017

An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

• Toxicological Research
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• v.29 no.2
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• pp.137-142
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• 2013

Arsenic (As) is a well-known human carcinogen and its dietary exposure has been found to be the major route of entry into general population. This study was performed to assess the body levels of As and their associated factors in Korean adults by analyzing total As in urine. Urine and blood samples were collected from 580 adults aged 20 years and older, who had not been exposed to As occupationally. Demographic information was collected with the help of a standard questionnaire, including age, smoking, alcohol intake, job profiles, and diet consumed in the last 24 hrs of the study. Total As, sum of As(III), As(V), monomethylarsonic acid (MMA), dimethylarsinic acid (DMA), in urine was determined using atomic absorption spectrometer involving hydride generation method. The geometric mean concentration of total As in urine was $7.10{\mu}g/L$. Urine As was significantly higher in men ($7.63{\mu}g/L$) than in women ($6.75{\mu}g/L$). Age, smoking, alcohol consumption, and job profiles of study subjects did not significantly affect the concentration of As in urine. No significant relationship was observed between body mass index (BMI), Fe, and total cholesterol in serum and urinary As. Urine As level was positively correlated with seaweeds, fishes & shellfishes, and grain intake. A negative correlation between urinary As level and HDL-cholesterol in serum and meat intake was observed. Overall, these results suggest that urinary As concentration could be affected by seafood consumption. Therefore, people who frequently consume seafood and grain need to be monitored for chronic dietary As exposure.

• Journal of Korean Society of Water and Wastewater
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• v.32 no.3
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• pp.279-289
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• 2018

N-nitrosodimethylamine (NDMA) is a class of disinfection byproducts and a frequently detected nitrosamine with carcinogenic potentials. This review summarizes NDMA precursors, their formation mechanisms in chloraminated water, and mitigation strategies. Understanding the formation mechanism and characteristics of precursors is essential for developing a mitigation strategy. Dimethylamine (DMA), the most widely studied NDMA precursor, has an NDMA molar yield up to 3%. In comparison, a subset of tertiary amines, e.g., pharmaceuticals, generate up to 90% upon chloramination. Potent NDMA precursors, are characterized by their negative partial charge, low planarity values and molecular weight, and high bond length and $pK_a$ values. A nucleophilic substitution of tertiary amine on chloramine is a key reason for the high NDMA yield from the most potent NDMA precursors. The distribution and fate of NDMA in surface water, aquifers, and its formation in the distribution system can be mitigated through two strategies: (1) degrading or/removing NDMA after its formation and (2) pre-treatment of its precursor's prior chloramination.

• Polymer(Korea)
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• v.27 no.3
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• pp.183-188
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• 2003

The dielectric constants of fluorine-containing epoxy resins, 2-diglycidylether of benzotrifluoride(FER)/4,4'-diamino-diphenyl methane (DDM) and diglycidylether of bisphenol-A (DGEBA)/DDM systems were evaluated by dielectric spectrometer. Glass transition temperature and thermal stability factors, including initial decomposed temperature, temperatures of maximum rate of degradation, and decomposition activation energy of the cured specimens were investigated by dynamic mechanical analysis and thermogravimetric analysis. For the mechanical properties of the casting specimens, the fracture toughness, flexural, and impact tests were performed, and their fractured surfaces were examined by scanning electron microscope. The dielectric constant of FER/DDM system was lower than that of commercial DGEBA/DDM system, and the mechanical properties of the cured specimens showed higher values than those of DGEBA/DDM system. This was probably due to the introduction of trifluoromethyl (CF$_3$) group into the side chain of the epoxy resins, resulting in improving the electric and mechanical properties of the epoxy cure system studied.

• Journal of the Korean Institute of Gas
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• v.9 no.3 s.28
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• pp.49-54
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• 2005

This work was to calibrate Anton Paar 512P vibrating tube densimeter which is a special type for density measurement under high pressure (up to 70 MPa) and temperature (up to 420 K) and checked the validity of the new apparatus. Calibration was peformed with water, nitrogen and water, vacuum as reference fluids. Temperature is measured from 313.15 K and 353.15 K at 10 K intervals, and pressure is measured up to 30 MPa at 5 MPa intervals, respectively. To check the validity of new apparatus and the calibration method we compared the values obtained by measuring density of carbon dioxide with those given by NIST Thermophysical Properties of Pure Fluids Database. The average deviations between the NIST and the experimental data were $0.3\%$ with water and nitrogen as reference fluids.

• Polymer(Korea)
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• v.34 no.2
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• pp.104-107
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• 2010

Polyurethane (PU) sheets were fabricated by the reaction of polypropylene glycol (PPG) and liquid diphenyl methane diisocyanate (L-MDI) with various trimethylol propane (TMP) contents. The $T_g$ value was varied from 34.8 $^{\circ}C$ to 49.9 $^{\circ}C$ according to the TMP content. As the content of TMP was increased from 4 to 12 wt%, the modulus of the PU sheet was increased from 322 MPa to 423 MPa, its tensile strength was increased from 10.6 MPa to 14.8 MPa, and its elongation was decreased from 62.8% to 49%. In case of acoustic properties, the sound speed of PU sheet was increased while its attenuation coefficient was decreased as the content of TMP was increased. The fabricated PU sheet was stable in water bath for 4 weeks.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Textile Coloration and Finishing
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• v.30 no.2
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• pp.98-106
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• 2018

In this study, graphene oxide(GO) was synthesized by using Hummer's method. Then, GO was used as a additive for epoxy resin nanocomposites that were prepared by mixing Tetraglycidyl diamino diphenyl methane(TGDDM) and hardner(MDEA+M-MIPA). Thermal and mechanical properties of epoxy resin nanocomposites were confirmed by analytical methods such as TG-DTA, DMA, fracture toughness, tensile strength, and flexural strength. The fracture surfaces of epoxy resin nanocomposites with different content of the GO were observed by a Scanning Electron Microscope(SEM). The mechanism for mechanical properties of epoxy resin nanocomposites was analyzed by modeling of nanocomposites with different GO weight. Due to the GO, both the heat resistance and the glass transition temperature of the epoxy resin nanocomposites were improved. Interestingly, when 0.1wt.% of GO was added to the epoxy resin/hardner mixture, the properties of mechanical increased compared with the neat epoxy resin. This results were caused by an aggregation between the GO.